SIPLACE D1 规格说明书英文版.pdf - 第32页
32 Vision Sensor Technology 2D Coplanarity Laser Module Description Coplanarity of connections on a component means that all connections lie on a level, the so-called placemen t plane. This level is created from the heig…
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Vision Sensor Technology
PCB Position Recognition
Bad Board Position Recognition
Ink spot criteria
Methods • Synthetic fiducial recognition method
• Mean grayscale value
• Histogram method
• Template matching
Shapes and sizes of fiducials/structures for
synthetic fiducials
other methods
For dimensions of synthetic fiducials,
see page 30
min. 0.3 mm
max. 5 mm
Masking material good coverage
Recognition time depends on the method: 20 ms - 200ms
Description
In the cluster technology
each subpanel is assigned
an ink spot. If this is present
during the measurement via
the PCB vision module, the
corresponding subpanel is
populated.
With this function it is pos-
sible to eliminate costs due
to unnecessary population of
faulty subpanels.
Technical data for PCB position recognition
PCB fiducials
Local fiducials
Library memory for recognition
of bad panels
up to 3 (subpanels and multiple panels)
up to 6 for the Long board option (Optional PCB fiducials
are output by the optimization.)
up to 2 per PCB (may be of different type)
up to 255 fiducial types per subpanel
Image analysis Edge detection method (Singular feature) based on gray-
scale values
Lighting method Front lighting
Fiducial recognition time 0.1 s
Field of vision 5.78 x 5.78 mm
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Vision Sensor Technology
2D Coplanarity Laser Module
Description
Coplanarity of connections
on a component means that
all connections lie on a level,
the so-called placement
plane. This level is created
from the height information
from the coplanarity mea-
surement. This ensures that
the same soldering condi-
tions apply for all connec-
tions.
Measuring principle
Measurement of the heights
of the connections occurs
contact-free according to the
principle of laser-triangula-
tion. For the 2D method, a
point laser beam scans the
component. The reflected
light from the laser is pro-
jected onto a sensor. In this
way the height information
for the connections is
obtained from the reflected
light from the laser.
Restrictions
• The component must
have a minimum of two
and a maximum of four
rows of gull-wing leads.
• The row of leads should
be located orthogonally to
each other.
• The leads should be
trained orthogonally to the
row of leads.
• The ends of the leads lie
on a straight line.
• Measurement of compo-
nents with just one row of
leads is not possible.
Place-
ment
level
Deviation from
coplanarity
Technical data
Components Gullwing
Accuracy ± 18.5 µm (3 (reference component)
± 24.7 µm (4
± 30.5 µm (3 (components up to 32 mm)
± 40.7 µm (4
± 31.3 µm (3 (components up to 55 mm)
± 41.7 µm (4
Max. component size 55 x 55 mm²
Min. lead pitch 300 µm
Max. component height 25 mm
Positioning option Location 2
Placement head type Pick&Place head
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SIPLACE Software
SIPLACE offers holistic solu-
tions based on modular soft-
ware tools for SMT machine,
line and production manage-
ment: the SIPLACE soft-
ware suite.
Product definition, optimi-
zation and line control
Fast, fault-free introduction
of products and optimum
utilization of production lines
are essential to maximize
production output. The
programs from the SIPLACE
software suite allow you to
easily program products,
fine-tune the programs you
have created and then find
the balance for them within
your SMT production lines.
Production monitoring &
process control
To achieve the production
targets that are set, it is
important to constantly
monitor and check the pro-
duction facilities. The
SIPLACE software suite con-
tains monitoring products tai-
lored to suit the user group.
These signal immediately if
limits are exceeded on the
machine or the production
line.
Set-up verification &
traceability
Set-up errors lead to series
errors. The user-friendly
SIPLACE software programs
help you to avoid such
errors, and thus ensure high
quality in your electronics
production.
The benefits of the
SIPLACE software suite at
a glance:
• Fast programming and
error detection
• Reduces changeover
times and stoppages
• Ensures optimum utiliza-
tion of your production
line's productivity
• Real-time information
from the production area
• Incredibly fast distribution
of information
• Optimum use of resources
• Timely notification when
production materials need
to be re-ordered
• Coordination of mainten-
ance
Example times for SIPLACE Pro
Average time for programming a PCB 10 minutes
Minimum line optimization time < 1 minute