Brochure-PacTech-WLP-Services.pdf
颂 PacTech member of nagase group Your Global Partner for Wafer Level Packaging
颂
PacTech
member
of
nagase
group
Your
Global
Partner
for
Wafer
Level
Packaging
o
Design
&
manufacturing
of
specialized
equipment
for
over
20
years
o
Process
development
&
subcontracting
services
utilizing
leading-edge
technologies
o
Proprietary
chemistries
for
demanding
semiconductor
technologies
o
Partnerships
supporting
global
customers:
IDMs,
OEMs
&
Fabless
Customized
Turnkey
Solutions
Broad
Range
of
Wafer
Level
Packaging
Services:
o
Electrolytic
&
Electroless
Plating
of
UBM
and
Bump
o
Repassivation
Layers
o
Sputtered
&
Electroplated
Redistribution
Layers
(RDL)
o
Solder
Bumping
-
Jetting
&
Ball
Placement
o
Wafer
Thinning
&
Dicing
o
Wafer
Backside
Metallization
o
Die
Sorting
in
Tape
&
Reel
or
Waffle
Pack
Flexible
Operation
Models
o
High
Volume
Subcontracting
Service
o
In-house
Technology
Transfer
using
Paclech
Equipment
o
Second
Sourcing
out
of
Global
Paclech
Locations
Unique
Wafer
Level
Packaging
Applications
ENIG
Bump
for
RFID
Adhesive
Attach
Nickel
on
Nickel
Electroless
Ag
on
Ni
for
soldering
and
Ag
sintering
Wafer
Thinning
Backside
Metallization
Wafer
Dicing
Advanced
Packaging
Platforms
ENIG
UBM
for
Flip
Chip
&
WLCSP
ENEPIG
for
Wire
Bonding
Solder
Bump
for
Flip
Chip
&
WLCSP
Cu
Pillar
for
Flip
Chip
&
WLCSP
Wafer
Backside
Processing
and
Die
Singulation:
Wafer
Thinning,
Backmetal,
Temporary
Wafer
Bonding,
Wafer
Dicing
o
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