7080B brochure.pdf - 第4页

Genera l Sp ecific ations Device T ype P a cka ge Size T es t Site Cap. T es t Open i ng Inde x T ime UPH Jam Rate QFP , TSOP , CSP , WL CSP , BGA , QFN, PL CC, L GA , PGA Min. 3mm x 3mm to Max. 50mm x 50mm Single sit e …

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Key Features
2x2 PnP module with X,Y auto pitch ( Option 2x2 PnP
Change 1*4 PnP)
Up to 4 site parallelism(option 8 site)
Auto loader & unloader
Contact force can change
Index time <0.4 seconds
Temperature support range 50 C~90 C +/- 2 C
90 C~130 C +/- 3 C
Friendly operating interface
Real Time Camera to detect double device in test site
( Option )
General Specifications
Device Type
Package Size
Test Site Cap.
Test Opening
Index Time
UPH
Jam Rate
QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3mm x 3mm to Max. 50mm x 50mm
Single site / Dual site ( 1x2 )
Quad site ( In-Line 1x4 ) Quad site ( Square 2x2 )
option: Octal site ( 4x2 )
345mm x 245mm
< 0.4 sec
9500/h (option 8 site 15000)
1/5000
Temp. ability
Contact Force
Tray Type
Loading &
Unloading
Facility Req.
Interface
Handler O.D.
Ambient ~ 90 C 2 C 90 C~130 C 3 C
85kg, option 240kg
JEDEC or EIAJ
6 auto trays, 3 manual trays
AC 220 V, 50/60 Hz, +-10%, Max. 8 KVA
5.0kg/cm or more (dry and clean air) Consumption: <200 nl/min
TTL, RS232, GPIB
1905mm (W) * 1560mm (D) * 1933mm (H)
General Specifications