SJ3906DCB1-06E_mail.pdf - 第5页

3D-SPI 3D-AOI 3D-AOI 3D-AXI Unloader Printer Feed-back from SPI to Printer 1 Feed-back from AOI to Pick-and-Place machine ※1 3 Automated line control function 4 Feed-forward from SPI to Pick-and-Place machine Reﬂow Loade…

6 7

Key Factor 2

Advanced Software Features

Applied Technology

SAKI Technology for M2M Communication

Key Factor 1

Advanced Hardware Features

Proprietary hardware provides

faster measurement and

inspection and accurate

measurements

⁃

Saki's machines are built with hardware that's made

to last.

⁃

A closed-loop, dual servo motor-drive system, high-

resolution linear scale, and rigid gantry structure

provide unsurpassed accuracy and repeatability for

absolute measurements.

⁃

An optimized conveyor system, driven by step

motors, enables fast PCBA loading and unloading.

⁃

Both the 3D-AOI and 3D-SPI systems have the same

rigid gantry structure that offers high accuracy.

Self-diagnostic System

Saki's predictive and preventive maintenance

management system assures stable machine

conditions and repeatable, consistent performance.

Every key component is monitored along with system

conditions, and a detailed diagnostic log is recorded.

The optimized preventive maintenance plan reduces

maintenance time, machine down-time, manpower,

and costs.

Simultaneous 2D and 3D inspections over the

entire board

⁃

3D-SPI uses both 2D and 3D images for inspection.

Optical Unit

⁃

Three camera resolution levels —7 μ m, 12 μ

m, 18 μ m— are available to match application

requirements.

⁃

Multi-frequency digital projectors (12um & 18um-

Two, 7um-Four) provide accurate 3D measurements

for high-quality images and quantitatively detect

solder printing failures.

⁃

Enhanced 2D and

3D calibration uses

multiple calibration

height targets for

positive and negative

heights to guarantee

height measurement

accuracy.

Remarkable Speed

Equipped with newly developed technologies

and features

⁃

Both 3D-AOI and 3D-SPI have optimized conveyor

systems, driven by step motors, in similar enclosures,

enabling fast PCBA loading and unloading.

⁃

The CoaXPress camera enables faster inspection.

⁃

A newly developed high-speed mode and unique

imaging system increase measurement and

inspection speed by about 190% compared to

previous machines.

Programming

Reduces set-up time,contributing to increased

productivity

⁃

Special BF2 software has a common user-interface

for Saki's 3D SPI, AOI, and AXI systems.

⁃

The software saves a complete 3D image of the

whole PCBA, so the operator can create inspection

data without using the physical board.

Creating programming data faster

⁃

Saki Self-Programming (SSP) Software

Saki's Self-Programming Function was developed on

the concepts of Board less, Skill less, and Stress less.

Inspection data can be

easily created by using

various PCB design data

in addition to Gerber

data and CAD data.

Measurement and Inspection

Saki's unique Warpage

Adjustment provides stable

inspection for boards with

large warpage such as flexible

printed circuits.

Coplanarity inspection

In addition to inspecting each solder desposit, we

inspect the relative variations in the BGA to increase

the quality of small and fine-pitch components.

Maximum solder ball

Minimum solder ball

Detects the dierence between

the maximum solder and

minimum solder within the part.

SPC Function

Trend View

Trend View Monitors inspection

results during automatic

operation and calculates

sample values in real time.

Through this function, the

printed solder paste quality can

be maintained and controlled

for each board.

Past Board View

This function saves inspection

results and measured values

for one week. It enables you

to search previously inspected

boards from the saved data,

sort them by placement data,

reference, and component

type, and primarily check the

inspection results, measured

values, failure types, and

images of failures.

Inspection Data Verification

History Management System

The History

Management System

records the detailed

data modification

system in detail (who,

what, when, where,

why, and how)

Golden & Silver Sample Check Function

Maintains inspection

accuracy by checking

machine status and

inspection conditions

before starting auto

operation.

Yield Chart

Time Based Maintenance

Condition Based Maintenance

Gerber

CAD XY

ECAD Design

All Charts View

Defect Analysis

3D-SPI 3D-AOI 3D-AOI 3D-AXI UnloaderPrinter

Feed-back from SPI to Printer

Feed-back from AOI to Pick-and-Place machine

※1

Automated line

control function

Feed-forward from SPI to Pick-and-Place machine

ReﬂowLoader

Management terminal

Pick-and-Place

8 9

Solution

Saki's QUALITY DRIVEN Production Solution

Key Factor 3

Applied Technology

M2M Solution

Feed-back from SPI to Screen Printer.

Feeds back

misalignment

data and prevents

print errors by

automatically

alerting the user

when the stencil

needs cleaning.

Feed-forward from SPI to

Pick-and-Place machine

Measures the degree the printing

position shifts to correct placement

positioning. A NG board skip function

improves efficiency, quality, and

cost.

Feed-back from AOI to Pick-and-Place

machine

Feeds back placement position and location

data from AOI to pick-and-place and feeds

forward data from SPI to improve quality and

efficiency.

