IPC-T-50F_.pdf.pdf - 第94页
26.1303 Y Axis 26.1809 Z Axis 29 Other (Engineering and Design Issues) 29.0034 Ambient 3 Components for Electronic Packaging 30 General (Component Description Issues) 30.0016 Active Device 30.0019 Add-On Component 30.023…
24.0420 Effective Color Temperature
24.0421 Effective Focal Length
24.0633 Illuminance
24.0634 Illumination
24.1791 Individual Test Pattern (IDP)
24.0727 Luminance
24.0728 Luminous Energy
24.0729 Luminous Flux
24.0746 Master Pattern
24.0768 Mirrored Pattern
24.0776 Molecular Dye-Imaging Material
24.1643 Multiple Image Production Master
24.1645 Multiple Pattern
24.0797 Negative (n.)
24.1639 Negative Pattern
24.0811 Opacity
24.1456 Opaquer
24.1195 Optical Image
24.1197 Orthochromatic Emulsion
24.0825 Panchromatic Emulsion
24.1470 Photographic Fog
24.0456 Photographic Image
24.0851 Photographic Operation
24.0852 Photographic Plate
24.0853 Photomaster
24.0854 Photometry
24.0855 Photoplotting
24.0858 Phototool
24.0859 Phototooling
24.0860 Phototooling Aid
24.0864 Pinhole (Phototool)
24.0879 Plotting
24.0888 Positive (n.)
24.0896 Power of Source
24.1642 Production Master
24.1308 Radiometry
24.1234 Reference Master
24.1237 Registered Production Master
24.1243 Render True Color
24.1509 Resolving Power
24.1252 Reversal Development
24.1257 Right Reading
24.1512 Right Reading Down
24.1513 Right Reading Up
24.1270 Runout
24.1205 Scribe Coat
24.1279 Scribing
24.1523 Shadowless Illumination
24.0941 Single-Image Production Master
24.0955 Solarization
24.1004 Spur
24.1537 Step Scale
24.1020 Step Wedge
24.1018 Step-and-Repeat
24.1040 System Effective Color Temperature
24.1104 Transmittance
24.1173 Working Master
25 Electronic Production Data Generation
25.1729 Alphanumerical
25.1329 Automatic Dimensioning
25.0228 Comment Record
25.1358 Composite Record
25.1361 Computer-Aided Manufacturing (CAM)
25.0246 Conditional End-of-Test
25.0254 Conductor Layer No. 1
25.0340 Data Capture
25.0342 Data Layer
25.0337 Data-Entry Device
25.0338 Data-Information Module (DIM)
25.0381 Digitizing (CAD)
25.0398 Distributed Numerical Control (DNC)
25.0490 Feature-Location Record
25.1411 Gerber Data
25.0664 Job Set
25.0716 Local Intelligence
25.0735 Manhattan Distance
25.0736 Manual Data Input
25.0773 Modal Form
25.1176 Nesting
25.1193 Numerical Control (NC)
25.0801 Object Code
25.0829 Parameter Record
25.0867 Pixel
25.0891 Postprocessing
25.1482 Postprocessor
25.1263 Rotational Error
25.1265 Routing Mark
26 Technical Documentation
26.1328 Assembly Drawing
26.0086 Baseline Dimensioning
26.1335 Basic Dimension
26.1778 Basic Specification (BS)
26.1780 Capability Detail Specification (CapDS)
26.0192 Chain Dimensioning
26.1779 Customer Detail Specification (CDS)
26.1740 Detail Specification
26.1781 Detailed Specification (DS)
26.0404 Drafting Image
26.0434 Elementary Diagram
26.0444 Engineering Drawing
26.1782 Generic Specification (GS)
26.1634 Manufacturing Drawing
26.0743 Master Dot Pattern
26.0744 Master Drawing
26.0826 Panel Drawing
26.1486 Printed Board Assembly Drawing
26.1231 Reference Dimension
