IPC-T-50F_.pdf.pdf - 第92页
22.0462 External Layer 22.0488 Feature 22.0493 Fiducial Mark 22.0505 Fingers 22.0537 Flush Conductor 22.0548 Footprint 22.0549 Form 22.0559 Gauge Precision 22.0568 Geometric T olerance 22.1812 Grid 22.1414 Ground Plane C…
21.0605 High-Impedance State
21.1801 Impedance
21.1802 Inductance
21.1423 Instrument Bus
21.1425 Insulation Resistance
21.0699 Leakage Current
21.0711 Line Coupling
21.0713 Load Capacitance
21.0721 Logic
21.1440 Logic Diagram
21.1441 Logic Family
21.0726 Loss Tangent
21.0761 Microstrip
21.0762 Microwave Integrated Circuit
21.1451 Minimum Electrical Spacing
21.0795 Near-End Crosstalk
21.1177 Net
21.1178 Net List
21.1180 Node
21.1190 Normal-Mode Rejection (NMR)
21.0814 Open Circuit Potential
21.1803 Permeability
21.0846 Permittivity
21.0893 Power Dissipation
21.0894 Power Factor
21.1804 Power Plane Inductance
21.1493 Propagation Delay
21.1494 Pulse, Electronic Signal
21.1499 Reflection, Signal
21.1805 Resistance
21.1259 Rise Time
21.1300 Shield (n.)
21.1527 Shielding, Electronic
21.0932 Signal
21.0946 Skin Effect
21.1006 Spurious Signal
21.1028 Stripline
21.1030 Stub
21.1206 Subnet
21.1037 Surge
21.1065 Thermal Coefficient of Expansion (TCE)
21.1084 Threshold
21.1102 Transmission Cable
21.1103 Transmission Line
21.1105 Tri-State
21.1551 Truth-Table Testing
21.1556 Unbalanced Transmission Line
21.1143 Volume Resistivity
21.1776 Wave Length Spectrum
21.1151 Waveguide
21.1171 Wiring Elementary
22 Printed Board and Printed Board Assembly Design
22.0030 Alignment Mark
22.1325 Anchoring Spur
22.0040 Annotation
22.0049 Array
22.0051 Artwork
22.0029 Automatic Component Placement
22.0124 Automatic Conductor Routing
22.0071 Back-Bared Land
22.0076 Background (Artwork)
22.1604 Base Material Thickness
22.0115 Blind Via
22.0119 Board Thickness
22.0142 Border Area
22.0143 Border Data
22.0144 Boss
22.0163 Buried Via
22.0178 Card-Edge Connector
22.0179 Card-Insertion Connector
22.1346 Center-to-Center Spacing
22.0215 Circuitry Layer
22.1811 Clearance Hole
22.0223 Coined Lead
22.0227 Comb Pattern
22.0237 Component Density
22.1357 Component Mounting Orientation
22.0241 Component Side
22.1359 Computer-Aided Design (CAD)
22.1362 Conductive Pattern
22.0251 Conductor
22.0848 Conductor Layer
22.0256 Conductor Line
22.0257 Conductor Path
22.0258 Conductor Pattern
22.0259 Conductor Side
22.1707 Conductor Thickness
22.0261 Conductor Track
22.0269 Connector Area
22.0270 Connector Contact
22.0266 Connector, One-Part
22.0267 Connector, Two-Part
22.0276 Contact Area
22.0281 Contact Spacing
22.0287 Control Drawing
22.0297 Corner Marks
22.0323 Crop Marks
22.0325 Crosshatching
22.1372 Crossing Count
22.1373 Cumulative Tolerance
22.0344 Datum
22.0345 Datum Feature
22.0346 Datum Reference
22.0360 Dependent of Feature Size
22.0363 Design Rule
22.0362 Design-Rule Checking
22.0364 Design Spacing of Conductors
22.0365 Design Width of Conductors
22.0382 Dimensioned Hole
22.0388 Direct Dimensioning
22.0399 Don’t-Care Area
22.0419 Edge Spacing
22.0413 Edge-Board Contact(s)
