What is New in IPC-7351C.pdf - 第34页
PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C Ne w La nd P at t e r n Na m ing Con v ention Man uf a ctu r er Nam e s an d A b br e viat ions A bbr ev i at ion Manu factur er ’ s Nam e A bbr ev i at ion M…
PCB Libraries Presents:
What is New in IPC-7351C
New Land Pattern Naming Convention
Extended Names Eliminate Duplication III
• Component manufacturer’s apply different tolerances on
the package dimensions which creates a different footprint
pattern. So a new Naming Convention must be created for
each mfr. Case Code
• Standard Packages – MfrNameAbr_MfrCaseCode
• Unique Packages – MfrNameAbr_MfrPartNumber
• This new naming convention is exclusive to all footprints,
so instead of having one naming convention for Standard
Packages and a different naming convention for Unique
packages, a universal naming convention is needed
PCB Libraries Presents:
What is New in IPC-7351C
New Land Pattern Naming Convention
Manufacturer Names and Abbreviations
Abbreviation
Manufacturer’s Name
Abbreviation
Manufacturer’s Name
TI
Texas Instruments
LATTICE
Lattice Semiconductor
AMD
Advanced Micro Devices
SA
State of the Art
ST
ST Microelectronics
CDE
Cornell
DubilierElectron
TE
TE Connectivity
CTS
CTS
KOA
KOA Speer Electronics
MOLEX
Molex
NXP
NXP Semiconductors
ALD
Advanced Linear Devices
HTK
Honda Tsushin Kogyo
CYPRESS
Cypress Semiconductor
JAE
Japan Aviation Electron..
FOX
Fox Electronics
IQD
IQD Frequency
Products
IDT
Integrated Device Tech..
KEMET
Kemet
DIODES
Diodes, Inc.
PCB Libraries Presents:
What is New in IPC-7351C
New Solder Joint Goal Recommendations
Proportional SMD Pad Stack
25% Pitch
30% Pitch
5% Pitch 20% Pitch
Gullwing
Lead Shape Toe Heel Side
Courtyard Excess
2.54
mm Pitch (DPAK) 0.63 0.76 0.13 0.50
1.27
mm Pitch 0.30 0.35 0.06 0.25
1.00
mm Pitch 0.25 0.30 0.05 0.20
0.08
mm Pitch 0.20 0.25 0.04 0.16
0.65
mm Pitch 0.16 0.20 0.03 0.13
0.50
mm Pitch 0.13 0.15 0.02 0.10
0.40
mm Pitch 0.10 0.12 0.01 0.08
0.35
mm Pitch 0.09 0.10 0.00 0.07
Component Families
Small Outline IC (SOIC)
Small Outline Package (SOP)
Quad Flat Package (QFP)
Small Outline Transitor (SOT23)
Small Outline Transitor (SOT223)
Small Outline Transitor (SOT143)
Small Outline Diode (SOD)
Ceramic Flat Package (CFP)
Ceramic Quad flat Package (CQFP)
TO (DPAK)
Pad Length =
Nominal Lead Length + Toe + Heel
Pad Width =
Nominal Lead Width + Side