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These 3D inspection systems all come from Visc om in Hanover , Germany . Among them are sever al S3088 SPI and S3088 ultra syst ems. This has a de - cisive advantage: Using the c ombined results for pr ocess analysis and…

DELTEC Automotive GmbH & Co. KG,

located in Furth im Wald in Bavaria,

Germany, is an electronics manufac-

turing services (EMS) provider known

throughout Europe. With approximately

250 employees, the company can realize

even the most complex orders with the

highest quality. This requires end-to-end

stability in the series process. For their

SPI, AOI and AXI/MXI inspection technol-

ogies, DELTEC relies on 3D systems from

Viscom AG.

The products manufactured at

DELTEC range from safety and medical

technology through office and data

communication. The company’s larg-

est customer group, however, is the

automotive sector. Components from

DELTEC are found in vehicles from the

most popular European automotive

manufacturers. These components

range from sensor, ignition and control

technology to charging adapters and

window closing systems. Headlights

and taillights make up a significant

portion of their products. This is why

DELTEC experiences the ongoing

changes in the lighting technology

field every day.

Decisive high quality

Until very recently, the LEDs installed

in vehicles typically had a classical

component body with leads on the

sides. New types of LED components,

for example, the chip-scale packages

(CSP), no longer have sheathing that

extends past the light source. The

illuminant surface dictates the size

of the component. In SMD produc-

tion (surface-mounted device), this

change resulted in new challenges to

be professionally mastered. Markus

Seidl, head of quality management at

DELTEC, sums up these requirements:

“It all comes down to the paste volume

on the printed circuit board, how

it flows, how it appears in the X-ray

image and how high the percentage

of voids is; position accuracy is also

crucial.” Quality and zero defect escape

are basic prerequisites in the automo-

tive industry. “This concentration on

quality is also reflected in our technol-

ogies. We work closely with suppliers

that place an equally strong emphasis

on technological value,” adds Thomas

Fischer, production and process tech-

nology manager at DELTEC. For these

reasons, one of the company’s reflow

ovens is equipped with a vacuum

chamber. “Naturally, the results under

vacuum are excellent. We can achieve

less than two percent air inclusion

with this technology,” declares Fischer.

But the disadvantage of this option is

increased cycle time.

Ultra-modern inspection

technologies

About 25 percent of the production

surface at DELTEC is devoted to

inspection technologies. Machines

and software from the automatic

optical inspection (AOI), solder paste

inspection (SPI) as well as automatic

and manual X-ray inspection (AXI/MXI)

areas are central elements in quality

management. DELTEC applies them

to the corresponding paste and solder

joint inspections, random testing of

complex automatic processes and to

making high-performance, high-qual-

ity large series production a reality.

Strong partners on the entire line

“This concentration on quality is also reected

in our technologies. We work closely with suppliers

that place an equally strong emphasis on

technological value.”

Harry Kuckelkorn, general manager at DELTEC, and account manager

Walter Schneider from Viscom in front of the S3088 SPI

These 3D inspection systems all come

from Viscom in Hanover, Germany.

Among them are several S3088 SPI

and S3088 ultra systems. This has a de-

cisive advantage: Using the combined

results for process analysis and qualifi-

cation is relatively simple. The data this

requires are generated and evaluated

on a software platform spanning all

the systems. One exceptionally useful

option in this context is Viscom

training for the DELTEC employees

occupied with process support and

inspection program generation.

Increasing piece counts at DELTEC are

just one of many reasons intelligent,

automated inspection is more and

more indispensable. “We passed the

ten-million-piece mark for the first

time in 2015. This included extremely

complex electronic assemblies, as

well as the simplest. But this is also an

important topic for Viscom, because

every single piece passes through the

SPI and AOI systems,” explains Rainer

Müller, manager of marketing and

sales at DELTEC.

3D SPI for more information

From DELTEC’s perspective, paste

print represents the most important

causal variable in the SMD process.

A 3D paste inspection provides the

employees comprehensive process-

relevant data essential for qualifying

and stabilizing a series process. As

well, more and more of DELTEC’s

automotive customers insist on

a 3D paste inspection for hidden

solder joints. Here, the images and

measurement values generated by

the inspection are a great help in

classifying defects. Fischer states,

“With this inspection technology, we

are handed information about vol-

ume, paste height and other aspects

and suddenly see, there are actually

differences between one and another

of the components which could not be

determined in any other way.”

