KE-2000R_InstructionManual_C_Rev00说明.pdf - 第876页

索引 KE2050R/2055R/2060R(Rev.00) i-2 查找 ·········· 4-132,5-23 厂商 ············· 5-30 程序编辑 ········· 1-59,4-5 程序名称 ··········· 1-74 尺寸设置 ········· 4-6,4-10 重夹后生产 ········· 2-121 重试次数 ··········· 4-50 重试列表 ··········· 2-73 重新…

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索引 KE2050R/2055R/2060R(Rev.00)
i-1
索引
【A~Z】
2000选项·········· 4-117
3点法 ··········· 12-25
ATC ·········· 1-12,3-21
ATC控制 ···········9-35
ATC吸嘴的分配 ········ 8-9
AWC ·············2-27
BOC标记位置 ······4-15,4-19
BOC种类 ··········· 4-8
CAL块 ············3-16
CVS ·············3-24
DTS控制 ···········9-33
Emergency ··········1-40
Explorer···········1-65
FCS ············ 11-20
FMLA·············1-11
FPI ············ 12-10
HLC连接 ···········8-26
HMS ·············1-17
HOD ··········1-37,4-144
HOD的使用方法 ······· 4-145
IC回收带········8-19,12-16
LED ·········· 1-15,1-16
MNLA·············1-11
MTC/MTS/DTS ·········4-64
MTC滑梭吸取位置 ·······8-16
MTC自动示教 ·········4-52
MTS标记识别 ·········4-53
MTS的设置方法 ········12-6
MTS控制 ···········9-34
MTS装配位置偏差 ·······8-15
OCC ·········· 1-15,3-25
OCC偏移 ·········· 11-20
SOT方向检查 ····2-86,4-69,9-39
UPS ·········· 1-22,3-34
UPS蓄电池 ··········3-34
VCS ·········· 1-16,3-16
VCS2值化阈值········ 11-15
VCS的构造 ········· 4-103
VCS聚焦高度 ········ 4-101
VCS偏移 ·········· 11-13
VCS使用单元 ········ 8-25
VCS脏污检查 ········ 8-40
X,Y,Z,θ ·········· 1-34
XY校正系数 ········· 11-4
Z 项吸取偏移 ········ 4-51
(通用图像数据)简易输入 ·· 6-19
【B】
帮助 ············ 4-239
包装代码 ·········· 5-15
包装代码库 ········· 13-9
包装形式 ········ 4-37,4-40
保养 ············· 3-1
背面高度 ·········· 4-16
边缘检查显示 ········ 9-19
编号 ············ 4-73
编辑 ············ 4-128
标记(标记ID) ········ 4-30
标记识别 ··········· 4-9
标记识别错误 ········ 2-110
标记数据库 ········· 4-210
标准使用单元 ········ 8-22
不间断模式 ········· 7-11
不间断运行 ········· 4-116
【C】
菜单的构成 ········· 1-58
操作环境 ·········· 4-164
操作选项 ··········· 7-1
示教 ········ 7-2
生产 ····· 1-60,2-1
生产(显示) ····· 7-4
生产(功能) ····· 7-6
生产(功能2) ····· 7-8
生产(暂停) ····· 7-9
生产(检查) ···· 7-11
使用单元 ····· 7-12
侧面照明 ·········· 4-103
测定 ········· 4-169,4-175
索引 KE2050R/2055R/2060R(Rev.00)
i-2
查找··········4-132,5-23
厂商·············5-30
程序编辑·········1-59,4-5
程序名称···········1-74
尺寸设置·········4-6,4-10
重夹后生产········· 2-121
重试次数···········4-50
重试列表···········2-73
重新查找··········· 5-2
重新生产模式········ 2-105
传动部的构成·········2-26
传送········· 4-167,4-168
传送I/O状态 ·········2-64
传送带············ 3-9
传送导轨宽度的调整······2-27
传送滑轮···········3-10
传送类············9-20
个别控制 ···· 2-29,9-20
自动控制 ·······9-22
自动调整基板宽度控制 ·9-24
垂直照明···········1-11
【D】
打开·········· 1-72,2-23
打印······· 1-77,4-238,5-34
打印机设定··········1-76
打印基板···········1-20
带宽·············4-40
单电路板·········4-7,4-11
