Products_Overview_EN_CN.pdf - 第7页
CondensoX Condensation Soldering In reflow condensation soldering or vapour-phase soldering, soldering is accomplished with the aid of a hot vapour . Heat transfer in condensation soldering is up t o ten times higher tha…
TECHNOLOGY BENEFITS
技术优势
› Control of the reow prole with patented injection principle
›
Hermetically sealed process chamber
› Controllable vacuum process
› Horizontal, safe transport for the module through the machine
›
No spreading of Galden
®
and active Galden
®
ltering
› Process monitoring with wireless WPS system
专利介质注入法实现高重复精度的温度曲线控制
高度密封性炉膛
可控真空制程
水平传输系统保证炉膛中组件的传输安全
无Galden®介质损耗，并主动过滤
无线WPS系统提供制程动态监控
CondensoX
Condensation Soldering
In reflow condensation soldering or vapour-phase soldering, soldering is accomplished with the aid
of a hot vapour. Heat transfer in condensation soldering is up to ten times higher than with con-
vection soldering. This is particularly suitable for processing large or high-mass boards in a stable
process atmosphere. The inert heat transfer medium used is perfluorpolyether (Galden
®
).
Our CondensoX series can solder even the most difcult assemblies quickly and dependably, at
temperatures up to 240 °C. In order to improve control of the condensation phase, Rehm has
developed a patented injection process that allows the soldering procedure to be individually reg-
ulated. An optional vacuum module ensures void-free soldered joints – directly after the soldering
process or as a pre-vacuum. Our systems let you adjust parameters, such as temperature or
pressure (vacuum), flexibly according to production requirements.
回流或气相焊接制程都需要借助热蒸汽。与回流焊接相比，气相焊接的热传导效应要高出十倍以上，尤其适用
于稳定制程气体环境下的大型或重型电路板加工，而介质Galden®则扮演着惰性热载体的角色（Galden®）。
即使面对最复杂的组件，CondensoX系列也能够对其进行快速有效的焊接，最高焊接温度可达240℃。为了更好地
控制冷凝阶段，锐德采用专利型的介质注入法，实现焊接制程的单独调节。可选的真空模块则能够实现无空洞焊
接——直接部署在焊接制程结束之后或采用真空预压。该系统所有参数（例如压力或温度）均可灵活设置——最优
质的服务源于完美匹配您的生产需求。
CondensoX Condensation Soldering
Smartline
Inline
Inline loading/
unloading
air operation
联线式
在线装载/卸载
空气制程
X-Line
Inline
Inline loading/
unloading
nitrogen operation
联线式
在线装载/卸载
氮气制程
XC
Manual
Front loading
手动
正面装载
XS Smart
Manual
Loading from
the side and front
手动
正面及侧面装载
XM Smart
Manual / Autom
Loading from
the side
手动/自动
侧面装载
CondensoX-Serie
Nexus
Void free soldering with vacuum
Perfect for different applications
完美适配多种应用的真空接触式焊接系统
Reliable vacuum processes for improved quality
The vacuum soldering process generates tempera-
tures of up to 400 °C and is an ideal solution for void-
free and flux-free applications. The Nexus not only
provides your manufacturing operation with advanta-
ges for the soldering process, but rather for bonding
processes as well.
可靠的真空工艺有效提升焊接质量
Nexus 真空接触式焊接系统， 焊接温度可高达400℃， 是满
足无空洞及无助焊剂应用需求的理想型解决方案。在生产应
用方面，Nexus不仅具备焊接制程上的优势，还同样适用于
胶粘工艺制程。
Without vacuum
非真空制程
With vacuum
真空制程
Up to
400 °C