Nexus_EN_CN.pdf - 第7页
7 Controlled chamber pressur e | 控制腔体压力 A controlled gas sampling system via a vacuum pump from the pr ocess chamber prevents overpressur e during controlled flushing via a separate proportional valve for f eeding into t…
6
Example vacuum heating process
|
真空加热过程示例
Reliable vacuum processes
for improved quality
可靠真空制程，提升焊接质量
Increased productivity and quality advantages can be achieved
in the production of power electronics by means of vacuum
soldering. Vacuum provides for oxide-free processes as well
as improved wetting, and thus for more effectively lled solder
joints. Beyond this, vacuum drastically reduces the number of
voids in solder joints and supports processes such as plasma
cleaning and gas exchange for advanced packaging. Tempera-
tures of up to 400 °C are possible with Nexus.
在电力电子元器件生产中，真空焊接工艺可帮助客户显著提升生产效率
和产品质量。真空环境可确保实现无氧化焊接，改善湿润性能，获得更
饱和的焊点，还能够显著降低焊点空洞率，并支持先进封装领域中的等
离子清洗和换气等工艺。
Nexus
设备最高焊接温度可达到
400 °C
。
without vacuum with vacuum
400 400
300 300
200 200
100 100
0 2 4
vacuum for
void-free solder joints
evacuate and ood
with nitrogen
vacuum and input, e.g.,
formic acid for oxide-free
wetting surfaces
heat up to
solder temperature
activation
phase
pre-heating
phase
cooling phase
solder temperature
6 8min
1000
°C °C
1000
hPa hPa
0 0
0 0
7
Controlled chamber pressure
|
控制腔体压力
A controlled gas sampling system via a vacuum pump from the process chamber prevents overpressure
during controlled flushing via a separate proportional valve for feeding into the process chamber; thus each
pressure level can be set as required using a software programme.
可控制采样系统经由真空泵从真空腔内取样，通过比例阀控制注入气体的流量以防止气体注入时产生过压； 因此，可以
使用软件程序根据需要设置每个压力级别。
controlled chamber pressure with nitrogen atmosphere
pressure level constant
压力水平常数
proportional valve
for nitrogen input
氮气输入比例阀
vacuum pump to control the chamber
pressure of 0 - 1000 mbar
真空泵可以控制腔体
压力在0-1000 mbar
在氮气气氛下控制真空腔压力
Inert gases and forming gas
| 惰性气体与混合气体
Nitrogen (N
2
) is typically used to protect against
oxidation. In combination with 5 % hydrogen, the forming gas
is also used for reducing oxides; no special safeguards are
necessary within this mixing ratio.
混合气体也用于与5%的氢气混合使用，以减少氧化物，在此混合比例
内，无需采取特殊措施。
Forming gases with a hydrogen content from 5 % to 100 %
need necessarily appropriate safeguards and are used only at
280 °C or higher. Depending on the process temperature, the
use of formic acid can be benecial.
5%至100%氢含量的混合气体可能需要更高等级的防护装置，并且只能
在280°C或更高温度下使用。根据工艺温度的不同，使用甲酸有益于
工艺。
Activation (Gas)
Investment Wetting
Nitrogen N
2
Forming gas N
2
/H
2
(95 %/5 %)
Hydrogen H
2
100 %
Formid acid HCOOH
N
2
N
2
/H
2
Various media
for a wide range of requirements and demands
各种介质
广泛适用于各种需求
Depending on the process temperature and the desired oxide freedom, the use of different process media is possible.
根据工艺温度和所需的氧化物自由度，可以使用不同的工艺介质。