SIPLACE D1 规格说明书英文版.pdf - 第8页

8 Modular Machine Concept Step 1: Placement system with 1 gan try Step 2: Selection of the placement heads 12-segment C & P head 6-segment C & P head Pick & Place head Step 3: Selection of the conveyor Single…

Machine Performance

Incredibly fast new prod-

uct introduction (NPI) with

external set-up preparation

and vision teaching

The SIPLACE D1 really

comes into its own in flexible

production environments.

For example, NPI can be

implemented as fast as pos-

sible with the SIPLACE Vir-

tual Product Build. This NPI

solution allows you to pro-

gram offline, set up and

check offline and to make

adjustments offline with the

SIPLACE Pro software.

This increases machine utili-

zation and reduces waste.

And with respect to the cur-

rent production run, the

SIPLACE vision teaching

station also makes it

extremely simple and fast to

generate component shape

descriptions, even for com-

plex components. The set-up

process starts once you have

optimized the product and

defined all the components in

the programming system.

This is also done externally

and then checked by means

of the barcode and data

transfer. This makes the

product change child's play:

the program and all the data

are sent to the line and the

new production run can start.

It just can't get any faster!

Lowest dpm with set-up

verification, sophisticated

sensors and AOI

The highest machine quality

allows the SIPLACE D1 to

produce the highest product

quality. This is guaranteed by

a number of additional

features.

Sensors check the presence

and position of the compo-

nents before and after every

pick-up and placement oper-

ation at the placement head.

The digital SIPLACE Vision

System detects the compo-

nents faster and more reli-

ably than the old analog

technology. Finally, with

SIPLACE OS, the SIPLACE

team is offering an AOI

(Automatic Optical Inspec-

tion) device that checks the

products and signals errors

to the placement machine.

This network of tests consid-

erably lowers dpm rates and

increases the first pass yield.

Types of place-

ment head

12-nozzle Collect&Place head (C&P12)

6-nozzle Collect&Place head (C&P6)

SIPLACE Pick&Place head (P&P)

PLEASE NOTE IPC value [comp./h]

According to the vendor-neutral conditions of the IPC 9850 standard published

by the Association of Connecting Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance

tests. It corresponds to the conditions set out in the SIPLACE scope of service

and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable

conditions for each machine type and setting, and corresponds to the theoret-

ical conditions normally used in the industry.

Number of

gantries

IPC value Benchmark value Theoretical value

Placement head

configuration and

placement head

rate

C&P12

C&P6

P&P

13,000

8,400

2,600

15,000

9,800

2,800

20,000

11,500

3,500

Modular Machine Concept

Step 1: Placement system with 1 gantry

Step 2: Selection of the placement heads

12-segment C&P head

6-segment C&P head

Pick&Place head

Step 3: Selection of the conveyor

Single conveyor

Flexible dual conveyor

Step 4: Selection of the component

changeover table, WPC

Component changeover table

Waffle-pack changer WPC

Step 5: Selection of the feeder modules

S tape feeder modules

Modular Machine Concept

Sample Configuration

BZ Buffer zone

C&P Collect&Place head

CM Coplanarity module

COT Component changeover table

FCC Flip-chip camera, type 25

G1 Gantry 1

ICC IC camera, type 33 or 36

NCH C&P Nozzle changer for the C&P head

NCH P&P Nozzle changer for the Pick&Place

head

OP Operator panel

P&P Pick&Place head

PA Placement area

WPC Waffle-pack changer

COT

NCH P&P

NCH C&P FCC CM ICC P&P

COT/WPC

C&P

OP OP