26.1260 Roadmap
26.1107 Schematic Diagram
26.1783 Sectional Specification (SS)
26.1532 Specification Drawings
26.1091 Tolerance
26.1092 Toleranced Dimension
26.1175 X Axis
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26.1303 Y Axis
26.1809 Z Axis
29 Other (Engineering and Design Issues)
29.0034 Ambient
3 Components for Electronic Packaging
30 General (Component Description Issues)
30.0016 Active Device
30.0019 Add-On Component
30.0236 Component
30.1356 Component Lead
30.0240 Component Pin
30.1735 Component Thermal Masses
30.1737 Cubic Components
30.1738 Cylindrical Components
30.1739 Date Code
30.0369 Device
30.0392 Discrete Component
30.0436 Embedded Component
30.0594 Heatsink
30.1426 Integrated Circuit
30.0681 Large-Scale Integration (LSI)
30.1754 Leadless Component
30.0757 Microcircuit
30.0758 Microcomponents
30.0759 Microelectronics
30.0777 Monolithic Integrated Circuit
30.1460 Package
30.0821 Package Cap
30.0053 Package Cover
30.0822 Package Lid
30.1468 Passive Component (Element)
30.0844 Perimeter Sealing Area
30.0872 Plastic Device
30.1289 Semiconductor
30.1520 Separable Component Part
30.1031 Stud-Mount Termination
30.1772 Surface Mounting Device (SMD)
30.1034 Surface-Mount Component (SMC)
30.1069 Thermal Shunt
30.1559 Very Large-Scale Integration (VLSI)
31 Discrete & IC Through-Hole Component Packages
31.0067 Axial Lead
31.1387 Dual-Inline Package
31.1224 Leaded Chip Carrier
31.1273 Sacrificial-Foil Laminate
31.0942 Single-Inline Package (SIP)
32 Discrete Surface Mount Component Packages
32.0984 Solid-Tantalum Chip Component
33 I/C Package Types for Surface Mounting
33.0100 Beam Lead
33.0098 Beam-Lead Device
33.0182 Castellation
33.0208 Chip Carrier
33.0295 Coplanar Leads
33.0523 Flat Pack
33.1435 Leaded Surface-Mount Component
33.1436 Leadless Chip Carrier
33.0694 Leadless Device
33.1437 Leadless Inverted Device
33.1438 Leadless Surface-Mount Component
33.0869 Planar-Mount Device
35 Bare Die
35.0151 Broken Pick
35.0205 Chip
35.0373 Dice
35.0375 Die
35.0400 Doping
35.0666 Junction Temperature
35.0949 Slice
35.1122 Uncased Device
35.1145 Wafer
36 Component and Lead/Termination Properties
36.0006 Accordion Contact
36.0017 Active Metal
36.0075 Backfill
36.1337 Bellows Contact
36.1810 Bifurcated Contact
36.1732 Butt Leads
36.1345 Carrier Tape
36.0243 Compression Seal
36.1741 Dissolution of Metalization
36.0424 Elastomeric Connector
36.1747 Gull Wing Leads
36.0590 Header (Module)
36.1752 J-Leads
36.0688 Lead
36.0696 Lead Pin
36.0698 Lead Wire
36.0785 Multilayer Carrier Tape
36.0807 Omnibus Ring
36.1764 Rectangular Leads
36.1528 Single-Layer Carrier Tape
36.1025 Stress Relief
36.1033 Support Ring
36.1546 Three-Layer Carrier Tape
36.1554 Two-Layer Carrier Tape
36.1164 Window (Carrier Tape)
37 Components for Wiring and Cabling
37.0106 Bifurcated Solder Terminal
37.1338 Birdcage
37.0145 Boss (Connector)
37.0169 Bus Bar
37.0203 Chemical Wire Stripping
37.0218 Closed-Entry Contact
37.0220 Coaxial Cable
37.0265 Connector
37.0271 Connector Housing
37.0272 Connector Tang
