SIPLACE D2 规格说明书英文版.pdf - 第7页

7 Machine Performance Incredibly fast new prod- uct introdu ction (NPI) wi th external set-up preparation and vision teaching The SIPLACE D2 really comes into its ow n in flexible production environments. For examp le, N…

Machine Description

Fast and flexible dual

gantry machine

High-tech with an optimum

price/performance ratio:

this was the SIPLACE team's

aim for the SIPLACE D2 - the

fast and flexible dual-gantry

machine from the new

SIPLACE D-series genera-

tion. Now you can benefit

from the innovative added

value that the SIPLACE D2

creates with its combination

of innovative and proven

technology.

The highlights of the

SIPLACE D2 at a glance:

Flexible head combina-

tions to meet every need

The SIPLACE D2 is

equipped with two gantries

for high speed and flexibility.

Their head modularity allows

you to choose between the 6

and 12-nozzle Collect&

Place heads. This ensures

that you always have the

optimum configuration for

individual requirements.

During placement, the place-

ment heads fetch the com-

ponents from the at-rest

component supply, and set

them down on the PCB,

which is also stationary.

This proven SIPLACE princi-

ple guarantees reliable pick-

up of even the smallest com-

ponents, prevents the com-

ponents slipping on the PCB

and minimizes traversing

paths.

Optimized transport condi-

tions with the flexible dual

conveyor

The user also has access to

different variants of the PCB

conveyor: SIPLACE single

conveyor and flexible

SIPLACE dual conveyor.

The latter offers all the bene-

fits of the conventional dual

conveyor, such as reducing

non-productive downtimes,

combined with the option of

using the single conveyor.

01005 placement

Even the trend towards com-

ponent miniaturization is no

problem for the SIPLACE D2

since it is equipped as stan-

dard to place 01005 compo-

nents. To do this, you simply

have to implement the optio-

nal 01005 package for

12-nozzle Collect&Place

heads. You can then process

even the tiniest components

currently available without

any problems.

Machine Performance

Incredibly fast new prod-

uct introduction (NPI) with

external set-up preparation

and vision teaching

The SIPLACE D2 really

comes into its own in flexible

production environments.

For example, NPI can be

implemented as fast as pos-

sible with the SIPLACE Vir-

tual Product Build. This NPI

solution allows you to pro-

gram offline, set up and

check offline and to make

adjustments offline with the

SIPLACE Pro software.

This increases machine utili-

zation and reduces waste.

And with respect to the cur-

rent production run, the

SIPLACE vision teaching

station also makes it

extremely simple and fast to

generate component shape

descriptions, even for com-

plex components. The set-up

process starts once you have

optimized the product and

defined all the components in

the programming system.

This is also done externally

and then checked by means

of the barcode and data

transfer. This makes the

product change child's play:

the program and all the data

are sent to the line and the

new production run can start.

It just can't get any faster!

Lowest dpm with set-up

verification, sophisticated

sensors and AOI

The highest machine quality

allows the SIPLACE D2 to

produce the highest product

quality. This is guaranteed by

a number of additional

features.

Sensors check the presence

and position of the compo-

nents before and after every

pick-up and placement oper-

ation at the placement head.

The digital SIPLACE Vision

System detects the com-

ponents faster and more

reliably than the old analog

technology. Finally, with

SIPLACE OS, the SIPLACE

team is offering an AOI

(Automatic Optical Inspec-

tion) device that checks the

products and signals errors

to the placement machine.

This network of tests consid-

erably lowers dpm rates and

increases the first pass yield.

Types of placement

head

12-nozzle Collect&Place head (C&P12)

6-nozzle Collect&Place head (C&P6)

PLEASE NOTE IPC value [comp./h]

According to the vendor-neutral conditions of the IPC 9850 standard pub-

lished by the Association of Connecting Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance

tests. It corresponds to the conditions set out in the SIPLACE scope of

service and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable

conditions for each machine type and setting, and corresponds to the theor-

etical conditions normally used in the industry.

Number of gantries 2

IPC value Benchmark value Theoretical value

Placement head

configuration and

placement head rate

C&P12 /

C&P12

C&P12 / C&P6

C&P6 / C&P6

27,200

20,900

16,500

31,000

23,000

19,500

40,500

32,000

23,000

Modular Machine Concept

Step 1: Placement system with 2 gantries

Step 2: Selection of the placement heads

12-nozzle C&P head

6-nozzle C&P head

Step 3: Selection of the conveyor

Single conveyor

Flexible dual conveyor

Step 4: Selection of the

component changeover table

Step 5: Selection of the feeder modules

S tape feeder modules