Products_Overview_EN_CN.pdf - 第10页
TECHNOLOGY BENEFIT S 技术优势 › Analysis of resistance of sensitive electronics in extreme temperatures › Optimal combinations of systems with other measuring equipment › Excellent insulation values due to foamed housing › E…
TECHNOLOGY BENEFITS
技术优势
› Oxide and void-free joint surface between chip and interconnected device
› Integrated or separate oxidation and deoxidation processes
› Simple proling and fast heating and cooling rates
› Assembly under high level of vacuum
› Integration of drying and degassing processes
› Optimum dispersal of waste heat
Nexus
Contact Soldering
The Nexus system guarantees high-quality results with a reflow process using con-
tact heat in a vacuum. It thus meets the highest requirements of power electronics, in
the advanced packaging and semi-conductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally
highly dissimilar takes place in the vacuum at a reduced pressure at temperatures up
to 400 °C. The reduced pressure thereby helps to minimise oxidation on the com-
ponents and on the solder itself. The transfer of heat is via heat contact surfaces or
optional by radiation. The Nexus system is predominantly used in small and medium
production lines as well as in the eld of laboratory.
Nexus在真空环境下采用接触式回流焊接工艺，能够确保高质量的焊接成果。因此它能够满足电力电
子产品的先进封装以及半导体应用领域的最高要求。
接触式焊接系统最适合用于在DCB基板上对不同组件（例如IGBT）进行无空洞焊接。性质迥异的材料
在低压真空且温度高达400℃的环境下相结合，有效降低了部件和焊料自身的氧化反应。Nexus系统可
以通过表面接触或者辐射方式进行热传导，主要应用于中小型生产线以及实验室领域。
Nexus Contact Soldering
芯片与基板之间焊点无氧化且无空洞
集成或分离式清洁及除垢工艺
简化建模和提升加热及冷却速率
高度真空的装配环境
集成式干燥和除气工艺
更优化的散热
TECHNOLOGY BENEFITS
技术优势
› Analysis of resistance of sensitive electronics in extreme temperatures
› Optimal combinations of systems with other measuring equipment
› Excellent insulation values due to foamed housing
› Excellent heating or cooling capacity
› Easy access and minimal maintenance
› Systems available as stand-alone or in-line variant
Securo Plus
System for
hot function test
高温耐受性测试系统
Securo Minus
System for
cold function test
低温耐受性测试系统
极端温度条件下分析电子元件的耐受性能
与其他检测设备高度兼容，优化组合成多样化检测系统
采用隔热性更为优良的发泡隔热层
出色的加热或冷却性能
易于操作，最低维护需求
可用做批处理或嵌入式处理系统
Securo Tests | Trials
+120 °C
+80 °C
RT
t
°C
Securo
Plus
−40 °C
−50 °C
RT
t
°C
Securo
Minus
Safe electronics despite heat – hot function
test system for temperature range of +80 °C
bis +120 °C.
不惧酷热的安全电子元器件——高温耐受性测试系
统，模拟+80℃至+120℃的极端温度
Always reliable in the cold as well – cold
function test system for temperatures up
to -50 °C.
寒冷环境下始终可靠如一——低温耐受性测试系
统，可模拟低至-50℃的极端寒冷环境。
Securo
Tests | Trials
Modern electronics are used nowadays in a range of industries and are therefore exposed to
the most widely varied temperatures. Most notably, electronic assemblies in safety-related are-
as of application must function 100 % reliably at all temperature conditions. Safe testing and
measuring methods are increasingly relevant and have already become standard in analysing
the resistance of electronic components and increasing their durability in the long term.
Our Securo systems for cold and hot function tests simulate these extreme environmental con-
ditions by selectively heating or cooling the system. The systems function under air or nitrogen
atmosphere and are available as batch or inline variant.
如今，现代电子设备已被广泛应用于各大行业，需要常常暴露于广泛温度范围条件下。尤其值得注意的
是，与安全相关的应用领域中，电子设备必须在所有温度条件下都100%安全可靠，否则后果不堪设想。由
此，各种安全测试和测量方法层出不穷，并逐渐衍生出专门用于分析和检测电子元器件耐受性，以及提高
元器件耐久性的相关标准，
锐德开发的Securo高温/低温耐受性测试系统可通过对电子组件进行选择性的冷却/加热，真实而准确地对极
端环境进行模拟。该系统可用于空气或氮气环境，并可根据需要选择批处理或嵌入式处理系统。
Temperature ranges