PI series 3D SPI brochure and specifications.pdf - 第7页

Speciﬁcations are subject to change without notice. Mycronic, MYD A TA, MYDA TA automation and MY ; Mycr onic 4.0; MYPro, MYPro Line, MY100, MY100e, MY200, MY200HX, MY200DX, MY200SX, MY200LX, MY300, MY300EX, MY300HX, MY3…

Measure paste volume with

unmatched accuracy

The PI series’ patented Z-referencing technology captures hundreds

of references across an ultra-large 3D ﬁeld of view, giving you

unprecedented accuracy for even the smallest paste volume

measurements.

Take control over

your print process

PI’s automatic pad grouping by AAR (Area Aperture Ratio) allows you to continuously

improve your process and set tolerances independently of products. Together with

the MYPro Link software suite, this means you can transform your inspection data

into actionable process information.

Highly accurate paste volume

measurement using a patented

Z-referencing technology that

overcomes the limitations of

traditional SPI systems.

Superior accuracy in real

production environments

withno false calls due to a

unique warp compensation

enabled by multi-frequency,

multi-pattern moiré, com-

bined with patented dual

Z-axis motion.

Unambiguous information

for defect classiﬁcation

with high-resolution textured

3Dimages.

Improve your process and

set tolerances independently

of products with meaningful

automatic pad grouping

by AAR.

Gain new insights into your

process with extra-large review

images in textured 3D for easy

diagnostics.

Monitor your process in realtime

with MYPro Analyze, which helps

you report and monitor your

progress with useful trend

analyses.

Stable Z-reference

Unstable Z-reference

Not measured

TRADITIONAL SPI

Threshold at ~40μm

Not measured

Traditional SPI: The typical threshold for a traditional SPI is usually 30–40micro-

meters (μm), meaning height and volume under this limit goes unmeasured. Asa

result, volume is underestimated on small pads, preciselywhen you need to know

how much paste is truly deposited.

PI series: PI’s patented

Z-referencing method

leverages the entire

textured 3D board

information, rather than

just cropped images

around the pads, to

deﬁne a stable and

accurate Z-reference.

8 9

INSPECTION TECHNOLOGY PI PICO PI PRIMO

3D engine 360° Moiré—Shadow free, Multi-camera, Multi-projector, Multi-pattern

Camera 80Mpixel, 12-bit CMOS sensor 160Mpixel, 12-bit CMOS sensor

Projection 4 HD, 10-bit industrial projectors 8 HD, 10-bit industrial projectors

Field of View (XxY) 160mmx55mm 350mmx55mm

Lighting White LED + RGB lighting

Warp compensation ±5mm with dual Z-axis motion for real-time Z and Q adjustments

Z-reference Full PCB inspection for Z-referencing with no cropping around pad

INSPECTION PERFORMANCE PI PICO/PI PRIMO

Measurements Height, Area, Volume, Oset, Bridging, Shape 2D, Shape 3D, Coplanarity

Defect types

Insucient/Excessive/Missing paste, Bridge, Shape 2D, Shape 3D,

User deﬁned defect, Paste pollution

Minimum paste/glue deposit size 100μmx100μm

Maximum paste/glue deposit size 20mmx20mm

Maximum paste height 400μm (consult for higher paste height)

Height resolution 100nm

Height accuracy <2μm on Certiﬁcation target at operating temperature

Height repeatability <1μm at 3σ on Certiﬁcation target at operating temperature

Volume repeatability <3% at 3σ on PCB at operating temperature

Inspection speed 3 sec. per Field of View

SOFTWARE SUITE PI PICO/PI PRIMO

Oine programming software

MYPro Create (Gerber, CAD data, glue deposit data)

Online SPC

Alerts in case of process drift

SYSTEM PI PICO/PI PRIMO

Operating system Linux

Storage capacity 6TB including 4TB in RAID 1

Axis motion Stepper motor and linear optical encoder (1μm resolution)

PI series 3D SPI

State-of-the-art design

Robust conception, smart access and built-in

manual for fastand easy maintenance,

every aspect has been designed

to simplify your operations.

FACILITIES PI PICO/PI PRIMO

Interface IPC-SMEMA-9851

Power requirements Single Phase 2P + Earth, AC 100–240V/16A, no need for compressed air

Dimensions in mm (WxDxH) 1,000 (800 optional)x1,296x1,932 (adjustable height)

Weight 430kg

Operating temperature 15–30°C

Relative humidity 20–75% (without condensing)

PCB HANDLING PI PICO PI PRIMO

S M S M L XL

Minimum PCB dimensions 51mmx51mm (2x2")

Maximum PCB dimensions (XxY)

350x533mm

(14x21")

533x533mm

(21x21")

350x533mm

(14x21")

533x533 mm

(21x21”)

609x533mm

(24x21”)

762x533mm

(30x21”)

