88226623-01-05 - Flex Neo PPiX Tech Spec.pdf - 第12页
12 DEK FLEX NeoHorizon P PiX Machine Pro ductivity Opt ions Transport Specification Substrate Su pport Grid - Lok® tooling Substrate Tr ansport 3- Stage High Throughp ut Conveyor w ith DSM Single pi ece conveyor w ith fl…
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DEK FLEX NeoHorizon PPiX
Machine Productivity Options
Process
Specification
Print Method
ProFlow® ATx
Stinger
Printing Environment Control
Contact PM
Recommended Stencil Frame
VectorGuard
Adjustable Width Stencil Mount (AWSM)
Frame variants – Fully adjustable to accommodate
frame sizes in the range of 381mm to 736mm (15” to
29”) by 38mm height.
Image position: Centre / Front / Custom
Under Stencil Cleaning
Interchangeable Under Stencil (iUSC) cleaner, fully
programmable with wet/dry/vacuum wipe with external
solvent tank. Specify length (300mm, 400mm, 520mm)
Vacuum Assist for Under Stencil
Cleaning
On board vacuum unit 35 litres/sec airflow
Handling & Cleaner Options
Specification
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y) – Long Board Option
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade
insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Software & Communications
GEM on TCP/IP
12
DEK FLEX NeoHorizon PPiX
Machine Productivity Options
Transport
Specification
Substrate Support
Grid-Lok® tooling
Substrate Transport
3-Stage High Throughput Conveyor with DSM
Single piece conveyor with flat belts (heavy boards)
Remote board stop (for use with heavy board option)
Substrate Fixture
All Purpose Clamping (APC) system*
Snuggers (edge clamping)
Foil-less clamps
* Can only be used with Modular single stage rail system – for availability contact product manager
Vision & Verfication
Specification
HawkEye® Bridging
Enabled
Data Capture
Specification
Product Data Capture
Verification - handheld barcode reader
Traceability - remote barcode reader
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DEK FLEX NeoHorizon PPiX
Machine Footprint Standard Rails