Viscom_Case_Studies_SP_Deltec_170116_en.pdf - 第4页

plus from Closed Loop: The S3088 SPI communicates not only with the paste printer , but with the placemen t ma - chine as well. Thus, placement offset can also be corrected. Pr esence inspection with 3D A OI In the AOI a…

These 3D inspection systems all come

from Viscom in Hanover, Germany.

Among them are several S3088 SPI

and S3088 ultra systems. This has a de-

cisive advantage: Using the combined

results for process analysis and qualifi-

cation is relatively simple. The data this

requires are generated and evaluated

on a software platform spanning all

the systems. One exceptionally useful

option in this context is Viscom

training for the DELTEC employees

occupied with process support and

inspection program generation.

Increasing piece counts at DELTEC are

just one of many reasons intelligent,

automated inspection is more and

more indispensable. “We passed the

ten-million-piece mark for the first

time in 2015. This included extremely

complex electronic assemblies, as

well as the simplest. But this is also an

important topic for Viscom, because

every single piece passes through the

SPI and AOI systems,” explains Rainer

Müller, manager of marketing and

sales at DELTEC.

3D SPI for more information

From DELTEC’s perspective, paste

print represents the most important

causal variable in the SMD process.

A 3D paste inspection provides the

employees comprehensive process-

relevant data essential for qualifying

and stabilizing a series process. As

well, more and more of DELTEC’s

automotive customers insist on

a 3D paste inspection for hidden

solder joints. Here, the images and

measurement values generated by

the inspection are a great help in

classifying defects. Fischer states,

“With this inspection technology, we

are handed information about vol-

ume, paste height and other aspects

and suddenly see, there are actually

differences between one and another

of the components which could not be

determined in any other way.”

As one example, the paste print for

0201 components can no longer

be inspected manually. Automatic

inspection is the only option and a

paste offset of 200 or 300 µm is already

not acceptable. In their lines, DELTEC

employs automatic data exchange

(Closed Loop) between the Panaso-

nic SP18 stencil printers and Viscom

S3088 SPI solder paste inspection

systems. In practice, this yields con-

crete advantages: Depending on the

solder paste offset values determined

by the 3D SPI system, the print offset

is automatically corrected over several

printed circuit boards. The number of

steps this correction is carried out in

can be defined. For example, an offset

is not corrected in one single step,

but over several intermediate steps.

This then reaches the optimum result.

Fluctuations between printed circuit

board materials can also be easily

compensated with the Closed Loop

from Viscom.

In the past, the print offset had to

be manually adjusted over and over.

“Then it was a matter of extreme

swings in one direction or the other.

This cost time and never resulted in

the quality I would get with simply

automating the adjustment,” recalls

Fischer. With the Viscom paste in-

spection systems, customers can also

optimize their stencil-cleaning cycles

based on the SPI results. Yet another

“With this inspection technology, we are handed

information about volume, paste height and other

aspects and suddenly see, there are actually dierences

between one and another of the components which

could not be determined in any other way.”

From accepting all the smallest parts to delivery of the complete

electronic assemblies, each logistical step at DELTEC is transparent

Classifying inspection results is comfortable and easy on the clearly

laid out, ergonomic HARAN verification station from Viscom

plus from Closed Loop: The S3088 SPI

communicates not only with the paste

printer, but with the placement ma-

chine as well. Thus, placement offset

can also be corrected.

Presence inspection

with 3D AOI

In the AOI area, DELTEC uses 3D inspec-

tion especially for SOT (small-outline

transistor) component body detec-

tion. In this case, the advantage of 3D

inspection is greater stability, which is

seen in lower false alarm rates. Thomas

Fischer: “Of course there will always

be important optical factors, such as

the great number of different body

designs with barely enough contrast

to distinguish them from the printed

circuit board background. The 3D AOI

is simply better at this.”

This inspection technology will be

a mainstay at DELTEC in the coming

years. “In the future, we will also record

menisci with 3D AOI; this is a recurring

topic for our customers,” states Fischer.

This involves ensuring the inspected

meniscus actually is IPC-compliant and

definitively extends up to a prescribed

component height. In addition to the

3D inspection, DELTEC also employs

2D and 2.5D methods in the AOI area

to inspect its assemblies (orthogonal

and angled). Inspection libraries, com-

piled and optimized by the company

over 15 years, are the solid basis for

these inspections.

