What is New in IPC-7351C.pdf - 第46页

PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C N ew Non - col lap s in g BG A S JG R ecom mend atio n Pr opor t iona l S MD Pad S tack Non - Col laps ing B a ll G r id A rray Pin Pi t ch A dj. % Pa d Siz e…

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PCB Libraries Presents:
What is New in IPC-7351C
New Collapsing BGA SJG Recommendations
Proportional SMD Pad Stack
Collapsing Ball Grid Array (BGA)
Pin Pitch
Adj. %
New Pad Size
Old Pad Size
Pad Round
-
off
Courtyard Excess
Nominal Ball (mm) Fixed Fixed
80% of Pin Pitch
0.75 1.27 80% 0.60 0.60 0.01 1.00
0.60 1.00 80% 0.48 0.50 0.01 0.80
0.55 1.00 80% 0.44 0.45 0.01 0.80
0.50 0.80 80% 0.40 0.45 0.01 0.65
0.45 0.80 80% 0.36 0.40 0.01 0.65
0.35 0.65 80% 0.28 0.33 0.01 0.50
0.30 0.65 80% 0.24 0.25 0.01 0.50
0.25 0.50 80% 0.20 0.20 0.01 0.40
0.20 0.45 80% 0.16 0.20 0.01 0.35
A Single Simple Ball Diameter to Pad Size Calculation
PCB Libraries Presents:
What is New in IPC-7351C
New Non-collapsing BGA SJG Recommendation
Proportional SMD Pad Stack
Non
-
Collapsing Ball Grid Array
Pin Pitch
Adj. %
Pad Size
Pad Round
-
off
Courtyard Excess
Nominal Ball (mm) Fixed Fixed
80% of Pin Pitch
0.75 1.27
100%
0.75 0.00 1.00
0.60 1.00
100%
0.60 0.00 0.80
0.55 1.00
100%
0.55 0.00 0.80
0.50 0.80
100%
0.50 0.00 0.65
0.45 0.80
100%
0.45 0.00 0.65
0.35 0.65
100%
0.35 0.00 0.50
0.30 0.65
100%
0.30 0.00 0.50
0.25 0.50
100%
0.25 0.00 0.40
0.20 0.45
100%
0.20 0.00 0.35
0.17 0.40
100%
0.17 0.00 0.30
0.15 0.35
100%
0.15 0.00 0.30
PCB Libraries Presents:
What is New in IPC-7351C
• Component Family Grouping by Pin Quantity
• 3D Model Picture of Each Component
• Land Pattern Pictures with Level A & B Rotations
• Updated Solder Joint Goal Tables
• Naming Convention: Mfr. Part Number or Case
• New Chapter on Aspects of 3D Modeling
• Appendix Introduces Drafting Outline Guidelines
• Relocating all Assembly Related Data to the new
IPC-7070 Component Mounting Issues and
Recommendations
Chapters 8 & 9 – Total Rewrite