Minimum PCB thickness 0.1mm

Maximum PCB thickness 5mm 7.5mm

Minimum edge clearance 3mm

Top clearance 20mm

Bottom clearance 50mm

Conveying direction Left to right/Right to left/Left to left/Right to right

Conveyor width adjustment Automatic

Conveying height 830–930mm (standard)/900–1,000mm (optional)

Conveyor lenght

1,000mm

(standard)

800mm

(optional)

1,000mm

(standard)

800mm

(optional)

1,000mm 1,250mm

Maximum PCB weight 4kg 4.5kg

DIMENSIONS PI PICO/PI PRIMO [¢mm¢]

760

650

1,000

1,292

1,000

(or 800 optional)

120

297

1,647

1,932

1,892

900

OPTIONS PI PICO/PI PRIMO

External barcode readers (1D/2D) Cognex DM 150 or Keyence SR1000

Internal barcode readers (1D/2D) Software option enabling reading from inspection head

Uninterruptible power supply For PC/230V

Closed loop with stencil printer Available for all major stencil printer brands

Glue deposit inspection Simultaneous inspection for paste and glue

M2M conveying mode Kit to implement IPC HERMES 9852 protocol

Other options available Please contact us

10 11

Speciﬁcations are subject to change without notice. Mycronic, MYDATA, MYDATA automation and MY; Mycronic 4.0; MYPro, MYPro Line, MY100, MY100e, MY200, MY200HX, MY200DX, MY200SX, MY200LX, MY300, MY300EX, MY300HX, MY300DX,

MY300SX, MY300LX, MY500, MY600, MY600JD, MY600JP, MY600JX, MY700, MY700JD, MY700JP, MY700JX and MYSynergy; Mycronic 4.0; MYSmart, MYC50, MYD10, MYD50, MYT10, MYT50; Mycronic SMD Tower; MYTower; 5, 6, 6+, 7+, 5x, 6x;

ViTECHNOLOGY, VIT; 5K, 5K3D, 8K, 8K3D, 9K, 9K3D; PI, PI Pico, PI Primo; SIGMA Link; HYDRA Speedmount, Midas, ISIC; Agilis, Agilis Linear Magazine (ALM), Agilis Linear Magazine Flex (ALM FLEX), Agilis Stick Magazine (ASM), Agilis Tray Magazine (ATM),

Mycronic Tray Exchanger (TEX), Mycronic Tray Wagon Magazine (TWM); Mycronic Dip Unit (DPU); Mycronic Standard Vision System (SVS), Mycronic Dual Vision System (DVS), Mycronic Linescan Vision System(LVS), Mycronic HYDRA Vision System (HVS);

Mycronic Assembly Process Management (APM) including; JPSys, TPSys, MYLabel, MYPlan, MYCenter, MYTrace, MYCam and FlowLine are registered trademarks or trademarks of Mycronic AB. Mycronic AB is ISO 9001:2015 and ISO 14001:2015 certiﬁed.

4030822 REV 0000 / SEPTEMBER 2021

Bringing tomorrow’s

electronics to life

SWEDEN

Mycronic AB

PO Box 3141

Nytorpsvägen 9

SE-183 03 Täby

Sweden

Tel: +46 8 638 52 00

NETHERLANDS

Mycronic B.V.

High Tech Campus 10

5656 AE

Eindhoven

Netherlands

Tel: +31 402 62 06 67

FRANCE

Mycronic S.A.S.

1 rue de Traversière

CS 80045

94513 Rungis Cedex 1

France

Tel: +33 1 41 80 15 80

SOUTH KOREA

Mycronic Co. Ltd.

3rd Floor, Jung-San Bldg.

163 LS-ro Gunpo-Si

Gyonggi-Do, 15808

South Korea

Tel: +82 31 387 5111

SINGAPORE

Mycronic Pte., Ltd.

9 Tagore Lane,

#02-08/09

9@Tagore

Singapore 787472

Tel: +65 6281 7997

GERMANY

Mycronic GmbH

Biberger Straße 93

D-82008 Unterhaching

bei München

Germany

Tel: +49 89 4524248-0

Mycronic Ltd.

Unit 2, Concept Park

Innovation Close

Poole, Dorset, BH12 4QT

Tel: +44 1202 723 585

CHINA

Mycronic Co., Ltd.

Unit 106, E Block

Lane 168, Da Duhe Road.

Putuo District, 200062

Shanghai P.R. China

Tel: +86 21 3252 3785/86

JAPAN

Mycronic Technologies KK

KDX Chofu Bldg. 7th ﬂoor

1-18-1 Chofugaoka,

Chofu-shi

Tokyo 182-0021

Japan

Tel: +81 42 433 9400

USA

Mycronic Inc.

554 Clark Road

Tewksbury

MA 01C876-1731

USA

Tel: +1 978 495 9799

MYCRONIC.COM