Intelligent data combination

At DELTEC, highly precise assembly

with LEDs is a core process. With mod-

ern LED types, the solder joint quality

can often only be verified with X-ray. If

defects such as air inclusions or solder

beads are then determined, the result

of the paste inspection system is ex-

tremely important for optimizing the

process. By linking the results, DELTEC

can react quickly to such defects. This

is enabled by the data combination

possibilities offered by the Viscom

Quality Uplink. “When the AOI system

indicates that I have, for example, a

bad solder joint, I need to know what

it was caused by. Then I receive the

linked paste information and see, OK, I

have stayed within my limits, but still I

must take action. For example, maybe

the specified paste volume I am work-

ing with is too low. Something like this

is very important, especially during

the sample phase,” emphasizes Fischer.

The relevant image information can

be evaluated with the Viscom Uplink

Process Analyzer (VUPA). The Closed

Loop connections are also a software

element of the Viscom Quality Uplink.

High-value X-ray systems

DELTEC consciously purchased the

Viscom X7056RS with its AOI and AXI

functions so they would be able to

run a combined inspection in cases

where the automatic optical inspection

comes up against its limits, due to

shadowing or other characteristics. The

system is increasingly used for process

qualification. “Recently, we tried out

and evaluated several different stencil

designs for a specific product: a little

more paste, a little less paste, a slightly

modified paste volume. We verified the

results with the AOXI and evaluated the

statistics files,” explains Fischer.

Alongside of this, DELTEC uses the

Viscom X8011 PCB plus for manual

X-ray inspection. One of the advantag-

“Of course there will always be important optical

factors, such as the great number of dierent body

designs with barely enough contrast to distinguish

them from the printed circuit board background.

The 3D AOI is simply better at this.”

At DELTEC, the newest high-value equipment from leading manufacturers

guarantees the highest quality

es: “It is possible to take a printed cir-

cuit board to the machine and quickly

see what is happening with a critical

solder joint, without having to set up

an elaborate program,” says Fischer.

The system lends itself to highly ver-

satile application and enables imme-

diate manual inspection if anomalies

crop up in production or for handling

complaints. The application fields are

similar to those for the X7056RS, espe-

cially for checking solder filling in the

THT (through-hole technology) area or

inspecting SMD voids.

Statistics and traceability

For real-time evaluation, DELTEC lever-

ages the possibilities offered by Viscom

statistical process control (SPC). Each

production line is equipped with an

SPC monitor. An update arrives every

two or three minutes. This means that

when, for example, a real defect is

classified on the AOI station, the cor-

responding display promptly appears

on the line and the operator receives

just-in-time information indicating

whether the specified limits are main-

tained or intervention is called for.

At DELTEC, any electronic assemblies

found to be defective are locked

against further processing steps.

This was made possible by a Notes

databank solution based on barcode

control, which the company devel-

oped in concert with an external

programming team. “Result files

are stored within several different

inspection steps. Our DELTEC locking

system, or DLS, collects these files and

if a circuit board receives a negative

status, it is correspondingly locked

during the downstream processes,”

explains Fischer, and continues:

“We have 100 percent traceability. A

barcode scanner is positioned before

each machine. Affixing labels is also a

very important step and is the first link

in the complete traceability chain.”

ISO/TS 16949 and other

certifications

DELTEC’s orientation stands on a long

history. In 1996, the company was

certified in accord with ISO 9001, an

essential requirement level for quality

management. DELTEC began setting

its course for the automotive sector in

2003, as it opened its new Engineering

Center. “At this point it was clear that

we needed to work on our structures

again to meet the requirements of

ISO/TS 16949,” states Harry Kuckelkorn,

general manager at DELTEC. This is a

set of technical specifications based

on ISO 9001, specifically arranged for

the automotive industry and one of

the important foundations for the

DELTEC processes and systems. “This

is 28 sections and over 100 orienta-

tion points for controlling complex

processes within the company and to

ensure the reaction capabilities need-

ed to enact preventive safeguards,”

explains Kuckelkorn.

Certification under environmental

management standard ISO 14001 fol-

lowed in 2006; in the near future, the

company expects to complete the ISO

13485 certification process for medical

products. Preparations for this step are

in full swing.

Harry Kuckelkorn knows what he is

talking about. He is a council member

and delegate at the German Institute

for Quality (DGQ) and currently has a

teaching assignment with the Insti-

tute for Police and Safety Research

at the School of Public Management

in Bremen, Germany, where he holds

lectures on quality management and

conducts the examinations in this

subject. “I do this mainly to give back

something of what I was given when I

was a student,” says Kuckelkorn about

his teaching activity.

Long-term advance planning

The DELTEC general manager under-

scores the major role played by the

long-term character of the automotive

sector: “Processing a request can take

Two DELTEC colleagues with a number of mutual interfaces: Thomas Fischer, manager of production

and technology, and Markus Seidl, head of quality management