SE3000-DD 3D SPI Brochure EN.pdf - 第6页

10 | SE3000-DD 3D SPI SE3000-DD 3D SPI | 11 MRS is an ide al technolog y solution for a wide r ange of applica tions including those with ver y high quality requir ements. LED Aerosp ac e Adv anced P ackaging SMT Electr …

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8 | SE3000-DD 3D SPI SE3000-DD 3D SPI | 9
The SPI V5 series soware delivers
world-class user experience with its
intuitive interface, completely
changing the way users interact
with our system.
With full multi-touch experience, SPI
V5 series soware oers a range of
revolutionary features that enable
smarter and faster inspection.
Features Include
• Seamless integration of all applications -
Teach, Inspection, Defect Review and
Real-time SPC.
• Unlimited undo-redo and global search
options in Teach.
• Loads of smart, informative and relevant
charts that provide yield summary, FPY
information, hotspot display, top 10 pad
failures, historical panel and more.
• Easy, hassle-free operation using multi
touch, multi-selection, pinchzoom,
and pan-move options.
CyberPrint OPTIMIZER™ automatically optimizes the print process by
proactively analyzing accurate trend data - first-ever in the industry!
Pre-defined templates help you get started quickly while customizable
rules support perfect customization for specific product needs.
CyberPrint OPTIMIZER‘s predictive process improvement gets you
better yields and reduces downtime.
Award-Winning Intuitive Soware CyberPrint OPTIMIZER™ Ready
Real-time SPC.
Hot Spot Display.
Defect Correlation
SPI AOI AOI
FAIL
FAIL
FAIL
FAIL
FAIL FAIL
PASS PASS
PASS
Fast, scalable SPC solution
CyberReport™ oers full-fledged
machine-level to factory-level SPC
capability with powerful historical
analysis and reporting tools.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
Failure analysis drives line optimization and auto tolerance changes
Defect Review Interface.
10 | SE3000-DD 3D SPI SE3000-DD 3D SPI | 11
MRS is an ideal technology solution for a wide range of applications
including those with very high quality requirements.
LED
Aerospace
Advanced Packaging
SMT Electronics
Advanced Socket Metrology
Automotive
Medical
Solder Paste
Defense
Semiconductor
High End Applications
www.nordson.com/TestInspect
Nordson Test & Inspection Japan
ti-sales-jp@nordson.com
Nordson Test & Inspection Singapore
ti-sales-eu@nordson.com
Nordson Test & Inspection Taiwan
ti-sales-tw@nordson.com
Nordson Test & Inspection Korea
ti-sales-korea@nordson.com
BR-SE3000-DD 20/01/2023-V1
For more information, speak with your
Nordson representative or contact your
Nordson regional oice
Nordson Test & Inspection
Europe, SEA, Africa
ti-sales-eu@nordson.com
Nordson Test & Inspection Americas
ti-sales-us@nordson.com
Nordson Test & Inspection China
ti-sales-cn@nordson.com
Specifications subject to change without prior notice.
Copyright © Nordson 2024. Other products and company
names mentioned are trademarks or trade names of their
respective companies.
Nordson Test & Inspection products are patent protected
and covered by the patent listed at www.nordson.com.
Inspection Capabilities
Standard
MRS Sensor
Ultra-High Resolution
MRS Sensor
Inspection Speed 35 cm
2
/sec (2D+3D) 15 cm
2
/sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
Panel Size (Max.)
SE3000 DD: Single Lane: 510 x 510 mm (20 x 20 in.); Dual Lane: 350 x 320 mm (13.7 x 12.5 in.)
SE3000 D: Single Lane: 510 x 510 mm (20 x 20 in.); Dual Lane: 510 x 320 mm (20 x 12.5 in.)
Clearance Top: 50 mm (1.96 in.) ; Bottom: 30mm (1.18 in.)
Panel Thickness 0.3 mm to 5.0 mm (0.01 in. to 0.2 in.)
Panel Edge Clearance 3.0 mm (0.12 in.)
Maximum Panel Weight 3.0 kg (6.6 lbs)
Measurement Types Height, Area, Volume, Registration, Bridge Detection, Defect Review
Measurement Gage R&R
<10%, 6 σ on Printed Circuit Board;
<5% 6 σ on Certification Target
<5%, 6 σ on Printed Circuit Board;
<3% 6 σ on Certification Target
Z Height Accuracy 3 μm on a Certification Target
Z Height Measurement Range 1 mm
Conveyor Speed Range 150 - 450 mm/sec (5.9 - 17.7 in./sec)
Conveyor Adjustment Automatic
Vision System & Technology
Imagers Multi-3D sensors
Resolution 18 μm 9 μm
Field of View (FOV) 36 x 36 mm (1.42 x 1.42 in.) 21 x 21 mm (0.82 x 0.82 in.)
Maximum Pad Size in FOV 15 x 15 mm (0.6 x 0.6 in.)
Maximum Inspection Area - SE3000 DD Single Lane: 504 x 504mm (19.84 x 19.84 in.) Dual Lane: 344 x 314mm (13.54 x 12.36 in.)
Maximum Inspection Area - SE3000 D Single Lane: 504 x 504mm (19.84 x 19.84 in.) Dual Lane: 504 x 314mm (19.84 x 12.36 in.)
System Specifications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10-15 amps
Compressed Air Requirements 5.6 Kgf/cm
2
to 7.0 Kgf/cm
2
(80 to 100 psi @ 4 cfm)
System Dimensions 170.5 x 162 x 152 cm (W x D x H) Height excludes signal-light pole and leveling feet
Weight ≈1596 kg (3519 lbs.)
Options
Barcode Reader, Rework station, SPC Soware, Alignment Target • Standard SE3000, SE3000 X and SE3000XL models available
Specifications