2026 Ersa-Electronics-Production-Overview.pdf - 第14页
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HOTFLOW ONE
REFLOW SOLDERING
models for the reflow process. More than
40 years of experience and expertise
in reflow soldering technology shape
the development of our solutions. High
thermal performance, a good cross-pro
-
file, and optimum zone separation ensure
HOTFLOW ONE:
The HOTFLOW ONE reflow soldering
system offers excellent value for money
and features a well-designed system
layout. These are the new entry-level
excellent soldering results. The HOTFLOW
ONE is available with 14 heating modules
and a process zone of 3.35 m or with
20 heating modules and 4.84 m process
length.
EXOS 10/26 convection reflow
soldering system with vacuum module
heating circuit in the vacuum chamber and
four cooling zones, the EXOS achieves a
reduction in void rate of up to 99% in the
peak zone thanks to a negative pressure of
up to 10 mbar. The conveyor system is
divided into four segments. Infeed, pre-
heating and peak zone, vacuum module,
EXOS 10/26: Low-void
reflow soldering with vacuum
EXOS 10/26 is a powerful vacuum reflow
soldering system for extremely low-void
connections in electronics manufactur
-
ing. Equipped with eleven heating zones,
and cooling zone each have their own indi
-
vidually controllable conveyor, which does
not require any lubricant in the vacuum
section. The EXOS 10/26 requires very low
maintenance and can be intuitively operated
and controlled via the software.
Lubricant-free roller conveyor in the vacuum moduleBefore/after comparison: more than 99% reduction
in voids
Integrated, easily accessible vacuum module
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SURFACE-MOUNT TECHNOLOGY
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REWORK
Rework Systems
Automated rework precision for best results
High-precision axis system and
high-resolution cameras
Automated component placement,
soldering and desoldering processes
High-performance hybrid heating
head with two heating zones
Process monitoring with Reflow
Process Camera
Powerful large-area IR bottom
heating in six zones
Three K-type thermocouple inputs
for AccuTC sensor
Effective assembly cooling
with compressed air
Optional residual solder removal
with Auto Scavenger
(also retrofittable)
Optional Dip & Print Station
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SURFACE-MOUNT TECHNOLOGY
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