AdvantisV_Platform_brochure.pdf - 第3页

Sustained Profitability Maximum Productivity Unmatched value Low cost of ownership • Low CAPEX/entry cost; buy only what you need • Intelligent design with minimal maintenance requirements Premium technologies • Same tec…

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Value. Scalability. Performance.
Versatility for any production environment
As an electronics manufacturer, you need a solution that is tailored
to your production requirements with the ability to adapt within them.
The AdvantisV portfolio enables you to congure your lines to excel
with the products you run and the way you run them – all at the lowest
possible cost, regardless of product mix.
Unmatched value
Low cost of ownership
Premium technologies
Investment protection
Flexible, scalable foundation
Simplied base congurations, easily integrated options
Flexibility for a wide range of applications
Class-leading performance
Exceptional and predictable output
Highest accuracy and yield
Advanced tools for streamlined NPI and changeovers
Value-driven solutions for cost-sensitive markets
Redening midrange platform capabilities
In a fast-paced market, electronics manufacturers are being pressed to optimize
eciency and productivity to meet aggressive market demands. For Tier II/Tier III OEMs/
EMSs in a highly competitive landscape, this requires versatile, high-performance
production solutions that can changeover quickly and seamlessly and deliver high-
quality products while preserving razor-thin margins.
Universal Instruments’ AdvantisV™ is a powerful, cost-eective tool that gives the
most aspiring manufacturers everything needed to stand above the rest. AdvantisV
is a next-generation midrange platform that combines the best in technology and
performance with a low entry price and unmatched scalability. AdvantisV gives you
all the functionality you need today, with a growth path for tomorrow’s challenges.
AdvantisV delivers aordable performance without compromise.
New Benchmark
Sustained Profitability
Maximum Productivity
Unmatched value
Low cost of ownership
Low CAPEX/entry cost; buy only what you need
Intelligent design with minimal maintenance requirements
Premium technologies
Same technologies found on Universal’s agship Fuzion Platform
VRM linear motor: thermally stable, 1µm resolution, dual-drive with fast motion response and settling times
Exclusive head technologies with high capacity and signicant overlapping component ranges
Intelligent feeders with closed-loop validation
High-resolution digital line-scan cameras for superior component range, speed and FPY
Investment protection
Easily adapts to future requirements
Robust technologies for long usable life
Flexible, scalable foundation
Simplied base congurations, easily integrated options
Minimal base congurations to grow with your requirements
Large catalog of available licensed premium options
Flexibility for a wide range of applications
Largest board size capability up to 1.3 meters long
Component range from 01005–150mm square and up to 25mm tall
No head changes or machine recongurations for new products
Supports all feeder input types (strip, tape, tube, tray, bulk, odd-form)
Multiple changeover schemes (bank exchange, family setups, feeder
anywhere)
Class-leading performance
Exceptional and predictable output
Single and dual-beam variants with throughputs up to 66,500 cph per module
Up to 7X the number of multifunction spindles for higher throughput, no bottlenecks
Consistent output from prototyping to cost-eective volume production
Highest accuracy and yield
1µm positioning, 27µm system-level accuracy
Single optimized pick-up point for highest yield
Closed-loop controls (nozzle contamination check, dynamic height adjust, self-diagnostics)
Advanced tools for streamlined NPI and changeovers
Direct CAD/Gerber import with BOM merge
Oine board verication and component teach
Comprehensive online editing and validation tool set
Fastest time to market, highest yields
Sequential process for complete board build
Quickly generate and optimize ducial, feeder, placement,
and component information
Full editing capability for all aspects of programming in
pre-production NPI mode, and dynamic on-the-y editing in
full production mode eliminate need for machine stoppages
and reduce scrap and repair costs
Semi-automated solder paste and post-placement inspection
Oine
Component Teach
Virtual Sticky Tape,
P2P Data Validation
Feeder
Banks
Factory
Software
NPI
Software
Post-Placement
Inspection
Component
Inspection
Pre-Placement
Inspection
Online
Component Teach
Feeder
Inspection
Fiducial
Inspection
Validation
Feeders
Nozzle
Changers
Board
Size
Heads
Cameras
Board
Support
Intuitive GUI with
simplied NPI process ow
Technologies for Performance, Flexibility & Yield
Base Frame
Robust and stable foundation for accurate and repeatable performance
Single welded structure precision machined to within 1µm from corner to
corner for extreme accuracy
VRM Linear Motor Positioning System
High-accuracy (1µm resolution), closed-loop positioning control supports
current, converging and emerging technologies
High acceleration – up to 2.5G
Dual-drive control is self correcting and reduces settle times
Thermally stable, non-magnetic
Fewer moving parts for minimal maintenance and no adjustments
20-year lineage – thousands of proven VRM platforms in the eld today
Direct drive technology stands the test of time to maintain its accuracy
indenitely; backed by a ve-year warranty
Magellan Digital Upward-Looking Camera
Exceptional exibility for NPI through high-volume, high-throughput applications
High resolution of 1024 x 1024 pixels to facilitate small part feature recognition
Large 55mm eld-of-view improves throughput for applications that typically require multiple FOVs
Complete feature-based recognition: full-lead/all-bump, missing-ball, orientation check, odd-form features
Front, side, and on-axis lighting that can be used individually or in combination
Lighting intensity is consistent across viewable area for faster, more accurate alignment and inspection
FZ™ Placement Heads
Extensive component ranges that signicantly overlap between heads, delivering superior line balancing and the
ability to simply change the program, and not the line or heads, when changing products
Robust design, low maintenance, industry-leading accuracy and performance
FZ7™ Placement Head
The FZ7 head quickly and accurately
places components as small as 0201 up
to 55mm square with single eld-of-view
inspection and up to 25mm tall.
Precision accuracy (27µm @ Cpk>1)
Advanced odd-form capability and
insertion forces up to 5kg for press-t
or pin-in-paste applications
Components up to 150mm with
multiple elds of view
FZ30™ Placement Head
The FZ30 is the industry’s fastest, most accurate and most exible high-speed placement head.
Maximized Performance
Industry’s fastest tact time (55ms), 35,000 cph per head
Industry’s most accurate high-speed placement head (34µm)
Little derate, not reliant on gang picking, predictable throughputs on any mix
Uncompromising Flexibility
Largest component range for a high-speed head (01005–30mm square):
lead-less, leaded, bumped, odd-form with little need to skip spindles
Full-lead/all-bump inspection, missing-ball inspection/orientation check
Highest Quality and Yields
Vertical Part Sensor (VPS) validates part presence, orientation, and thickness;
inspects nozzles and enables on-the-y exchange of suspect nozzles
Auto Pocket Teach and touchdown sense at both pick and place improves pick
ppm, guarantees ideal placement force, and reduces nozzle wear
Single pick point eliminates gang picking (multiple pick point) concerns
Auto nozzle centering/contamination check/bypass assure sustained yields
FZ30 - Unmatched exibility and performance FZ30 - Best-in-class accuracy of 34µm
FZ Placement Heads
Chip
LED
Tant Cap
SOIC
TSOP
DPAK
QFP
BGA
PLCC
CSP
Electrolytic Cap
Connectors
CCGA
BNGA
Odd-Form
Pin-in-Paste