CP40培训说明书.pdf - 第9页
1 a b c d e
DCAdirect chip attachment
SBCsolder ball connect
GLASSepoxy:
Asymmetrical:
Diode:
Trimmer (capacitor):
Resistor:
Capacitor:
transistor:
Rectangular:
PGApin grid array)
BGAball grid array)
PQFPplastic quad flat package)
C4controlled collapse chip connection)
DIPdual in-line package)
PLCCplastic leaded chip carrier)
SOJsmall out-line J-lead)J
TSOPthin small out-line package)
TBGAtiny-BGA)
BLPbottom lead package)
UBGAmicro BGA)11.4
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