22.0414 Edge-to-Edge Spacing
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22.0462 External Layer
22.0488 Feature
22.0493 Fiducial Mark
22.0505 Fingers
22.0537 Flush Conductor
22.0548 Footprint
22.0549 Form
22.0559 Gauge Precision
22.0568 Geometric Tolerance
22.1812 Grid
22.1414 Ground Plane Clearance
22.0595 Heatsink Plane
22.0610 Hole Density
22.0611 Hole Location
22.1621 Hole Pattern
22.0639 Independent of Size
22.0640 Index Edge
22.0641 Index Edge Marker
22.0642 Indexing Hole
22.0643 Indexing Notch
22.0644 Indexing Slot
22.1427 Innerlayer Connection
22.0654 Interfacial Connection
22.1614 Interlayer Connection
22.0658 Internal Layer
22.0659 Interstitial Via
22.1432 Keying Slot
22.1622 Land
22.0678 Land Pattern
22.0677 Landless Hole
22.1624 Layer
22.0686 Layer-to-Layer Spacing
22.0695 Lead Mounting Hole
22.0701 Least Material Condition (LMC)
22.1439 Legend
22.0745 Master Line
22.0747 Maximum Material Condition (MMC)
22.1756 Metalized Land Areas
22.0766 Minimum Annular Ring
22.0765 Minimum Annular Width
22.1184 Nonconductive Pattern
22.1453 Nonfunctional Interfacial Connection
22.1185 Nonfunctional Land
22.1186 Nonfunctional Terminal Area
22.0805 Offset Land
22.0806 Offset Terminal Area
22.0828 Parallel Pair
22.0862 Pilot Hole
22.1473 Pitch
22.1475 Plated-Through Hole (PTH)
22.0882 Polarizing Slot
22.0887 Positional Tolerance
22.0897 Power Plane
22.1484 Primary Side
22.0915 Printed Contact
22.0916 Printed Edge-Board Contact
22.1216 Quasi-Interfacial Connection
22.1201 Quasi-Interfacial Plated-Through Hole
22.1316 Reduction Marks
22.1232 Reference Edge
22.1233 Reference Hole
22.1236 Regardless of Feature Size
22.1315 Registration Mark
22.1264 Router (CAD)
22.1267 Rubber Banding
22.1517 Secondary Side
22.0934 Signal Conductor
22.0935 Signal Line
22.0936 Signal Plane
22.0977 Solder Resist Aperture
22.0978 Solder Side
22.0990 Spacing
22.0994 Span
22.1211 Supported Hole
22.1042 Tab
22.1052 Terminal Area
22.1053 Terminal Clearance Hole
22.1054 Terminal Hole
22.1055 Terminal Pad
22.1773 Terminations
22.1068 Thermal Relief
22.1086 Through Connections
22.1547 Tooling Feature
22.1094 Tooling Hole
22.1098 Trace
22.1099 Track
22.1106 Trim Lines (Pattern)
22.1550 Trim Lines (Printed Board)
22.1110 True Position
22.1111 True Position Tolerance
22.1129 Unsupported Hole
22.1562 Via
22.1563 Voltage Plane
22.1141 Voltage-Plane Clearance
24 Phototool Generation and Photographic Processes
24.0052 Artwork Master
24.0078 Backlighting
24.0150 Brightness
24.1347 Characteristic Curve
24.1355 Color Temperature
24.0230 Compensated Artwork
24.1792 Composite Test Pattern (CTP)
24.0242 Composite (Phototool)
24.1366 Contact Printing
24.1369 Cosine Law (Illumination)
24.0334 Cut-and-Peel
24.0335 Cut-and-Strip
24.0347 D Curve
24.0350 Definition (Phototool)
24.0356 Densitometer
24.0357 Density (Phototool)
24.0361 Depth of Field (Optical)
24.0368 Developing (Phototool)
24.0371 Diazo Material
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24.0420 Effective Color Temperature
