德森印刷机说明书之操作手册-4d1321fc284ac850ac024234.pdf - 第25页
深圳德森精密设备有限公司 Shenzhen Desen Pre cision Machine Co., Ltd. - 25 - 3. A dj ustment of squee gee ’ s travel: o pen Parame ter S etting i n b ar to ol 1 a nd o pen i ts d ialog b o x by i nputting the secondar y p assword “ p…
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 24 -
紧气缸用挡环固定及移动 Y 向定位挡住网框；
6) Switch on “ Screen frame standing valve ” and “ Screen frame clamping valve ” to fix and
clamp the screen frame. A
t
the same time, fix the screen frame locking cylinder on the
machine firmly with a limit ring and cover the screen frame by moving the positioning device
of axis
Y;
7) 关闭 “ Z 轴上升
”
，使工作台回到取象位置；
7) Switch off “ Axis Z rise ” to make the workbench return to the image taking position; and
8) 单击 “ 标志点设置
”
，进入 “ 标志点采集 ” 对话框。
8) Click “ S ignalized point setting ” to enter the “ Signalized point collect ” dialog box .
8.
在 “ 标志点采集 ” 对话框中，进入标志点采集和 PCB 校正，完成 PCB 与网板位置视
觉校正并对准。
8. In the “ Signalized point collect ” dialog box , enter signalized point collection and PCB
calibration to finish the visual calibration and alignment of the positions of PCB board and screen;
9.
在 标志点设置 完后，单击 “ 标志点设置 ” 对话框中的 [ 确认 ] ，回到生产编辑窗口。
9. After the signalized point setting is done, click Enter in the “ S ignalized point setting ” dialog box
to return to the production editing window; and
10.
单击主工具栏中的 “ 文件 / 保存
”
，将此次 PCB 板的参数设置保存到新建的文件名下，
待开始生产时打开此档使用。
10. Click “ File/Save ” in the main tool bar to save the parameter setting of PCB board this time to a
newly created file which shall be opened for use after production is started.
注： 以上操作说明详见第四章介绍。
Note:
Note:
Note:
Note:
see
see
see
see
Chapter
Chapter
Chapter
Chapter
IV
IV
IV
IV
for
for
for
for
detailed
detailed
detailed
detailed
introduction
introduction
introduction
introduction
of
of
of
of
the
the
the
the
operations
operations
operations
operations
above.
above.
above.
above.
3.2.4
3.2.4
3.2.4
3.2.4
刮刀的安装
3.2.4
3.2.4
3.2.4
3.2.4
Installation
Installation
Installation
Installation
of
of
of
of
squeegee
squeegee
squeegee
squeegee
11.
打开机器前盖；
1. Open the front cover of machine;
12.
移动刮刀横梁到适合位置，将装有刮刀片的刮刀压板装到刮刀头上；
2. Move the squeegee beam to an appropriate position and install the squeegee pressure plate with
a squeegee blade to the squeegee head;
13.
刮刀行程的调整：打开工具栏 1 中 [ 参数设置 ] ，输入二级密码 ” printer9 ” 打开 [ 参数设置 ]
对话框，进行刮刀升降行程的设置；
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 25 -
3. Adjustment of squeegee
’
s
travel: open Parameter Setting in bar tool 1 and open its dialog box by
inputting the secondary password “ printer9 ” to carry out setting for the lift travel of squeegee; and
14.
刮刀行程调整以刮刀降到最低位置刀片正好压在钢网板上为宜。
4. Adjust the squeegee
’
s
travel till the squeegee blade just presses the steel screen when the
squeegee declines to the lowest position.
注意：
刮刀片安装前应检查其刀口是否平直，有无缺损。
Note: before installation of squeegee, inspect whether the knife-edge is straight and whether
it
has
damage.
3.2.5
3.2.5
3.2.5
3.2.5
刮刀压力和速度的选择
3.2.5
3.2.5
3.2.5
3.2.5
Choosing
Choosing
Choosing
Choosing
of
of
of
of
pressure
pressure
pressure
pressure
and
and
and
and
speed
speed
speed
speed
of
of
of
of
squeegee
squeegee
squeegee
squeegee
刮刀的压力及刮刀速度是钢网印刷中两个重要的工艺参数。
Squeegee pressure and speed are two key technological parameter
s
in the printing by means of
steel mesh.
