MDF51SU_2S_13C_252803_2529_CL0547_2018_1_03_Catalo-8799701.pdf - 第7页

7 MDF51 Series ● High V oltage Wire-to-Board Connectors Part No. HRS No. Packaging Finish MDF51-24SCF(40) 547-2005-0 40 10,000 / reel Tin plating Please place orders in full reel increments. 2.25 3.1 1.4 1.4 0.8 1 t=0.2 …

MDF51 Series●High V oltage Wire-to-Board Connectors

■

Header (Contact pitch : 13 mm)

●Straight, through-hole

19.1

1.2

Contact No.1 mark

18.2

24.1

P=13

6.75 2.8

2.8

1.2 t=0.3

6.85

1.8

+0.1

0.9

(1.8)

6.85±0.1

+0.1

0.9

+0.1

18.2±0.1

19.1±0.1

+0.1

●Packaging Specification

Recommended PCB la y out dimensions

PCB thic kness : 1.6mm

()% &+#+*

E2((

'+%

E2((

Unit : mm

12.75

4.451.45

27.8

Contact No.1 indicator

Part No. HRS No.

No. of

contacts

Insulator

Color

Packaging

MDF51SY-2P-13DSA(21)

547-0920-3 21 2

Black 120 pcs/tray

Please place orders in full tray increments.

Part No. HRS No.

No. of

contacts

Insulator

Color

Packaging

MDF51SU-2S-13C(03)

547-2018-1 03 2

Gray

100 pcs/pack

Please place orders in full pack increments.

■ Crimp socket (Contact pitch : 13 mm)

Jun.1.2023Copyright2023HIROSEELECTRICCO.,LTD.AllRightsReserved.

MDF51 Series●High V oltage Wire-to-Board Connectors

Part No. HRS No. Packaging

Finish

MDF51-24SCF(40) 547-2005-0 40 10,000 / reel Tin plating

Please place orders in full reel increments.

2.25 3.1

1.4

0.8

t=0.2

8.1

4.1

●

UL style : UL3239

●

Strip length

1.8 to 2.6mm

Tools

●

Applicable wire (Tin plated, annealed copper wire)

Unit : mm

Crimp contact

Usage Recommendations

Type Part No. HRS No. Applicable contact

Applicator AP105-MDF51-24S 901-4607-9 00 MDF51-24SCF

Press CM-105 901-0005-4 00

-----------------

Contact extraction tool DF-C-PO (B) 550-0179-2 00

MDF51-24SCF

1.Recommended temperature profile

Note 1 : Up to 2 cycles of Reflow soldering are possible under the same

conditions, provided that there is a return to normal temperature

between the first and second cycle.

Note 2 : The temperature profile indicates the board surface temperature at

the point of contact with the connector terminals.

2.Reccomended flow temperature Peak temperature : 260ç for 10 seconds max.

3. Recommended manual soldering Manual soldering : 350ç for 3 seconds max.

4. Recommended screen thickness

and open area ratio

(Pattern area ratio)

Thickness : 0.15mm

Open area ratio : 100%

5. Board warpage

Maximum of 0.03mm at the connector center, with both ends of the connector as

reference points.

6. Cleaning conditions Refer to "Board to cable connectors Use Handbook".

7. Wire preparation and contact

crimping

Refer to “Board to cable connectors Use Handbook”.

The crimp contact termination must be performed using specified tools.

All dimensions and crimp conditions are listed in applicable Crimp Condition

Table and Crimping Quality Standards Manual.

Wire size (Stranded wire conductor) Jacket diameter

AWG#24 (19 / Ø0.127mm) Ø1.74mm

Note : When using other than the recommended wire, contact your nearest

Hirose sales representative.

10sMAX

60sec

60~120sec

255

çMAX

180

100

150

200

250

230

Time (Seconds)

Temperature (ç)

MDF51 Series●High V oltage Wire-to-Board Connectors

8. Precautions

■ Mating

Socket will self-align in the header.

Align the Socket over the header and firmly push-down at the “O” symbol

until both locks are fully engaged.

Tactile “click” sensation will confirm fully locked condition.

■Unmating

Compress both locks evenly, toward each other.

While compressing the lock releases pull the socket straight up until free of

the header.

■ The crimped contacts must be fully inserted in the crimp socket horizontally

and will self-guide itself in the proper position

■ The header must be mounted on the PC board when mating with the

corresponding socket.

■ Differences in colors shade of the molded components will not affect form,

fit or function.

■ Contact HRS if additional information is required.

PUSH

Crimp socket

Header

O mark

symbol

Step 1 Step 2

Crimp socket

Header

O mark

symbol

Lock release

Crimp socket

Lock release

PUSH