单位类··········· 4-164
电路配置·········4-6,4-24
电路配置偏差······ 4-19,4-23
电路外形尺寸·········4-19
电气规格···········1-22
电气类············3-12
电源·············1-22
定位方式··········· 4-7
定位孔基准·········· 4-7
定位孔位置··········4-13
定心·············4-49
定心方式···········4-38
定心系统···········1-33
读取吸嘴数据········· 8-5
断点原点返回 ········ 2-139
对象元件 ········ 1-22,4-78
多工位线 ·········· 8-28
多引脚元件 ·········· 6-1
多值识别 ··········· 4-9
【E】
二值化识别 ·········· 4-9
【F】
反射照明 ·········· 4-103
范围检查 ········ 4-26,4-34
非矩阵电路板 ······ 4-8,4-22
分层 ············ 4-33
分割识别 ·········· 4-100
分开(分割)贴片数据 ···· 4-122
分配 ············ 4-112
分配视野设置 ········ 4-102
附加信息 ·········· 4-50
复合阵列元件 ········· 6-1
复制 ············ 4-131
【G】
高分辩率摄像机 ······· 1-16
个别控制 ········ 2-23,9-20
各贴片头的运行信息 ····· 10-9
各吸嘴的次数设置 ······ 10-5
各吸嘴运行信息 ······· 10-4
跟踪球(轨迹球) ···· 1-47,3-26
跟踪吸取高度 ········ 4-212
更改名称 ·········· 5-13
更换次数设置 ········ 10-10
工具 ·········· 2-66,5-25
工作板 ··········· 1-50
供给 ············ 4-73
供给装置 ········ 4-43,9-28
供给装置信息 ········ 2-74
供料器安排选项 ······· 4-114
索引 KE2050R/2055R/2060R(Rev.00)
i-3
共面性····3-27,4-67,8-34,12-24
共面性检查········· 4-187
共线性··········· 12-26
管理············ 4-223
过滤器元件·········· 3-2
【H】
号码·············4-73
画面的构成··········1-33
坏板标记传感器······· 12-11
坏板标记传感器示教······8-35
坏板标记类型········· 4-8
坏板标记位置·········4-20
环境设置·········· 4-164
【J】
机器操作·········· 4-165
机器设定·········1-50,8-1
启动 ········· 8-2
退出 ········· 8-3
机器设置···········8-34
机器运行信息·········10-1
机械规格···········1-18
基板/回路 ········· 4-117
基板ID············ 4-7
基板传送···········8-29
基板的设置··········2-19
基板高度···········4-16
基板厚度···········4-16
基板配置··········· 4-7
基板设计端点······4-10,4-13
基板设计偏移量········4-13
基板设置···········2-25
基板生产···········2-40
基板数据·········4-5,4-6
基板外形尺寸······ 4-11,4-19
基板位置基准······4-10,4-12
基板吸取控制·········9-25
基本设置··········· 4-6
基本样式···········4-89
基准回路···········4-17
基准销的位置 ········ 8-14
激光传感器高度 ······· 11-6
激光高度 ·········· 4-60
激光高度检查 ········ 2-92
激光控制 ·········· 9-15
激光识别算法 ········ 4-63
激光校准测定位置 ······ 1-35
激光校准传感器 ····· 1-33,3-15
激光赃污 ·········· 2-114
激光状态一览表 ······· 13-29
继续生产 ·········· 2-117
加油 ············ 3-29
夹持吸嘴 ·········· 12-18
校准台 ··········· 9-37
间距 ······· 4-40,4-42,4-82
检测 ········· 4-170,4-175
检查 ······· 2-79,4-66,4-184
检查元件释放 ······ 4-52,7-6
检修 ············· 3-2
角度照明 ·········· 1-15
界面 ············ 1-39
紧急停止 ·········· 1-50
警告级别设置 ····· 10-7,10-12
矩阵电路板 ······· 4-7,4-17
【K】
空打 ············ 2-42
空气过滤器 ····· 3-6,3-7,3-8
空运行模式 ········· 2-22
控制 ············ 4-100
控制数据管理 ········ 13-17
宽度 ············ 4-83
扩展 ·········· 4-56,4-99
扩展列 ··········· 6-10
扩展名 ········ 1-74,13-27
扩展引脚连接器 ······· 4-99
【L】
类型 ·········· 4-41,4-74
另存为 ··········· 1-73
流程图 ·········· 2-1,4-1