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IPC-T -50F Terms and Definitions for Interconnecting and Packaging Electronic Circuits Developed by the T erms and Definitions Committee (2-30) of the Institute for Interconnecting and Packaging Electronic Circuits Users …

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The Principles of
Standardization
In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice
IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the Terms and Definitions
Committee (2-30) of the Institute for Interconnecting and Packaging
Electronic Circuits.
Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher. 1996
IPC-T-50F
Terms and Definitions
for Interconnecting and
Packaging Electronic
Circuits
Developed by the Terms and Definitions Committee (2-30) of the Institute
for Interconnecting and Packaging Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
T
HE
I
NSTITUTE FOR
I
NTERCONNECTING
AND
P
ACKAGING
E
LECTRONIC
C
IRCUITS
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the
Terms and Definitions Committee are shown below, it is not possible to include all of those who assisted in the evolution of this
Standard. To each of them, the members of the IPC extend their gratitude.
Terms & Definitions Committee
Richard R. Douglas
Chairman
Douglas & Associates
Ron Underwood
Technical Liaison of the Board of Directors
Circuit Center
Committee Members
Masamitsu Aoki...........................Toshiba Chemical Corporation
Robert Blanchette........................................................U.S. Navy
John P. Caputo........................................... Raytheon Company
Linda Cartwright....................... Compaq Computer Corporation
Alan Cash................................................. Northrop Corporation
James Cordum ........................................... Teledyne Lewisburg
Francis J. Dance......................................... Burndy Corporation
Alfred C. Dentino ................................................. Acton Division
Richard R. Douglas................................. Douglas & Associates
Howard S. Feldmesser...................... Johns Hopkins University
Joe R. Felty........................................... Texas Instruments, Inc.
Karen Flewharty.................................... Texas Instruments, Inc.
Robert N. Garabedian...................... Printed Circuit Corporation
Gerald Ginsberg............................ Component Data Associates
William G. Hali ..............................................E&SCorporation
Ralph J. Hersey ........ Lawrence Livermore National Laboratory
David D. Hillman ..................................... Rockwell International
Les Hymes................................................... Plexus Corporation
Larry P. Knowles................................... Librascope Corporation
Nicholas J. Lester........... Comargus Information Service (USA)
William E. Loeb.......................... Loeb/Henderson & Associates
Kosaku Maeda ............................................ Mec Company, Ltd.
James F. Maguire ................... Boeing Aerospace & Electronics
George Messner....... AMP-AKZO Corporation/PCK Technology
James H. Moffitt......................................................... U.S. Navy
Michael S. Morris ....................................................... U.S. Navy
John H. Morton................................................. IBM Corporation
Robert Parker......................... University of Southern California
William Reid...................................................... I-Con Industries
Robert S. Reylek.................................................. 3 M Company
Bruce C. Rietdorf....... Magnavox Electronic Systems Company
David E. Robertson.................................................... Pace, Inc.
Jerald G. Rosser............................... Hughes Aircraft Company
Don W. Rumps ................................ AT&T Technology Systems
Mark A. Savrin........................... Kulicke & Soffa Industries, Inc.
Donald P. Schnorr............................ General Electric Company
Laura Scholten.................................................... Optrotech, Inc.
Jack Semenik........................................ Allen-Bradley Company
Rick Smedley ........................................ Texas Instruments, Inc.
Norbert Socolowski........................................ Alpha Metals, Inc.
Lutz Treutler...................... Fachverband Elektronik Design e.V.
Ron Underwood............................................ Circuit Center, Inc.
IPC-T-50F June 1996
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