As one example, the paste print for

0201 components can no longer

be inspected manually. Automatic

inspection is the only option and a

paste offset of 200 or 300 µm is already

not acceptable. In their lines, DELTEC

employs automatic data exchange

(Closed Loop) between the Panaso-

nic SP18 stencil printers and Viscom

S3088 SPI solder paste inspection

systems. In practice, this yields con-

crete advantages: Depending on the

solder paste offset values determined

by the 3D SPI system, the print offset

is automatically corrected over several

printed circuit boards. The number of

steps this correction is carried out in

can be defined. For example, an offset

is not corrected in one single step,

but over several intermediate steps.

This then reaches the optimum result.

Fluctuations between printed circuit

board materials can also be easily

compensated with the Closed Loop

from Viscom.

In the past, the print offset had to

be manually adjusted over and over.

“Then it was a matter of extreme

swings in one direction or the other.

This cost time and never resulted in

the quality I would get with simply

automating the adjustment,” recalls

Fischer. With the Viscom paste in-

spection systems, customers can also

optimize their stencil-cleaning cycles

based on the SPI results. Yet another

“With this inspection technology, we are handed

information about volume, paste height and other

aspects and suddenly see, there are actually dierences

between one and another of the components which

could not be determined in any other way.”

From accepting all the smallest parts to delivery of the complete

electronic assemblies, each logistical step at DELTEC is transparent

Classifying inspection results is comfortable and easy on the clearly

laid out, ergonomic HARAN verification station from Viscom

plus from Closed Loop: The S3088 SPI

communicates not only with the paste

printer, but with the placement ma-

chine as well. Thus, placement offset

can also be corrected.

Presence inspection

with 3D AOI

In the AOI area, DELTEC uses 3D inspec-

tion especially for SOT (small-outline

transistor) component body detec-

tion. In this case, the advantage of 3D

inspection is greater stability, which is

seen in lower false alarm rates. Thomas

Fischer: “Of course there will always

be important optical factors, such as

the great number of different body

designs with barely enough contrast

to distinguish them from the printed

circuit board background. The 3D AOI

is simply better at this.”

This inspection technology will be

a mainstay at DELTEC in the coming

years. “In the future, we will also record

menisci with 3D AOI; this is a recurring

topic for our customers,” states Fischer.

This involves ensuring the inspected

meniscus actually is IPC-compliant and

definitively extends up to a prescribed

component height. In addition to the

3D inspection, DELTEC also employs

2D and 2.5D methods in the AOI area

to inspect its assemblies (orthogonal

and angled). Inspection libraries, com-

piled and optimized by the company

over 15 years, are the solid basis for

these inspections.

Intelligent data combination

At DELTEC, highly precise assembly

with LEDs is a core process. With mod-

ern LED types, the solder joint quality

can often only be verified with X-ray. If

defects such as air inclusions or solder

beads are then determined, the result

of the paste inspection system is ex-

tremely important for optimizing the

process. By linking the results, DELTEC

can react quickly to such defects. This

is enabled by the data combination

possibilities offered by the Viscom

Quality Uplink. “When the AOI system

indicates that I have, for example, a

bad solder joint, I need to know what

it was caused by. Then I receive the

linked paste information and see, OK, I

have stayed within my limits, but still I

must take action. For example, maybe

the specified paste volume I am work-

ing with is too low. Something like this

is very important, especially during

the sample phase,” emphasizes Fischer.

The relevant image information can

be evaluated with the Viscom Uplink

Process Analyzer (VUPA). The Closed

Loop connections are also a software

element of the Viscom Quality Uplink.

High-value X-ray systems

DELTEC consciously purchased the

Viscom X7056RS with its AOI and AXI

functions so they would be able to

run a combined inspection in cases

where the automatic optical inspection

comes up against its limits, due to

shadowing or other characteristics. The

system is increasingly used for process

qualification. “Recently, we tried out

and evaluated several different stencil

designs for a specific product: a little

more paste, a little less paste, a slightly

modified paste volume. We verified the

results with the AOXI and evaluated the

statistics files,” explains Fischer.

Alongside of this, DELTEC uses the

Viscom X8011 PCB plus for manual

X-ray inspection. One of the advantag-

“Of course there will always be important optical

factors, such as the great number of dierent body

designs with barely enough contrast to distinguish

them from the printed circuit board background.

The 3D AOI is simply better at this.”

At DELTEC, the newest high-value equipment from leading manufacturers

guarantees the highest quality