Spec of AX-3 AX-5 June 2005 LR.pdf - 第5页
Assembléon's component pick-and-place platform definitely sets the standard for the way electronics manufacturers in the medium to high volume throughput range will be acquiring SMT production capacity over the next…
3.4 Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.1 Board traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.4.2 Batch traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.5 AX Data interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6 Remote diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7 CAD Conversion / Machine Program Creation (PPS-Pro) . . . . . . 25
4.0 Technical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.1 Configurable placement output . . . . . . . . . . . . . . . . . . . . . . . . 27
4.2 Placement specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3 Components and packaging . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.4 PCB specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.5 Installation requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.0 AX-3 / AX-5 System Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Contents
2 of 34
Contents
Assembléon's component pick-and-place platform definitely sets the standard for
the way electronics manufacturers in the medium to high volume throughput range
will be acquiring SMT production capacity over the next decade.
The new AX Platform anticipates the requirements of SMT manufacturers with a
unique True-modularity™ concept which delivers low-cost entry, product
changeovers in minutes, output reconfiguration right from 30k cph (IPC 9850), and
the lowest cost per placement in the market.
With CCD component alignment technology added to proven 'on the fly' laser
alignment for optimal chip placement, the AX platform can place a full range of
components. Its configuration is optimized for each new production batch without
the need for changing the machine.
The AX handles chips from 01005 up to IC packages, such as QFP, BGA and CSP,
with dimensions up to 45 x 45mm. Only for the most challenging components, just
add the AQ-2 in-line to place fragile flip-chip or snap-in connectors requiring high
placement force.
Built on 24 years of pick-and-place experience in modular manufacturing, the
A-series platform solution comprises three main placement systems - the AX-3,
AX-5 and the AQ-2 - for full application and component handling flexibility.
Compared to the traditional way of meeting production demand using high-capacity
machines, with the possibility of over- or under-capacity, the A-series concept uses
simple, self-contained placement robots that allow small output increments. This
unique and easy modularity, matching your investment to required capacity, is a
major breakthrough in the field of electronics assembly.
1 Introducing
the AX
Platform
Introducing the AX Platform
3 of 34
1.1 Features
Introducing the AX Platform
4 of 34
The AX Platform has the following features
Parallel placement
Board loading, placement and board unloading are performed in parallel
Each robot operates smoothly at a controlled pace while overall
productivity is high
Single-sided operation delivers high productivity/footprint
Stationary board during production yields minimum placement errors
Modular platform
Allows the platform to be configured for the required output while
maintaining full feeder availability
Expandable from 45k cph up to 150k cph for output
Can be reconfigured in less than 20 minutes
Enables product changeovers in minutes for known boards.
Component capability
Covers 01005 up to 45 x 45mm with the same placement head
Provides component vision alignment or laser alignment with the same
placement head - component vision for components up to 45 x 45mm,
laser alignment for components down to 01005
Delivers placement accuracy of 50 micron (µ + 4 sigma)
Placement robots
Both compact as standard placement robot have the same output rating
Robots can easily be moved between machines
Each robot is a self-contained X-Y robot
Robots can be exchanged without recalibration within 20 minutes
Routine maintenance and repair can be performed off-line
Placement heads
Linear Z-motor has standard programmable placement force of 2 to 8N,
lower forces with restrictions
Board warpage correction is automatic
Minimal PPM is assured by component sensing from pick to place
The placement head verifies the nozzle type and quality after each nozzle
exchange and before each production run
Placement head can be exchanged without recalibration within
20 minutes
Board transport
Features automatic width and thickness adjustment of edge clamped
boards
Walking beam principle (No board loading and unloading time!)
Can be left-to-right or right-to-left
SMEMA or Japanese height
Feeding platform
Trolleys allow fast exchange of intelligent feeders
Stationary feeders allow tape replenishment during production
Adaptive pick correction assures minimal PPM
Capable of handling 13" reels standard, 15" reels optional