Cougar_EVO_Brochure_en-LR.pdf - 第3页
3 P CB , bo t to m si de s ho w n as MP R v ie w t o highligh t st ruct ures on a Die E x te nde d fie ld o f v ie w w i t h ne w Pan el 16 16 ( t op) com par ed t o Y.P ane l 13 13 (b o t tom ) Surface-mounted devices ar…
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Three unrivalled tools
going hand in hand for reliable, repeatable, and quick results.
FGUI
Acquisition
for CL
VoidInspect
Workflow CL
FF CT
Reconstruction
VoidInspect – automatic void calculation in SMT production
(DEVELOPED BY YXLON – POWERED BY ORS)
CL VOLUME SLICE/PADS VOIDS RESULT
BGALEDIGBTLGA
- Acquisition of a computed laminography scan (CL)
with FGUI user interface.
- Reconstruction of the CL volume with FF CT
software.
- Void calculation with VoidInspect ensures highest
product quality.
SPEED: Up to 5x faster than comparable software in the market
FLEXIBILITY: Applicable for a wide range of components
QUALITY: Best computed laminography in the market means
best results
REPEATABILITY: 0% deviation in one volume, measured
several times; <1% deviation in different volumes, several
acquisitions of the same component
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PCB, bottom side shown as MPR view to
highlight structures on a Die
Extended field of view with new Panel 1616 (top)
compared to Y.Panel 1313 (bottom)
Surface-mounted devices are very small and often tightly
fitted to a given area. That is why in order to get the
most accurate and repeatable test results the inspection
system must provide not only high performance and
resolution but also be equipped with dynamic image
enhancing filters.
The new Cheetah EVO SMT offers the right kind of
optimization for inspecting SMT devices in addition to
other empowering pros:
LARGE FLAT-PANEL DETECTOR PANEL 1616
- Expanded field of view (1280 x 1280 pixel size),
50% larger compared to the previous version
- Better overview and faster working processes due to
reduced steps in automated processes
BEST LAMINOGRAPHY (micro3Dslice)
- Detailed 3D visualization for quick and easy failure
analysis
- Optimally suited for large PCBs
- Results on layer level
- Non-destructive inspection of large areas
- Substantial cost savings compared to micro sectioning
AUTOMATIC VOID CALCULATION WITH
VOIDINSPECT
INTEGRATION IN PRODUCTION LINE
- Direct communication with inline AOI / AXI inspection
systems thanks to YXLON ProLoop
ADDITIONAL PROS
- VGSTUDIO MAX*
SMT inspections:
grand performance
for small devices
APPLICATIONS
- PCB
- LED
- BTC
- BGA
- LGA
- IGBT
- QFN/QFP
- Die Attach
*optional
As electronic components, semiconductor devices are the
key elements of the majority of electronic systems.
Due to their compactness and density, their testing
requires maximal image resolution at low power and low
voltage. Void compilations, including multi-area voiding,
need accurate, repeatable inspection routines.
The new Cheetah EVO Semi offers excellent inspection
results at low power and low kV in addition to other
empowering pros:
HIGHLY SENSITIVE DETECTOR & DOSE REDUCTION
- The detector’s high sensitivity enables operations
with reduced dose
- With the optional dose reduction kit the dose rate on
sensitive components can be additionally reduced, by
using filters and a collimator
- Optimized electronics for high speed and long-term
stability at 24/7 operations
- Long detector lifetime due to radiation resistance
Semicon inspections:
maximum resolution at minimum voltage
APPLICATIONS
- Wafer inspection
- 3D integrated circuit joints
- Micro-bumps
- Sensors
- MEMS and MOEMS
- TSVs
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HIGH DETAIL RECOGNITION
- Operators enable the detection of the finest details
through an integrated image chain
AUTOMATIC ERROR DETECTION
- Integrated error detection in FGUI (BUMPS, VOID)
- ProInsight ready (possibility of developing and
integrating individual algorithms)
ADDITIONAL PROS
- VGSTUDIO MAX*
- Highly stable components
2D x-ray image of BGA with 60 µ bumps 3D CL image showing 60 µ Bumps, open and soldered
*optional