Nexus_EN_CN.pdf - 第6页
6 Example vacuum heating process | 真空加热过程示例 Reliable vacuum processes for impro ved quality 可靠真空制程，提升焊接质量 Increased productivity and quality advantages can be achie ved in the production of power electronics by means of …
5
Operating principles
|
运行原理
Heating and cooling Satilinatil
| 加热和冷却
A major benet of the Nexus contact soldering system is that the heating or cooling gradient can be predened based on pre-
determined parameters. The gradients can be preset as required. Within these specication limits, the temperature is adjusted
automatically by the Nexus so that these limit values are not exceeded. This eliminates the possibility of a malfunction of the
assembly to be soldered.
Nexus接触焊接系统的主要优点是可以根据预定参数预定义加热或冷却梯度。 可以根据需要预先设置渐变。在这些规格限制内，Nexus会自动
调整温度，以免超出这些限制值。 这消除了待焊接组件发生故障的可能性。
The heating output of the Nexus has been designed for a uniform heating process when fully loaded with high-mass assemblies
meaning that short cycle times are also no problem. Sensor components determine and verify the temperatures recorded on the
goods carrier support.
Nexus的加热输出设计为在满载高质量组件的情况下实现均匀的加热过程，这意味着较短的循环时间也不成问题。传感器组件确定并验证在货
物支架上记录的温度。
0
50
100
150
200
250
300
2200 2300 2400 2500 2600 2700 2800
Temperature in °C
Time in s
Set value
Controller 1
Controller 2
Controller 3
The vacuum soldering process generates temperatures of
up to 400 °C and is an ideal solution for void-free and flux-free
applications. The Nexus not only provides your manufactu-
ring operation with advantages for the soldering process, but
rather for bonding processes as well.
真空焊接制程可提供最高
400°C
的焊接温度，是无空洞和无助焊剂焊
接应用的最理想解决方案。无论是焊接制程还是粘合制程，
Nexus
设
备都能够为您的生产应用提供无与伦比的多种优势。
heating plate
加热板
PCB
电路板
cooling
冷却
hermetically sealed process chamber
密封炉膛
direct
heat transfer
6
Example vacuum heating process
|
真空加热过程示例
Reliable vacuum processes
for improved quality
可靠真空制程，提升焊接质量
Increased productivity and quality advantages can be achieved
in the production of power electronics by means of vacuum
soldering. Vacuum provides for oxide-free processes as well
as improved wetting, and thus for more effectively lled solder
joints. Beyond this, vacuum drastically reduces the number of
voids in solder joints and supports processes such as plasma
cleaning and gas exchange for advanced packaging. Tempera-
tures of up to 400 °C are possible with Nexus.
在电力电子元器件生产中，真空焊接工艺可帮助客户显著提升生产效率
和产品质量。真空环境可确保实现无氧化焊接，改善湿润性能，获得更
饱和的焊点，还能够显著降低焊点空洞率，并支持先进封装领域中的等
离子清洗和换气等工艺。
Nexus
设备最高焊接温度可达到
400 °C
。
without vacuum with vacuum
400 400
300 300
200 200
100 100
0 2 4
vacuum for
void-free solder joints
evacuate and ood
with nitrogen
vacuum and input, e.g.,
formic acid for oxide-free
wetting surfaces
heat up to
solder temperature
activation
phase
pre-heating
phase
cooling phase
solder temperature
6 8min
1000
°C °C
1000
hPa hPa
0 0
0 0
7
Controlled chamber pressure
|
控制腔体压力
A controlled gas sampling system via a vacuum pump from the process chamber prevents overpressure
during controlled flushing via a separate proportional valve for feeding into the process chamber; thus each
pressure level can be set as required using a software programme.
可控制采样系统经由真空泵从真空腔内取样，通过比例阀控制注入气体的流量以防止气体注入时产生过压； 因此，可以
使用软件程序根据需要设置每个压力级别。
controlled chamber pressure with nitrogen atmosphere
pressure level constant
压力水平常数
proportional valve
for nitrogen input
氮气输入比例阀
vacuum pump to control the chamber
pressure of 0 - 1000 mbar
真空泵可以控制腔体
压力在0-1000 mbar
在氮气气氛下控制真空腔压力