*1 factory installed option

Automated line control function

Automates control of the assembly line

to reduce rework and waste and increase

throughput.

※

〜

Saki partners with the leading PCB equipment

manufacturers. Ask us which products we connect

with.

BF2-Editor

Create data and debug the process offline

BF2-Monitor

(Offline verification terminal)

RMS (Remote Management System)

Remotely control multiple BF2-Monitors

with a single PC. Reduces assembly-floor

personnel. Moreover, the production status

of each device can be confirmed.

MPV (Multi Process View)

The BF2-Monitor shows the results of all

inspection processes (SPI, pre-reflow, and

post reflow) on one screen in real time for

operator review, simplifying the verification

process and making it less subject to error.

It is also useful for analyzing the cause of a

defective board.

Correction of

the print position

Automatic

cleaning instructions

NG board skip

Placement position

correction*

Options

3D-AOI

(Post Reﬂow)

3D-AOI

(Post Reﬂow)

BF2-Monitor

BF2-Editor

Server

MPV

RMS Central

Management Terminal

Line 1

Line 2

Line 3

（MPV DATA）

3D-AOI

(Post Reﬂow)

Dual Monitor

3D-SPI

3D-AOI

(Pre Reﬂow)

3D-AOI

(Pre Reﬂow)

3D-AOI

(Pre Reﬂow)

3D-SPI

10 11

Resolution

Height

measurement

range

Image

capture time

Major

characteristics

Meets requirements for

production of advanced smart

phones, wearable devices, and

devices and modules for IoT.

Capable of 0201mm (008004in.)

pad inspection.

Well balanced system

offering both high speed

and the inspection of

the industry's smallest

components.

Saki's new optical sensor

increases speed by 190%

delivering the industry's

highest throughput.

7μm 12μm 18μm

500μm

3,600mm

High-deﬁnition High speed

9,92in.

8,52in.

1,64in.

1,063mm

5,500mm

6,400mm

Product

3Si Series Product Specifications

3Si Series Optical Unit Specifications

Dual-lane system can inspect 2 different PCBAs simultaneously

Wide selection of cameras based

on various optical resolutions and speeds

Substantially improves inspection speed

Comparison between BF-3Si and 3Si-LS2 using an optical unit with

18μm resolution and PCB size 330x250mm(12.99x9.84in.).

Front View

（mm, in.）

850 ,33.46

(1500 ,59.05)

(1930 ,75.98)

1040 ,40.94

(1500 ,59.05)

(1930 ,75.98)

1040 ,40.49

1340 ,52.75

(1500 ,59.05)

(1930 ,75.98)

(775 ,30.51)

(986 ,38.81)

Side View

（mm, in.）

285, 11.23

1430, 56.30

(1000, 39.37)

(900, 35.44)

295, 11.62

1440, 56.70

(1000, 39.37)

(900, 35.44)

295, 11.62

1440, 56.70

(1000, 39.37)

(900, 35.44)

BF-3Si

3Si-LS2/MS2

NEW

13sec

25sec

Faster !

Dimensions

Single lane

Dual lane

Single lane

Dual lane

Single lane

Model Name

3Si-MS2 3Si-MD2 3Si-LS2 3Si-LD2 3Si-ZS2

Size （W）×（D）×（H）

（mm, in.）

850 × 1430 × 1500,

33.46 × 56.30 × 59.06

1040 × 1440 × 1500,

40.94 × 56.69 × 59.06

1340×1440×1500,

52.75×56.69×59.06

Weight(kg,lb)

850kg, 1873.93lb 900kg, 1984.16lb

Electric Power

Single Phase 〜 200-240V+/-10%, 50/60Hz

Air Requirement

0.5MPa, 5L/min（ANR）

PCB Size

（mm, in.）

ー

Single

mode

Dual

mode

ー

Single

mode

Dual

mode

ー

50×60〜330×330,

1.97×2.36〜

12.99×12.99

50×60〜

330×330,

1.97×2.36〜

12.99×12.99

50×60〜

320×330,

1.97×2.36〜

12.60×12.99

【7μm camera head】【7μm camera head】

50×60〜686×870,

1.97×2.36〜27.00×34.25

50×60〜330×330,

1.97×2.36〜12.99×12.99

50×60〜

330×330,

1.97×2.36〜

12.99×12.99

50×60〜

320×330,

1.97×2.36〜

12.60×12.99

【

12/18μm camera head

】【

12/18μm camera head

】

50×60〜500×510,

1.97×2.36〜19.68×20.07

50×60〜

500×510,

1.97×2.36〜

19.68×20.07

50×60〜

320×510,

1.97×2.36〜

12.60×20.07

PCB Clearance

Top：40mm, 1.57in.

Bottom：60mm, 2.36in.

Top：40mm, 1.57in.

Bottom：50mm,1.96in.

Top：40mm, 1.57in.

Bottom：60mm, 2.36in.

Top：40mm, 1.57in.

Bottom：50mm, 1.96in.

Top：40mm, 1.57in.

Bottom：60mm, 2.36in.

⁃

3Si-ZS2 supports the optical unit

with resolution of 18µm.