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Improve production quality Improve production efﬁciency Improve proﬁts Beneﬁts provided with Saki’ s 3D-SPI series P r o d u c t i v i t y C o s t s P r o ﬁ t s 4 5 Programming ⁃ One common platform supports 3D-SPI, 3D-A…

3D検査装置

3D-AXI

2D-AOI

Conformal Coating

Inspection Process

X-Ray

Inspection Process

3D-AOI

Selective Soldering

Inspection Process

3D-AOI

SMT Process

3D-SPI

SMT Process

Internet

Cloud-based

Management System

3D-AOI

SMT Process

2 3

Saki's Total Smart Factory Inspection Solution

QUALITY DRIVEN Production

SAKI maximizes production efficiency by

improving production-line quality.

Advantages of SAKI's Total Inspection Solutions

Today's technologies and markets demand advanced manufacturing,

high-mix low-volume production, precision quality, short lead times,

and low total cost-of-ownership. Saki's high-speed, high-accuracy

inspection and measurement systems, with enhanced software and

hardware platforms, satisfy those requirements. 

Saki's data capture capabilities and machine-to-machine (M2M)

connectivity maximize production efficiency for the Smart Factory.

Saki systems inspect the entire assembly process:

• Screen printing

• Dispensing

• Component placement

• Reflow

• Selective soldering

• Conformal coating

※ SPI: Solder Paste Inspection　AOI: Automated Optical Inspection

Improve

production

quality

Improve

production

efﬁciency

Improve

proﬁts

Beneﬁts provided with Saki’s 3D-SPI series

Productivity

Costs

Proﬁts

4 5

Programming

⁃

One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI

⁃

Saki Self-Programming (SSP) Software

Speed

⁃

Newly developed high-speed mode increases measurement

and inspection speed by about 190%

Measurement and Inspection/SPC Function

⁃

Warpage adjustment

⁃

Coplanarity inspection

⁃

SPC function

Verification

⁃

History Management System for data

logging and history

⁃

Golden & Silver Sample Check Function for

process verification

Machine Stability and Accuracy

⁃

Same rigid gantry structure as Saki's 3D-AOI

⁃

Self-diagnostic functions

⁃

Rigid gantry structure and dual motor-drive system

⁃

High resolution linear scale for accurate positioning

Speed

⁃

Increased conveyor speed

⁃

CoaXPress camera for faster

inspection & measurement process

Flexible Configurations for Diverse

Requirements

⁃

Simultaneous 2D and 3D inspection

of the entire board

⁃

Scalable optical resolutions of 7µm, 12µm, and 18µm

⁃

Flexible gantry for M/L/XL PCBA sizes and dual lanes

Quality First

QUALITY DRIVEN Production

SAKI's 3D-SPI systems

enable increased production

efficiency of the entire line

with remarkable speed, as

well as increased product and

performance quality and takt-

time control.

Using SAKI's 3D-SPI and 3D-AOI systems together further

increases line quality and enhances productivity.

Saki combines proprietary hardware and software to produce stable,

highly accurate 3D-SPI and 3D-AOI systems that improve production

and maximize process efficiency and product quality.

AOISPI

Key Factor 1

Advanced Hardware Features

Key Factor 2

Advanced Software Features

Key Factor 3

Applied Technology

Machine-to-Machine Systems

⁃

Feed-back from SPI to Printer

⁃

Feed-forward from SPI to Pick-and-Place

⁃

Feed-back from AOI to Pick-and-Place

Stand-alone Systems

⁃

RMS remotely manages multiple BF2-Monitors with one PC

⁃

MPV lets operators see every inspection result in real time

AOISPI AOISPI

6 7

Key Factor 2

Advanced Software Features

Applied Technology

SAKI Technology for M2M Communication

Key Factor 1

Advanced Hardware Features

Proprietary hardware provides

faster measurement and

inspection and accurate

measurements

⁃

Saki's machines are built with hardware that's made

to last.

⁃

A closed-loop, dual servo motor-drive system, high-

resolution linear scale, and rigid gantry structure

provide unsurpassed accuracy and repeatability for

absolute measurements.

⁃

An optimized conveyor system, driven by step

motors, enables fast PCBA loading and unloading.

⁃

Both the 3D-AOI and 3D-SPI systems have the same

rigid gantry structure that offers high accuracy.

Self-diagnostic System

Saki's predictive and preventive maintenance

management system assures stable machine

conditions and repeatable, consistent performance.

Every key component is monitored along with system

conditions, and a detailed diagnostic log is recorded.

The optimized preventive maintenance plan reduces

maintenance time, machine down-time, manpower,

and costs.

Simultaneous 2D and 3D inspections over the

entire board

⁃

3D-SPI uses both 2D and 3D images for inspection.

Optical Unit

⁃

Three camera resolution levels —7 μ m, 12 μ

m, 18 μ m— are available to match application

requirements.

⁃

Multi-frequency digital projectors (12um & 18um-

Two, 7um-Four) provide accurate 3D measurements

for high-quality images and quantitatively detect

solder printing failures.

⁃

Enhanced 2D and

3D calibration uses

multiple calibration

height targets for

positive and negative

heights to guarantee

height measurement

accuracy.

Remarkable Speed

Equipped with newly developed technologies

and features

⁃

Both 3D-AOI and 3D-SPI have optimized conveyor

systems, driven by step motors, in similar enclosures,

enabling fast PCBA loading and unloading.

⁃

The CoaXPress camera enables faster inspection.

⁃

A newly developed high-speed mode and unique

imaging system increase measurement and

inspection speed by about 190% compared to

previous machines.

Programming

Reduces set-up time,contributing to increased

productivity

⁃

Special BF2 software has a common user-interface

for Saki's 3D SPI, AOI, and AXI systems.

⁃

The software saves a complete 3D image of the

whole PCBA, so the operator can create inspection

data without using the physical board.

Creating programming data faster

⁃

Saki Self-Programming (SSP) Software

Saki's Self-Programming Function was developed on

the concepts of Board less, Skill less, and Stress less.

Inspection data can be

easily created by using

various PCB design data

in addition to Gerber

data and CAD data.

Measurement and Inspection

Saki's unique Warpage

Adjustment provides stable

inspection for boards with

large warpage such as flexible

printed circuits.

Coplanarity inspection

In addition to inspecting each solder desposit, we

inspect the relative variations in the BGA to increase

the quality of small and fine-pitch components.

Maximum solder ball

Minimum solder ball

Detects the dierence between

the maximum solder and

minimum solder within the part.

SPC Function

Trend View

Trend View Monitors inspection

results during automatic

operation and calculates

sample values in real time.

Through this function, the

printed solder paste quality can

be maintained and controlled

for each board.

Past Board View

This function saves inspection

results and measured values

for one week. It enables you

to search previously inspected

boards from the saved data,

sort them by placement data,

reference, and component

type, and primarily check the

inspection results, measured

values, failure types, and

images of failures.

Inspection Data Verification

History Management System

The History

Management System

records the detailed

data modification

system in detail (who,

what, when, where,

why, and how)

Golden & Silver Sample Check Function

Maintains inspection

accuracy by checking

machine status and

inspection conditions

before starting auto

operation.

Yield Chart

Time Based Maintenance

Condition Based Maintenance

Gerber

CAD XY

ECAD Design

All Charts View

Defect Analysis