AdvantisV_Platform_brochure.pdf - 第4页
T echnologies for Performance, Flexibility & Yield Base Frame • Robust and stable foundation for accurate and repeatable performance • Single welded structure precision machined to within 1µm from corner to corner fo…
Sustained Profitability
Maximum Productivity
Unmatched value
Low cost of ownership
• Low CAPEX/entry cost; buy only what you need
• Intelligent design with minimal maintenance requirements
Premium technologies
• Same technologies found on Universal’s agship Fuzion Platform
• VRM linear motor: thermally stable, 1µm resolution, dual-drive with fast motion response and settling times
• Exclusive head technologies with high capacity and signicant overlapping component ranges
• Intelligent feeders with closed-loop validation
• High-resolution digital line-scan cameras for superior component range, speed and FPY
Investment protection
• Easily adapts to future requirements
• Robust technologies for long usable life
Flexible, scalable foundation
Simplied base congurations, easily integrated options
• Minimal base congurations to grow with your requirements
• Large catalog of available licensed premium options
Flexibility for a wide range of applications
• Largest board size capability up to 1.3 meters long
• Component range from 01005–150mm square and up to 25mm tall
• No head changes or machine recongurations for new products
• Supports all feeder input types (strip, tape, tube, tray, bulk, odd-form)
• Multiple changeover schemes (bank exchange, family setups, feeder
anywhere)
Class-leading performance
Exceptional and predictable output
• Single and dual-beam variants with throughputs up to 66,500 cph per module
• Up to 7X the number of multifunction spindles for higher throughput, no bottlenecks
• Consistent output from prototyping to cost-eective volume production
Highest accuracy and yield
• 1µm positioning, 27µm system-level accuracy
• Single optimized pick-up point for highest yield
• Closed-loop controls (nozzle contamination check, dynamic height adjust, self-diagnostics)
Advanced tools for streamlined NPI and changeovers
• Direct CAD/Gerber import with BOM merge
• Oine board verication and component teach
• Comprehensive online editing and validation tool set
Fastest time to market, highest yields
• Sequential process for complete board build
• Quickly generate and optimize ducial, feeder, placement,
and component information
• Full editing capability for all aspects of programming in
pre-production NPI mode, and dynamic on-the-y editing in
full production mode eliminate need for machine stoppages
and reduce scrap and repair costs
• Semi-automated solder paste and post-placement inspection
Oine
Component Teach
Virtual Sticky Tape,
P2P Data Validation
Feeder
Banks
Factory
Software
NPI
Software
Post-Placement
Inspection
Component
Inspection
Pre-Placement
Inspection
Online
Component Teach
Feeder
Inspection
Fiducial
Inspection
Validation
Feeders
Nozzle
Changers
Board
Size
Heads
Cameras
Board
Support
Intuitive GUI with
simplied NPI process ow
Technologies for Performance, Flexibility & Yield
Base Frame
• Robust and stable foundation for accurate and repeatable performance
• Single welded structure precision machined to within 1µm from corner to
corner for extreme accuracy
VRM Linear Motor Positioning System
• High-accuracy (1µm resolution), closed-loop positioning control supports
current, converging and emerging technologies
• High acceleration – up to 2.5G
• Dual-drive control is self correcting and reduces settle times
• Thermally stable, non-magnetic
• Fewer moving parts for minimal maintenance and no adjustments
• 20-year lineage – thousands of proven VRM platforms in the eld today
• Direct drive technology stands the test of time to maintain its accuracy
indenitely; backed by a ve-year warranty
Magellan Digital Upward-Looking Camera
• Exceptional exibility for NPI through high-volume, high-throughput applications
• High resolution of 1024 x 1024 pixels to facilitate small part feature recognition
• Large 55mm eld-of-view improves throughput for applications that typically require multiple FOVs
• Complete feature-based recognition: full-lead/all-bump, missing-ball, orientation check, odd-form features
• Front, side, and on-axis lighting that can be used individually or in combination
• Lighting intensity is consistent across viewable area for faster, more accurate alignment and inspection
FZ™ Placement Heads
• Extensive component ranges that signicantly overlap between heads, delivering superior line balancing and the
ability to simply change the program, and not the line or heads, when changing products
• Robust design, low maintenance, industry-leading accuracy and performance
FZ7™ Placement Head
The FZ7 head quickly and accurately
places components as small as 0201 up
to 55mm square with single eld-of-view
inspection and up to 25mm tall.
• Precision accuracy (27µm @ Cpk>1)
• Advanced odd-form capability and
insertion forces up to 5kg for press-t
or pin-in-paste applications
• Components up to 150mm with
multiple elds of view
FZ30™ Placement Head
The FZ30 is the industry’s fastest, most accurate and most exible high-speed placement head.
