2026 Ersa-Electronics-Production-Overview.pdf - 第17页
REWORK pr inte d cir cu it bo ar ds . W ith a n act i ve he atin g sur face of 6 25 × 6 2 5 mm (24 × 24 inc he s ) and a m a xim um P C B th ick ne ss o f 10 mm, it i s ide al f or te le - communications, netw ork techno…
REWORK
residual solder removal and non-contact
temperature monitoring.
The HR 600 P is available in different
versions, e.g. with a large PCB holder
for larger assemblies or with a lowered
heating cassette for additional space for
tall structures.
HR 600 P – automated
rework precision
The HR 600 P hybrid rework system focuses
on precision and automation, as it is
particularly suitable for SMD components
with very fine grids and reliably process
-
es small SMT components and BGAs up
to a size of 60 x 60 mm. The automatic
soldering and placement processes are
supplemented by automatic, non-contact
HR 600/2
HR 600P
HR 600/2 – universal & automated
rework
With the HR 600/2 hybrid rework system,
almost all high-pin-count component
types on modern assemblies can be pro
-
cessed reliably and automatically. Lifting,
placing, and defined setting down of com
-
ponents, as well as the soldering process,
are core competencies of this universal
rework system.
HR 500
Further members of the
Rework family
Further Kurtz Ersa rework systems impress
with technologically interesting solutions
in heating and placement technology and
expand the range of options for users. The
HR 500 offers full Kurtz Ersa hybrid rework
technology for budget-oriented users. The
little brother of the HR 550 allows flexible
HR 550 XLHR 550
Further information:
repairs of standard assemblies of up to
380 x 300 mm and 50 x 50 mm component
size. For a very wide range of applications
and sufficient performance reserves, there
is the best-selling HR 550: semi-automat
-
ic rework processes in no time at all for
assemblies sizing up to 520 x 360 mm and
components of 70 x 70 mm in! The portfolio
of semi-automatic devices is rounded off
with the HR 550 XL – a real powerhouse for
large assemblies measuring up to approx.
530 x 610 mm with IR bottom heating in
eight zones, motorized x/y fine adjustment,
and component rotation. It is suitable for
industrial and power electronics as well as
large-format circuit boards
and is particularly attractive
for service providers.
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REWORK
printed circuit boards. With an active
heating surface of 625 × 625 mm
(24 × 24 inches) and a maximum PCB
thickness of 10 mm, it is ideal for tele-
communications, network technology, IT,
and AI infrastructure.
HR 600 XL - Automated
Rework in X(X)L
The HR 600 XL is designed for the
professional rework of BTC (bottom-ter-
minated components) using selective re-
flow soldering processes on large-format
Processing of giant components
Four different heating heads are available
for the largest Kurtz Ersa rework system,
which can process components with an
edge length of up to 160 x 160 mm. The
“Click to Place” feature integrated into
the software, together with a high-reso
-
lution camera, ensures fast and error-free
component placement.
Placement result of a BGA 7400, edge length
134 x 134 mm, with overlay of X-ray inspection result
Large-format BGA under the XXL heating head
Automatic residual solder removal
The integrated AUTO SCAVENGER
removes residual solder remaining on
the circuit board after desoldering in
a non-contact and gentle automated
process. For optimal suction results, the
parameters can be individually adjusted to
the application.
Cleaned pads with less than 20 μm of residue
(3D image)
Removal of residual solder
Highlights
n
High-performance hybrid
heating heads from 60 x 60 mm
to 160 x 160 mm, 800 to 4,800 W
n
IR Matrix™ bottom heater (25
elements), 15 kW, expandable
n
Process monitoring with up to
8 thermocouples
n
Precise component alignment
via image processing
n
Motorized axis system for com-
ponent placement (± 0.025 mm)
n
Residual solder removal via
integrated AUTO SCAVENGER
n
User-independent, reproducible
rework results guaranteed
n
Process control and
documentation via HR Soft 2
n
Fully or semi-automatic operation
n
Optional Dip&Print Station
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SURFACE-MOUNT TECHNOLOGY
i-CON 1C MK2 Robot Ready
Hand soldering meets automation
Simple, reliable integration in robotic
environments
Safe, reproducible soldering processes
Safe tip exchange within
record time due to Tip'n'Turn
Fast heat-up/reheat
Up to 20 % more performance
The i-CON 1C MK2 ROBOT READY automates
manual soldering processes and can be
flexibly integrated into robotic systems.
Poka-Yoke prevents assembly defects, and
the tool-free tip change using the Tip’n’Turn
principle minimizes downtime. QR codes
enable automated identification.
i-TIP CLEANER
Tip cleaning in record time.
The i-TIP CLEANER removes solder, flux, and oxide residues in less than a second - quickly
and gently. This ensures consistently high soldering quality, increased process reliability,
longer service life for soldering and desoldering tips, and thereby increases productivity.
NEW
Increases productivity
Improves soldering quality
Extends tip life
Automatic activation
Easy maintenance
Further
information:
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