刮刀速度： 选取的原则是刮刀的速度和锡膏的粘稠度及 PCB 板上 SMD 的最小引脚间距
有关，选择锡膏的粘稠度大，则刮刀的速度要低，反之亦然。对刮刀速度的选择，一般先从
较小压力开始试印，慢慢加大，直到印出好的焊膏为止。速度范围为 15 ～ 120 mm/s 。在印刷
细间距时应适当降低刮刀速度，一般为 15 ～ 30mm/s ，以增加锡膏在窗口处的停滞时间，从 而
增加 PCB 焊盘上的锡膏；印刷宽间距组件时速度一般为 30 ～ 12 0mm/s
。 （＞
0.5mm pitch 为宽
间距，＜ 0.5mm pitch 为细间距〕
Squeegee speed: the speed choosing principle is that squeegee speed is related to the viscosity
of solder paste and the minimum pin pitch of SMD on PCB board: larger viscosity of solder paste
corresponds to lower squeegee speed, vice versa . W hen choosing squeegee speed, trial printing
always starts from lower pressure, and then pressure increases gradually till good solder paste is
printed. Squeegee speed scope is 15 ～ 120 mm/s . In small pitch printing, the squeegee speed shall be
decreased appropriately to 15 ～ 30mm/s , in order to prolong the stagnation period of solder paste
at
the window and increase the solder paste left on PCB bonding pad. G enerally speaking, the wide
pitch printing needs a speed of 30 ～ 12 0mm/s (the pitch larger than 0.5mm pitch is wide pitch and
that smaller than 0.5mm pitch is small pitch).
本机器刮刀速度允许设置范围为 0 ～ 200 mm/s 。
The setting scope of squeegee speed of this printing machine is 0 ～ 200 mm/s .
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 26 -
刮刀压力： 压力直接影响印刷效果，压力以保证印出的焊膏边缘清晰，表面平整，厚度
适宜为准。压力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因
此刮刀压力一般是设定为 0.5 ～ 10kg 。
Squeegee pressure: pressure has a direct bearing on the printing effect.
A
proper pressure shall
guarantee clear edges, smooth surface and appropriate thickness of solder paste.
T
oo small pressure
will result in insufficient solder paste and further cold joints; and too large pressure will lead to
solder paste connection and further bridging . G enerally speaking, squeegee pressure is set during
0.5 ～ 10kg .
注：每增加或减小 1kg 刮刀行程 ± 0.4mm
Note: for the increment or decrease of 1kg, the squeegee travel will change by ± 0.4mm.
3.2.6
3.2.6
3.2.6
3.2.6
脱模速度和脱模长度
3.2.6
3.2.6
3.2.6
3.2.6
Speed
Speed
Speed
Speed
and
and
and
and
length
length
length
length
of
of
of
of
demoulding
demoulding
demoulding
demoulding
脱模速度： 指印刷后的基板脱离模板的速度，在焊膏与范本完全脱离之前，分离速度要
慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印
刷尤其重要。一般设定为 3mm/s ，太快易破坏锡膏形状。
Speed
Speed
Speed
Speed
of
of
of
of
demoulding
demoulding
demoulding
demoulding
:
:
:
:
it
refers to the speed for the printed base board to break away from
formwork. T he speed shall be slower before the thorough separation of solder paste and sample; and
the base board can decline quickly after the thorough separation. S lower separation is in favor of the
formation of clear edges, which is quite crucial to the small space printing. G enerally speaking, the
speed is set as 3mm/s . Excessively quick speed is prone to damage the solder paste shape.
本机器允许设置范围为 0 ～ 20mm/s 。
The setting scope of demoulding speed allowed by this printing machine is 0 ～ 20mm/s .
PCB
PCB
PCB
PCB
与范本的分离时间： 即印刷后的基板以脱板速度离开模板所需要的时间。 时间过
长，
易在范本底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在 1 秒左右。
Separation time of PCB board and sample:
it
refers to the time for the printed base board to
break away from the formwork
at
the demoulding speed. E xcessively long time is prone to leave
solder paste on the sample bottom; and excessively short time results in poor standing of solder paste .
G enerally speaking, the time is controlled
at
1s or so.
本机器用脱模长度来控制此变量，一般设定为 0.5 ～ 2mm 。本机器允许设置范围为 0 ～
10mm 。
This printing machine controls this variable with demoulding length which is generally set as