24.0421 Effective Focal Length
24.0633 Illuminance
24.0634 Illumination
24.1791 Individual Test Pattern (IDP)
24.0727 Luminance
24.0728 Luminous Energy
24.0729 Luminous Flux
24.0746 Master Pattern
24.0768 Mirrored Pattern
24.0776 Molecular Dye-Imaging Material
24.1643 Multiple Image Production Master
24.1645 Multiple Pattern
24.0797 Negative (n.)
24.1639 Negative Pattern
24.0811 Opacity
24.1456 Opaquer
24.1195 Optical Image
24.1197 Orthochromatic Emulsion
24.0825 Panchromatic Emulsion
24.1470 Photographic Fog
24.0456 Photographic Image
24.0851 Photographic Operation
24.0852 Photographic Plate
24.0853 Photomaster
24.0854 Photometry
24.0855 Photoplotting
24.0858 Phototool
24.0859 Phototooling
24.0860 Phototooling Aid
24.0864 Pinhole (Phototool)
24.0879 Plotting
24.0888 Positive (n.)
24.0896 Power of Source
24.1642 Production Master
24.1308 Radiometry
24.1234 Reference Master
24.1237 Registered Production Master
24.1243 Render True Color
24.1509 Resolving Power
24.1252 Reversal Development
24.1257 Right Reading
24.1512 Right Reading Down
24.1513 Right Reading Up
24.1270 Runout
24.1205 Scribe Coat
24.1279 Scribing
24.1523 Shadowless Illumination
24.0941 Single-Image Production Master
24.0955 Solarization
24.1004 Spur
24.1537 Step Scale
24.1020 Step Wedge
24.1018 Step-and-Repeat
24.1040 System Effective Color Temperature
24.1104 Transmittance
24.1173 Working Master
25 Electronic Production Data Generation
25.1729 Alphanumerical
25.1329 Automatic Dimensioning
25.0228 Comment Record
25.1358 Composite Record
25.1361 Computer-Aided Manufacturing (CAM)
25.0246 Conditional End-of-Test
25.0254 Conductor Layer No. 1
25.0340 Data Capture
25.0342 Data Layer
25.0337 Data-Entry Device
25.0338 Data-Information Module (DIM)
25.0381 Digitizing (CAD)
25.0398 Distributed Numerical Control (DNC)
25.0490 Feature-Location Record
25.1411 Gerber Data
25.0664 Job Set
25.0716 Local Intelligence
25.0735 Manhattan Distance
25.0736 Manual Data Input
25.0773 Modal Form
25.1176 Nesting
25.1193 Numerical Control (NC)
25.0801 Object Code
25.0829 Parameter Record
25.0867 Pixel
25.0891 Postprocessing
25.1482 Postprocessor
25.1263 Rotational Error
25.1265 Routing Mark
26 Technical Documentation
26.1328 Assembly Drawing
26.0086 Baseline Dimensioning
26.1335 Basic Dimension
26.1778 Basic Specification (BS)
26.1780 Capability Detail Specification (CapDS)
26.0192 Chain Dimensioning
26.1779 Customer Detail Specification (CDS)
26.1740 Detail Specification
26.1781 Detailed Specification (DS)
26.0404 Drafting Image
26.0434 Elementary Diagram
26.0444 Engineering Drawing
26.1782 Generic Specification (GS)
26.1634 Manufacturing Drawing
26.0743 Master Dot Pattern
26.0744 Master Drawing
26.0826 Panel Drawing
26.1486 Printed Board Assembly Drawing
26.1231 Reference Dimension
26.1260 Roadmap
26.1107 Schematic Diagram
26.1783 Sectional Specification (SS)
26.1532 Specification Drawings
26.1091 Tolerance
26.1092 Toleranced Dimension
26.1175 X Axis
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