88226623-01-05 - Flex Neo PPiX Tech Spec.pdf - 第7页

7 DEK FLEX NeoHorizon P PiX Machine S t andard C onf igurati on Transport Sy stem Specification Type Single pi ece conveyor w ith 3m m round belt s. Front ra il fix ed Width Adju stment Programmab le motoriz ed rear rail…

DEK FLEX NeoHorizon PPiX

Machine Standard Configuration

Standard Configuration

Specification

Machine Alignment Capability

> 2.0 C

@ +/- 12.5µm, (±6 Sigma)

System Alignment Capability > 2.0 C

@ +/- 15µm, (±6 Sigma)*

Wet Print Capability

> 2.0 C

@ +/- 20µm, (±6 Sigma)

Core Cycle Time 8 secs (Std Rails) 6.5 secs (HTC)**

Maximum Print Area

510mm*** (X) x 508.5mm (Y) (for Single Stage Mode)

Printer Construction One piece optimised welded frame

ISCAN

Machine Control

Motion control using CAN BUS network

Operating System Windows 10 IoT Enterprise

Operator Interface

Colour TFT touch screen display, keyboard and trackball with

DEK Instinctiv

software. Machine mountable on either left or

right hand side.

Camera HawkEye® 1700 digital camera, using IEEE 1394 interface.

Multi-channel. LED lighting. FOV 11.3mm x 8.7mm.

Inspection window 75mm

Camera Positioning

Rotary motors and encoders with 4 micron resolution

Squeegee Pressure Mechanism Software controlled, motorised with closed loop feedback

Stencil Positioning

Automatic loading incorporating squeegee drip tray

Stencil Alignment Motorised via actuators X, Y, and Theta

Under Stencil Cleaning

Typhoon Under Stencil Cleaner, fully programmable with

wet/dry/vacuum wipe with external solvent tank

Specify length (300mm, 400mm, 460mm, 515mm)****

Vacuum Assist for Under Stencil Cleaning On board vacuum unit 35 litres/sec airflow

Squeegee

Clamped double trailing edge squeegee (1 set included)

Tooling Deviation Monitor Verification of tooling setup via squeegee pressure feedback

Machine Interface

Upline and downline FMI included

Connectivity RJ-45LAN (networking) and USB2/3 interface available

ESD Compatibility

Compliant with EN/IEC 61340-5-1, EN/IEC 61340-5-2,

ANSI/ESD SP10.1, ANSI/ESD S20.20

Tri Colour Beacon Programmable with audible alarm

Temperature & Humidity Sensor

Monitoring of the process environment

Documentation Hard copy manuals comprising: Operator, Installation,

Electrical Drawings. On board technical manuals and tutorials

supporting operator functions. DVD containing manuals and

tutorials.

* System Alignment Capability is certified by a 3

party software QC Calc and undertaken by applying board

loading/unloading, board clamping, camera/rising table movement and print process.

Accuracy and Repeatability qualifications are certified by CeTaQ and AVS to deliver highly confident wet print

process.

** Measured using the ASM defined Core Cycle Time test parameters, for details contact the Product Manager

*** For print area up to 600mm long please contact the Product Manager

**** If configured with an AWSM, the cleaner chamber size should be matched with the minimum AWSM width and

stencil frame width being used

DEK FLEX NeoHorizon PPiX

Machine Standard Configuration

Transport System

Specification

Type

Single piece conveyor with 3mm round belts. Front rail

fixed

Width Adjustment

Programmable motorized rear rail

Transport Direction

Left to right

Right to left

Left to left*

Right to right*

Substrate Handling Size (minimum)

50mm (X) x 40.5mm (Y)

Substrate Handling Size (maximum)

370mm (X) x 508.8mm (Y) (3-Stage Mode)

510mm (X) x 508.5mm (Y) ( Single Stage Mode)

Substrate Thickness

0.2mm to 6mm

Substrate Weight (maximum)

1kg

Substrate Warpage

Up to 7mm including substrate thickness

Substrate Fixture

Over the top clamps

Substrate Handling Features

Soft rail lift/land

Board clamp regulator

Substrate Underside Clearance

Programmable 3mm to 42mm

*Available in single stage only

Process Parameter

Specification

Print Pressure

0kg to 20kg

Print Speed

2mm/sec to 300mm/sec

Print Gap

0mm to 6mm

Substrate Separation

Speed: 0.1mm/sec to 20mm/sec

Distance: 0mm to 20mm

Print Modes

ProFlow®

Print/Print

Print/Flood

Flood/Print

Adhesive

Paste Knead

Programmable: number; period; on demand

DEK FLEX NeoHorizon LPiX

Machine Standard Configuration

Vision

Specification

Vision System

SFF

Fiducial Recognition

Automatic fiducial teach and find incorporating 0.3mm

fiducial capture

Fiducials

2 or 3

Fiducial Types

Synthetic fiducial library or unique pattern recognition

Fiducial Size

0.3mm to 3mm*

Fiducial Locations

Anywhere on substrate

Fiducial Error Recovery

Auto lighting adjustment

Auto fiducial search

Camera Lighting

Software controlled programmable LED lighting

*0.1mm to 3mm available via RFQ

Chase

Specification

Screen Frame Size (maximum)

736mm x 736mm (29” x 29”)

Screen Frame Thickness

25mm to 38mm (1” to 1.5”)

Image Position

Front

Centre

Custom

Operating Environment*

Specification

Temperature

10° to 35°C (50° to 95°F)

Humidity

30% to 70% relative humidity (non-condensing)

Altitude

Maximum 2,000 metres (6,500 feet)

Location

Internal only, not suitable for wet locations

*as described in the IPC Standard J-STD-001G-Reqirements for Soldered Electrical and Electronic

Assemblies Section 4 with respect to the following:

• Facilities - Cleanliness and ambient environments in all work areas be maintained at levels that

prevent contamination or deterioration of tools, materials, and surfaces to be soldered or

conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of

tobacco products be prohibited in the work area.

• Environmental Controls - The soldering facility (controlled work area) be enclosed, temperature

and humidity controlled, and maintained at a positive pressure.

• Controlled Work Area (CWA) For the purpose of this statement, a Controlled Work Area

(CWA) is defined as an enclosed assembly / processing area maintained to a high degree of

shop cleanliness, environmental control, and foreign object debris (FOD) mitigation, either by

process or procedure, to limit the entry of contamination.