Maximized Performance
• Industry’s fastest tact time (55ms), 35,000 cph per head
• Industry’s most accurate high-speed placement head (34µm)
• Little derate, not reliant on gang picking, predictable throughputs on any mix
Uncompromising Flexibility
• Largest component range for a high-speed head (01005–30mm square):
lead-less, leaded, bumped, odd-form with little need to skip spindles
• Full-lead/all-bump inspection, missing-ball inspection/orientation check
Highest Quality and Yields
• Vertical Part Sensor (VPS) validates part presence, orientation, and thickness;
inspects nozzles and enables on-the-y exchange of suspect nozzles
• Auto Pocket Teach and touchdown sense at both pick and place improves pick
ppm, guarantees ideal placement force, and reduces nozzle wear
• Single pick point eliminates gang picking (multiple pick point) concerns
• Auto nozzle centering/contamination check/bypass assure sustained yields
FZ30 - Unmatched exibility and performance FZ30 - Best-in-class accuracy of 34µm
FZ Placement Heads
Chip
LED
Tant Cap
SOIC
TSOP
DPAK
QFP
BGA
PLCC
CSP
Electrolytic Cap
Connectors
CCGA
BNGA
Odd-Form
Pin-in-Paste
NPI–low-volume OEM/EMS, higher-complexity markets
Lowest entry price for single scalable machine solution
Full component range: 0201–150mm, micro BGA
Advanced NPI tool suite, auto component teach and edit on-the-y for immediate rst article
Direct CAD/Gerber import with BOM merge
NPI / All-in-One
Single-machine solution from
prototyping to LVHM
Medium-Volume EMS or OEM, White Goods, Military, Medical
20–35K line cph real throughput
Rapid changeover with full feeder bank exchange, family setups, oine setup and validation
(260) 8mm inputs, tray, track feeder support
Large PCB size range: up to 508 x 813mm (20” x 32”)
Large component range: 01005–150mm, connectors, odd-form
Low-Volume, High-Mix
Aordable, highly exible
full-line solution
(quote any job)
Medium-Volume, Medium-Mix
Volume eciency for more complex
and changing environments
Medium Mix EMS or OEM, Industrial, Set-top box, Telecom
35k–50k line cph real throughput
(400) 8mm inputs, 40 random access tray inputs, track feeder support
Large PCB size range: up to 508 x 813mm (20” x 32”)
Extensive component range overlap across all modules for easy balancing
Unique Higher-Volume
Single or multi-machine solution for
specialized applications
Higher-Volume LED Lighting, Memory modules (RAM, USB)
30–40K line cph real throughput
Large PCB size range: up to 508 x 1300mm (20” x 52”)
Extensive component range of single head for chips–TSOPs and BGAs
Single pick-up point for highest real speeds and yields
Solutions for Any Market
AdvantisV Portfolio
AdvantisV1-07
Single-Beam Models
AdvantisV1-07
AdvantisV1-30
Dual-Beam Models
AdvantisV2-60
AdvantisV1-30 AdvantisV1-07/DTF
AdvantisV1-30 AdvantisV1-30
AdvantisV2-60
Versatile IC placement platform, perfect for special processes such as Pin-in-Paste and OFA
Single-beam, dual-drive overhead gantry system
One 7-spindle FZ7 high-speed multifunction placement head
Upward-looking vision system
Superb for high-mix NPI environments and large board applications. Also a high-volume line booster.
Single-beam, dual-drive overhead gantry system
One 30-spindle rotary FZ30 high-speed turret placement head with single pick point
On-the-head optics
Flexible, high-speed productivity for medium-volume environments. A powerful line booster or
high-performance small part placer.
Dual-beam, dual-drive overhead gantry system
Two 30-spindle rotary FZ30 high-speed turret placement heads with single pick point
On-the-head optics
Model Throughput (cph) Accuracy (µm@>1.00 Cpk) Max Board Size Max Feeder Inputs (8mm) Component Range (mm)
AdvantisV1-07 16,500 (Max)
11,400 (1-Bd IPC Chips)
±38 (Chips)
±27 (1Cs)
508 x 813mm / 20 x 32” (Std)
508 x 1300mm / 20 x 52” (Opt)
128 (1 ULC) (0201) .25 x .5 x .15 (Min)
150 square and up to 40 tall
AdvantisV1-30 35,000 (Max)
22,600 (1-Bd IPC Chips)
±34 (Chips)
±34 (1Cs)
508 x 1016mm / 20 x 40” (Std)
508 x 1300mm / 20 x 52” (Opt)
136 (01005) .18 x .38 x .10 (Min)
30 x 30 x 6 (Max)
AdvantisV2-60 66,500 (Max)
40,500 (1-Bd IPC Chips)
±34 (Chips)
±34 (1Cs)
508 x 1016mm / 20 x 40” (Std)
508 x 1300mm / 20 x 52” (Opt)
136 (01005) .18 x .38 x .10 (Min)
30 x 30 x 6 (Max)
AdvantisV1-07/DTF