Products_Overview_EN_CN.pdf - 第8页
Nexus Void free soldering with vacuum Perfect for different applications 完美适配多种应用的真空接触式焊接系统 Reliable vacuum processes for improved quality The vacuum soldering process generates tempera - tures of up to 400 °C and is an …
CondensoX
Condensation Soldering
In reflow condensation soldering or vapour-phase soldering, soldering is accomplished with the aid
of a hot vapour. Heat transfer in condensation soldering is up to ten times higher than with con-
vection soldering. This is particularly suitable for processing large or high-mass boards in a stable
process atmosphere. The inert heat transfer medium used is perfluorpolyether (Galden
®
).
Our CondensoX series can solder even the most difcult assemblies quickly and dependably, at
temperatures up to 240 °C. In order to improve control of the condensation phase, Rehm has
developed a patented injection process that allows the soldering procedure to be individually reg-
ulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering
process or as a pre-vacuum. Our systems let you adjust parameters, such as temperature or
pressure (vacuum), flexibly according to production requirements.
回流或气相焊接制程都需要借助热蒸汽。与回流焊接相比，气相焊接的热传导效应要高出十倍以上，尤其适用
于稳定制程气体环境下的大型或重型电路板加工，而介质Galden®则扮演着惰性热载体的角色（Galden®）。
即使面对最复杂的组件，CondensoX系列也能够对其进行快速有效的焊接，最高焊接温度可达240℃。为了更好地
控制冷凝阶段，锐德采用专利型的介质注入法，实现焊接制程的单独调节。可选的真空模块则能够实现无空洞焊
接——直接部署在焊接制程结束之后或采用真空预压。该系统所有参数（例如压力或温度）均可灵活设置——最优
质的服务源于完美匹配您的生产需求。
CondensoX Condensation Soldering
Smartline
Inline
Inline loading/
unloading
air operation
联线式
在线装载/卸载
空气制程
X-Line
Inline
Inline loading/
unloading
nitrogen operation
联线式
在线装载/卸载
氮气制程
XC
Manual
Front loading
手动
正面装载
XS Smart
Manual
Loading from
the side and front
手动
正面及侧面装载
XM Smart
Manual / Autom
Loading from
the side
手动/自动
侧面装载
CondensoX-Serie
Nexus
Void free soldering with vacuum
Perfect for different applications
完美适配多种应用的真空接触式焊接系统
Reliable vacuum processes for improved quality
The vacuum soldering process generates tempera-
tures of up to 400 °C and is an ideal solution for void-
free and flux-free applications. The Nexus not only
provides your manufacturing operation with advanta-
ges for the soldering process, but rather for bonding
processes as well.
可靠的真空工艺有效提升焊接质量
Nexus 真空接触式焊接系统， 焊接温度可高达400℃， 是满
足无空洞及无助焊剂应用需求的理想型解决方案。在生产应
用方面，Nexus不仅具备焊接制程上的优势，还同样适用于
胶粘工艺制程。
Without vacuum
非真空制程
With vacuum
真空制程
Up to
400 °C
TECHNOLOGY BENEFITS
技术优势
› Oxide and void-free joint surface between chip and interconnected device
› Integrated or separate oxidation and deoxidation processes
› Simple proling and fast heating and cooling rates
› Assembly under high level of vacuum
› Integration of drying and degassing processes
› Optimum dispersal of waste heat
Nexus
Contact Soldering
The Nexus system guarantees high-quality results with a reflow process using con-
tact heat in a vacuum. It thus meets the highest requirements of power electronics, in
the advanced packaging and semi-conductor area.
The Nexus contact soldering system is best suited for void-free soldering of different
devices (e.g. IGBT) on DCB substrates. The combining of materials that are normally
highly dissimilar takes place in the vacuum at a reduced pressure at temperatures up
to 400 °C. The reduced pressure thereby helps to minimise oxidation on the com-
ponents and on the solder itself. The transfer of heat is via heat contact surfaces or
optional by radiation. The Nexus system is predominantly used in small and medium
production lines as well as in the eld of laboratory.
Nexus在真空环境下采用接触式回流焊接工艺，能够确保高质量的焊接成果。因此它能够满足电力电
子产品的先进封装以及半导体应用领域的最高要求。
接触式焊接系统最适合用于在DCB基板上对不同组件（例如IGBT）进行无空洞焊接。性质迥异的材料
在低压真空且温度高达400℃的环境下相结合，有效降低了部件和焊料自身的氧化反应。Nexus系统可
以通过表面接触或者辐射方式进行热传导，主要应用于中小型生产线以及实验室领域。
Nexus Contact Soldering
芯片与基板之间焊点无氧化且无空洞
集成或分离式清洁及除垢工艺
简化建模和提升加热及冷却速率
高度真空的装配环境
集成式干燥和除气工艺
更优化的散热