Nexus_EN_CN.pdf
Nexus Contact Soldering Contact Soldering with and without vacuum Ideal for a great variety of applications up to 400 °C 真空/非真空接触式焊接系统 适用于多种行业应用
Nexus
Contact Soldering
Contact Soldering with and
without vacuum
Ideal for a great variety of applications
up to
400 °C
真空/非真空接触式焊接系统
适用于多种行业应用
Void-free soldering with vacuum
Ideal for a great variety of applications
The Nexus guarantees high-quality results with a reow process using contact heat in
a vacuum. It thus meets the highest requirements of power electronics, in the advanced
packaging and semiconductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally highly
dissimilar takes place in the vacuum at a reduced pressure at temperatures up to 400 °C.
The reduced pressure thereby helps to minimise oxidation on the components and on the
solder itself. The transfer of heat is via heat contact surfaces or optional by radiation. The
Nexus system is predominantly used in small and medium production lines as well as in the
eld of laboratory.
Nexus设备采用接触式加热和真空处理技术，确保实现最佳焊接效果，由此满足电力电子行业在先进封装
和半导体技术领域的最高要求。
Nexux接触式焊接系统尤其适合于DCB基板上不同设备（例如IGBT）的无空洞焊接。高度相异的材料在真
空低压以及高达400 °C的温度下相结合。此外，真空环境还有助于最大程度防止元器件和焊料氧化。热传
导通过隔热垫和热辐射完成。Nexus系列主要用于中小型生产线以及实验室领域。
Contact
Soldering
Reliable and flexible
无空洞真空焊接工艺
适用于多种行业应用
3
Oxide and void-free joint surface between chip and interconnected device
Integrated or separate cleaning and de-scaling processes
Simple proling and fast heating and cooling rates
Assembly under high level of vacuum
Integration of drying and degassing processes
Optimum dispersal of waste heat
Reliable contact soldering
The Nexus makes it possible!
The Rehm Thermal Systems vacuum soldering oven is ex-
ceptionally well suited for production facilities which pursue
flux-free and void-free soldering in various inert gases (N
2
,
H
2
, N
2
/H
2
95/5).
The use of lead-free and lead-containing pastes and pre-
forms with/without flux is also possible. Miniaturization in
the elds of advanced packaging and semiconductors can
be further developed by means of vacuum technology.
可靠的接触焊 Nexus以行践言
锐德热力系统真空炉十分适合于在各种惰性气体（N2、H2、N2 / H2
95/5）中追求无需助焊剂和无空洞焊接的生产设备。
锡膏与焊料片有铅/无铅均可，也可采用无肋焊剂方式。真空有助于
推动先进封装与半导体技术的微型化发展。
芯片与元件之间的焊点无空洞无氧化
集成或独立式清洗和除垢
轻松设置温度曲线，快速加热和冷却
制程环境高度真空
集成干燥和排气制程
优化散热，满足功率器件需求