37.0268 Connector, Two-Part, Printed Board
37.0282 Contact Spring
37.0318 Crimp Contact
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37.0329 Cup Solder Terminal
37.0405 Drain Wire
37.0412 Edge-Board Connector
37.0466 Eyelet
37.0486 FCC System
37.0518 Fixed Contact
37.0522 Flat Cable
37.0533 Floating Bushing
37.1405 Fork Contact
37.0583 Guide Pin
37.0588 Haywire
37.0589 Header (Connector)
37.0602 Hermaphroditic Contact
37.0606 High-Voltage Wire
37.0619 Hook Solder Terminal
37.1420 Insert (Connector)
37.0653 Interface resistance
37.0665 Jumper Wire
37.0668 Key
37.1430 Keying (n.)
37.1431 Keying (v.)
37.0669 Keyway
37.0683 Latch (Connector)
37.0731 Machined Contact
37.0739 Margin (Flat Cable)
37.0809 One-Piece Connector
37.0813 Open-Entry Contact
37.1469 Perforated (Pierced) Solder Terminal
37.0880 Plug Connector
37.0889 Post
37.0905 Pressfit Contact
37.1313 Receptacle Connector
37.1242 Removable Contact
37.1255 Ribbon Cable
37.1256 Ribbon Interconnect (n.)
37.1239 Scoop-Proof Connectors
37.1299 Sheet-Metal Contact
37.0954 Socket Contact
37.0980 Solder Terminal
37.0992 Spade Contact
37.1014 Standoff Solder Terminal
37.1023 Strain Relief (connector)
37.1051 Terminal
37.1552 Turret Solder Terminal
37.1115 Two-Piece Contact
37.1167 Wiping Action
37.1567 Wire Stripping
4 Materials for Electronic Packaging
40 General (Material Issues)
40.0035 Amorphous Polymer
40.1727 Absorption Coefficients
40.1334 Base Material
40.0091 Basis Material
40.0183 Catalyst (Resin)
40.0221 Coefficient of Thermal Expansion
40.0250 Conductivity (Electrical)
40.0316 Creep
40.0326 Crosslink
40.0328 Crystalline Polymer
40.0377 Dielectric
40.0383 Dimorphism
40.1800 Flat Conductor
40.1813 Insulator
40.0870 Plastic
40.0871 Plastic Deformation
40.1479 Polymer
40.0884 Polymerize
40.1246 Resin
40.1071 Thermoplastic
40.1544 Thermoset
41 Rigid Printed Board Substrate Materials (Organic)
41.1320 Adhesive-Coated Catalyzed Laminate
41.1323 Adhesive-Coated Uncatalyzed Laminate
41.1343 B-Stage
41.0069 B-Staged Material
41.0070 B-Staged Resin
41.0111 Bismaleimide
41.0112 Bismaleimide Triazine
41.1339 Blank
41.0114 Blends
41.0152 Brominated Epoxy
41.0170 Butter Coat
41.0171 C-Staged Resin
41.0374 Dicyanidiamide
41.0393 Dispersant (Organosol)
41.0394 Disperse Phase (Suspension)
41.0395 Dispersing Agent
41.1743 Epoxy Glass Substrate
41.0445 Epoxy Novolac
41.0555 Functionality, Resin or Curing Agent
41.0673 Laminate Thickness
41.1609 Metal-Clad Base Material
41.0752 Metal-Clad Laminate
41.0819 Oxide Transfer
41.1463 Panel
41.0903 Preimpregnated Bonding Sheet
41.0904 Prepreg
41.1505 Resin-Rich Area
41.1507 Resin-Starved Area
41.1207 Substrate
41.1142 Volume Ratio (Composite)
42 Flexible Printed Board Substrate Materials (Org.)
42.0303 Cover Coat
42.0304 Cover Lay (Flexible Circuit)
42.0305 Cover Layer
43 Inorganic Substrates for Interconnecting Structures
43.1730 Alumina Substrate
44 Reinforcement/Constraining Core/Heat Dissipation
Materials
44.0045 Aramid
44.0099 Beaming
44.0105 Bias (Fabric)
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