Viscom_Case_Studies_SP_Deltec_170116_en.pdf

Case Study DEL TEC Intelligently networked 3D inspec tion 3D AX I 3D SPI 3D MXI 3D AOI 3D AX I 3D SPI 3D MXI 3D AOI

Case Study

DELTEC

Intelligently networked

3D inspection

3D AXI 3D SPI 3D MXI3D AOI 3D AXI 3D SPI 3D MXI3D AOI

DELTEC Automotive GmbH & Co. KG,

located in Furth im Wald in Bavaria,

Germany, is an electronics manufac-

turing services (EMS) provider known

throughout Europe. With approximately

250 employees, the company can realize

even the most complex orders with the

highest quality. This requires end-to-end

stability in the series process. For their

SPI, AOI and AXI/MXI inspection technol-

ogies, DELTEC relies on 3D systems from

Viscom AG.

The products manufactured at

DELTEC range from safety and medical

technology through office and data

communication. The company’s larg-

est customer group, however, is the

automotive sector. Components from

DELTEC are found in vehicles from the

most popular European automotive

manufacturers. These components

range from sensor, ignition and control

technology to charging adapters and

window closing systems. Headlights

and taillights make up a significant

portion of their products. This is why

DELTEC experiences the ongoing

changes in the lighting technology

field every day.

Decisive high quality

Until very recently, the LEDs installed

in vehicles typically had a classical

component body with leads on the

sides. New types of LED components,

for example, the chip-scale packages

(CSP), no longer have sheathing that

extends past the light source. The

illuminant surface dictates the size

of the component. In SMD produc-

tion (surface-mounted device), this

change resulted in new challenges to

be professionally mastered. Markus

Seidl, head of quality management at

DELTEC, sums up these requirements:

“It all comes down to the paste volume

on the printed circuit board, how

it flows, how it appears in the X-ray

image and how high the percentage

of voids is; position accuracy is also

crucial.” Quality and zero defect escape

are basic prerequisites in the automo-

tive industry. “This concentration on

quality is also reflected in our technol-

ogies. We work closely with suppliers

that place an equally strong emphasis

on technological value,” adds Thomas

Fischer, production and process tech-

nology manager at DELTEC. For these

reasons, one of the company’s reflow

ovens is equipped with a vacuum

chamber. “Naturally, the results under

vacuum are excellent. We can achieve

less than two percent air inclusion

with this technology,” declares Fischer.

But the disadvantage of this option is

increased cycle time.

Ultra-modern inspection

technologies

About 25 percent of the production

surface at DELTEC is devoted to

inspection technologies. Machines

and software from the automatic

optical inspection (AOI), solder paste

inspection (SPI) as well as automatic

and manual X-ray inspection (AXI/MXI)

areas are central elements in quality

management. DELTEC applies them

to the corresponding paste and solder

joint inspections, random testing of

complex automatic processes and to

making high-performance, high-qual-

ity large series production a reality.

Strong partners on the entire line

“This concentration on quality is also reected

in our technologies. We work closely with suppliers

that place an equally strong emphasis on

technological value.”

Harry Kuckelkorn, general manager at DELTEC, and account manager

Walter Schneider from Viscom in front of the S3088 SPI

These 3D inspection systems all come

from Viscom in Hanover, Germany.

Among them are several S3088 SPI

and S3088 ultra systems. This has a de-

cisive advantage: Using the combined

results for process analysis and qualifi-

cation is relatively simple. The data this

requires are generated and evaluated

on a software platform spanning all

the systems. One exceptionally useful

option in this context is Viscom

training for the DELTEC employees

occupied with process support and

inspection program generation.

Increasing piece counts at DELTEC are

just one of many reasons intelligent,

automated inspection is more and

more indispensable. “We passed the

ten-million-piece mark for the first

time in 2015. This included extremely

complex electronic assemblies, as

well as the simplest. But this is also an

important topic for Viscom, because

every single piece passes through the

SPI and AOI systems,” explains Rainer

Müller, manager of marketing and

sales at DELTEC.

3D SPI for more information

From DELTEC’s perspective, paste

print represents the most important

causal variable in the SMD process.

A 3D paste inspection provides the

employees comprehensive process-

relevant data essential for qualifying

and stabilizing a series process. As

well, more and more of DELTEC’s

automotive customers insist on

a 3D paste inspection for hidden

solder joints. Here, the images and

measurement values generated by

the inspection are a great help in

classifying defects. Fischer states,

“With this inspection technology, we

are handed information about vol-

ume, paste height and other aspects

and suddenly see, there are actually

differences between one and another

of the components which could not be

determined in any other way.”

As one example, the paste print for

0201 components can no longer

be inspected manually. Automatic

inspection is the only option and a

paste offset of 200 or 300 µm is already

not acceptable. In their lines, DELTEC

employs automatic data exchange

(Closed Loop) between the Panaso-

nic SP18 stencil printers and Viscom

S3088 SPI solder paste inspection

systems. In practice, this yields con-

crete advantages: Depending on the

solder paste offset values determined

by the 3D SPI system, the print offset

is automatically corrected over several

printed circuit boards. The number of

steps this correction is carried out in

can be defined. For example, an offset

is not corrected in one single step,

but over several intermediate steps.

This then reaches the optimum result.

Fluctuations between printed circuit

board materials can also be easily

compensated with the Closed Loop

from Viscom.

In the past, the print offset had to

be manually adjusted over and over.

“Then it was a matter of extreme

swings in one direction or the other.

This cost time and never resulted in

the quality I would get with simply

automating the adjustment,” recalls

Fischer. With the Viscom paste in-

spection systems, customers can also

optimize their stencil-cleaning cycles

based on the SPI results. Yet another

“With this inspection technology, we are handed

information about volume, paste height and other

aspects and suddenly see, there are actually dierences

between one and another of the components which

could not be determined in any other way.”

From accepting all the smallest parts to delivery of the complete

electronic assemblies, each logistical step at DELTEC is transparent

Classifying inspection results is comfortable and easy on the clearly

laid out, ergonomic HARAN verification station from Viscom