ASM_Catalogue_ASM_Consumables_EN_210407.pdf - 第5页

DEK SMT high performance understencil cleaning fabrics DEK SMT high-performance understencil cleaning fabrics provide effective cleaning and compatibility with multiple print platforms. Features and benets: ■ Absorbent,…

100%1 / 14
DEK Ultra-Fine Pitch (UFP)
ECO understencil cleaning rolls
DEK UFP ECO UNDERSTENCIL CLEANING ROLLS
Part number Platform Fabric width
(mm)
Core width (mm) Inner core
diameter (mm)
Roll max outer
diameter (mm)
Roll length (m)
SAP DEK
03128525 800071 DEK Micron 515 530 19 56 11
03128531 800072 DEK Micron 400 530 19 56 11
03130297 800073 DEK Micron 300 530 19 56 11
03239913 – DEK TQ (NEW) 400 – – – ~ 22
03128585 800074 MPM 443 457 19.5 64 12
03131628 800075 MPM 443 457 19.5 100 44
03131629 800076 MPM 546 559 19.5 64 12
03131630 800077 EKRA 400 400 13 53 10
03131631 800078 EKRA 500 500 13 53 10
03131632 800080 Panasonic 365 380 19.5 64.5 15
03131633 800082 Yamaha 440 440 25.5 88 25
03131634 800083 Yamaha 530 530 25.5 88 25
03155072 800084 Yamaha 620 620 25.5 88 25
DEK UFP ECO rolls are designed to boost productivity and yield,
reduce defects and decrease manufacturing costs.
The unique 3D architecture of DEK UFP ECO understencil cleaning rolls counters the
risk of contamination as the fabric traps solder paste and solders balls within its pockets.
This is a key dierentiator from paper-based products that allow paste to remain on
the surface of the paper, creating the potential for contamination. Consequently, DEK
UFP ECO rolls not only ensure eective understencil cleaning, they also prevent
contamination-related defects.
Ideal for ultra-ne-pitch apertures inherent with today’s miniaturized devices, DEK UFP
ECO rolls ensure a quick and eective clean. The hydrophilic properties of the bers
provide fast wicking, as solvent is delivered through the fabric to the bottom of stencil
instantaneously so that cleaning is more thorough and solvent consumption is reduced.
Features and benets:
■ Outstanding cleaning performance
■ Reduced solvent consumption by an average of 50%
■ Unique 3D structure traps solder particles away from the stencil,
removing smear
■ Ultra-low linting, Class 1000, ISO6 cleanroom compatible
■ Enhanced vacuum performance
■ Hydrophilic fiber structure for rapid solvent wicking
■ ESD-safe packaging
■ Improved process control
■ Non-abrasive structure of fabric increases stencil and coating life
■ Environmentally-friendly, chloride-free, recyclable
■ Faster, more effective cleaning cycle leading to higher throughput
4
|
Process Support Products
|
ASM: Stencils from the global No. 14
|
Process Support Products
|
ASM Consumables
DEK SMT high performance
understencil cleaning fabrics
DEK SMT high-performance understencil cleaning fabrics provide
effective cleaning and compatibility with multiple print platforms.
Features and benets:
■ Absorbent, vacuum-friendly & fast-wicking
- Special non-woven fabric construction reduces lint, preventing aperture blockages
and contamination
- Fabric does not compromise vacuum power, optimizing aperture cleaning
performance
- Wicks consistently across the full width of the cleaning roll to ensure even
distribution of the cleaning agent for a more productive clean
- Wick time is extremely fast compared to other cleaning fabrics
■ Effective cleaning
- Dry cycle in addition to Wet (Vac/Dry) cycle
- Delivers a superior clean for underside of the stencil
■ Broad machine compatibility
- Suitable for DEK, MPM, Ekra and other on-board cleaning systems, in addition to
advanced understencil cleaners such as DEK Cyclone technology
- 11 meters minimum length reduces number of changeovers and total changeover
time on DEK platforms
- 44 meter length available for latest MPM platform
DEK SMT HIGH PERFORMANCE UNDERSTENCIL CLEANING FABRICS
Part number Platform Fabric width
(mm)
Core width
(mm)
Roll diameter
(mm)
Inner core
(mm)
Roll length (m)
SAP DEK
03127081 176215 DEK Micron 515 530 56 19 11
03128524 176216 DEK Micron 400 530 56 19 11
03128532 176217 DEK Micron 300 530 56 19 11
03128523 173826* DEK Micron 515 530 56 19 11
03128538 431524 DEK Micron 607 620 56 19 11
03144917 431424
DEK Micron for Cyclone/
Typhoon
300 325 56 19 11
03217296 – DEK TQ (NEW) 400 – – – ~ 22
03131502 173451 AP series, UP series,
SPM, MPM125, Accela,
Momentum
320 457 64 19 12
03131501 173450 AP series, UP series,
SPM, MPM125, Accela,
Momentum
443 457 64 19 12
03139825 178911 AP series, UP series, SPM,
MPM125,
Accela, Momentum
597 622 64 19 12
03131512 178864 Accela, Momentum 443 457 100 19 44
03144221 178909 Accela, Momentum 546 559 100 19 44
03128533 178908 All Ekra In - Line printers 400 400 53 13 10
03131513 178907 All Ekra In - Line printers 500 500 53 13 10
03131611 431556 All Ekra In - Line printers 500 500 53 13 8
*With metalised anti-static packaging.
5
DEK Pro and DEK Pro XF
advanced understencil cleaning chemistries
Designed specifically for understencil cleaning, DEK Pro and DEK Pro XF improve
process performance and reduce print defects. They are safer, cleaner and
more environmentally friendly than IPA and traditional solvent cleaners, and are
compliant with all industry standards and environmental regulations.
Features and benets:
■ Prioritizes health, safety and the environment
- DEK Pro XF has no flash point and is low VOC
- DEK Pro has a high flash point of 67º C
(IPA flash point is 12º C)
- Safer to use, transport, store and dispose
- Manufactured using biodegradable materials
■ Reduce print defects
- No impact on thixotropic properties of the solder paste
- Reduce risk of solder slump and solder balling
- Residue-free after evaporation
■ Compliant and compatible
- Compatible with all solder paste materials
- RoHS and REACH compliant
DEK PRO ADVANCED UNDERSTENCIL CLEANING CHEMISTRIES
Part number Description Volume Available for
SAP DEK
03129706 173483 DEK Pro cleaning agent 1 liter Vacuum and non vacuum printers and manual cleaning
03129708 173485 DEK Pro cleaning agent 5 liters Vacuum and non vacuum printers and manual cleaning
03130223 431093 DEK Pro cleaning agent 20 liters Vacuum and non vacuum printers and manual cleaning
DEK PRO XF ADVANCED UNDERSTENCIL CLEANING CHEMISTRIES
Part number Description Volume Available for
SAP DEK
03130225 431513 DEK Pro XF cleaning agent 1 liter Vacuum printers
03126194 431514 DEK Pro XF cleaning agent 5 liters Vacuum printers
6
|
Process Support Products
|
ASM: Stencils from the global No. 16
|
Process Support Products
|
ASM Consumables