2026 Ersa-Electronics-Production-Overview.pdf - 第16页

REWORK residual sol der removal and non-contac t temperatur e monitoring. Th e HR 6 00 P i s av aila ble i n dif f er ent ver si on s, e.g . wi th a l arg e P CB h ol der for l ar ger a ss em bli es or w it h a lo wer e …

REWORK

Rework Systems

Automated rework precision for best results

 High-precision axis system and

high-resolution cameras

 Automated component placement,

soldering and desoldering processes

 High-performance hybrid heating

head with two heating zones

 Process monitoring with Reflow

Process Camera

 Powerful large-area IR bottom

heating in six zones

 Three K-type thermocouple inputs

for AccuTC sensor

 Effective assembly cooling

with compressed air

 Optional residual solder removal

with Auto Scavenger

(also retrofittable)

 Optional Dip & Print Station

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SURFACE-MOUNT TECHNOLOGY

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REWORK

residual solder removal and non-contact

temperature monitoring.

The HR 600 P is available in different

versions, e.g. with a large PCB holder

for larger assemblies or with a lowered

heating cassette for additional space for

tall structures.

HR 600 P – automated

rework precision

The HR 600 P hybrid rework system focuses

on precision and automation, as it is

particularly suitable for SMD components

with very fine grids and reliably process

es small SMT components and BGAs up

to a size of 60 x 60 mm. The automatic

soldering and placement processes are

supplemented by automatic, non-contact

HR 600/2

HR 600P

HR 600/2 – universal & automated

rework

With the HR 600/2 hybrid rework system,

almost all high-pin-count component

types on modern assemblies can be pro

cessed reliably and automatically. Lifting,

placing, and defined setting down of com

ponents, as well as the soldering process,

are core competencies of this universal

rework system.

HR 500

Further members of the

Rework family

Further Kurtz Ersa rework systems impress

with technologically interesting solutions

in heating and placement technology and

expand the range of options for users. The

HR 500 offers full Kurtz Ersa hybrid rework

technology for budget-oriented users. The

little brother of the HR 550 allows flexible

HR 550 XLHR 550

Further information:

repairs of standard assemblies of up to

380 x 300 mm and 50 x 50 mm component

size. For a very wide range of applications

and sufficient performance reserves, there

is the best-selling HR 550: semi-automat

ic rework processes in no time at all for

assemblies sizing up to 520 x 360 mm and

components of 70 x 70 mm in! The portfolio

of semi-automatic devices is rounded off

with the HR 550 XL – a real powerhouse for

large assemblies measuring up to approx.

530 x 610 mm with IR bottom heating in

eight zones, motorized x/y fine adjustment,

and component rotation. It is suitable for

industrial and power electronics as well as

large-format circuit boards

and is particularly attractive

for service providers.

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REWORK

printed circuit boards. With an active

heating surface of 625 × 625 mm

(24 × 24 inches) and a maximum PCB

thickness of 10 mm, it is ideal for tele-

communications, network technology, IT,

and AI infrastructure.

HR 600 XL - Automated

Rework in X(X)L

The HR 600 XL is designed for the

professional rework of BTC (bottom-ter-

minated components) using selective re-

flow soldering processes on large-format

Processing of giant components

Four different heating heads are available

for the largest Kurtz Ersa rework system,

which can process components with an

edge length of up to 160 x 160 mm. The

“Click to Place” feature integrated into

the software, together with a high-reso

lution camera, ensures fast and error-free

component placement.

Placement result of a BGA 7400, edge length

134 x 134 mm, with overlay of X-ray inspection result

Large-format BGA under the XXL heating head

Automatic residual solder removal

The integrated AUTO SCAVENGER

removes residual solder remaining on

the circuit board after desoldering in

a non-contact and gentle automated

process. For optimal suction results, the

parameters can be individually adjusted to

the application.

Cleaned pads with less than 20 μm of residue

(3D image)

Removal of residual solder

Highlights

High-performance hybrid

heating heads from 60 x 60 mm

to 160 x 160 mm, 800 to 4,800 W

IR Matrix™ bottom heater (25

elements), 15 kW, expandable

Process monitoring with up to

8 thermocouples

Precise component alignment

via image processing

Motorized axis system for com-

ponent placement (± 0.025 mm)

Residual solder removal via

integrated AUTO SCAVENGER

User-independent, reproducible

rework results guaranteed

Process control and

documentation via HR Soft 2

Fully or semi-automatic operation

Optional Dip&Print Station

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SURFACE-MOUNT TECHNOLOGY