CP40培训说明书.pdf - 第8页
DCA direct chip attachment SBC solder ball connect GLA SS epoxy: A sy mmetrical : Diode: T rimmer (capacitor): Resistor: Capa…
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SMC/SMD
SMT
Chip:
Ceramic:
Polarity:
Stagger:
Hexagon inductor:
Air wound coil:
Crystal oscillator: ,
Criteria:
Notch: ,
Contour: ,
Stable:
Burrs:
Inferior: ,
Reliability:
CSPchip scale package
MCMmulti-chip model
COBchip on board
LSIlarge scale integrated circuit LSIC
FCP: flip chip
DCAdirect chip attachment
SBCsolder ball connect
GLASSepoxy:
Asymmetrical:
Diode:
Trimmer (capacitor):
Resistor:
Capacitor:
transistor:
Rectangular:
PGApin grid array)
BGAball grid array)
PQFPplastic quad flat package)
C4controlled collapse chip connection)
DIPdual in-line package)
PLCCplastic leaded chip carrier)
SOJsmall out-line J-lead)J
TSOPthin small out-line package)
TBGAtiny-BGA)
BLPbottom lead package)
UBGAmicro BGA)11.4
1
a
b
c
d
e