Brochure-PacTech-Solder-Jetting-Laser-Bonding.pdf - 第4页

5 6 Model SB² - SMs Quantum SB²- SMs Quantum: The introduction of the dual-drawer system and vision-on- the-y enables the loading and unloading of the products to match the soldering speed of the SB² machine. This bring…

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High Accuracy Volume Manufacturing

SB² - Jet

Dimension

1262 x 987 x 1845 mm

Workspace

320 x 320 mm

Solder Ball Speed

6 - 8 balls / s

Solder Ball Ø

≥ 40 µm

Accuracy

+/- 3 - 5 µm (1 sigma)

Work Station

Chuck / Tray

Automation

Wafer handler, inline conveyor, JEDEC tray, others

Laser Man. Alignment

–

Laser Auto Alignment ü (3D)

Pattern Recognition

2D Applications

3D Applications

Repair

optional

Products

Wafer pieces, PCB & Flex substrates, single chips, BGAs, CSPs, camera modules,

sensors, Hard Disk Drivers, 3D components, medical applications

Applications Technical Specications

Model

SB²-Jet

SB²-Jet:

Flagship platform of PacTech’s leading edge solder jetting

technology, the SB²-Jet with the high precision gantry is

the most advanced system for automated high-speed se-

quential solder ball attach and laser reow. With accurate,

precise and reliable performance proven in mass volume

production environment, the large working area of this

model is highly exible for a variety of dierent microelec-

tronic substrates and applications.

Hard Disk Drive

Assembly

3D Solder Jetting for

Optoelectronics

A comprehensive version of the SB²-Jet is delivered with

a vision and pattern-recognition system, an after-bump 2D

inspection and an additional repair unit, with optional au-

tomated substrate or wafer handling solution customizable

to support customer-specic products and carriers such

as conveyor, robot or reel-to-reel system, this machine is

ready for in-line production integration.

SB² - M SB² - SM

Dimension

752 x 700 x 1819 mm 1183 x 880 x 1893 mm

Workspace

100 x 100 mm 200 x 200 mm

Solder Ball Speed

3 - 5 balls / s 3 - 5 balls / s

Solder Ball Ø

≥ 100 µm ≥ 60 µm

Accuracy

+/- 15 µm (1sigma) +/- 5 µm (1sigma)

Work Station

Chuck Chuck

Automation

– –

Laser Man. Alignment

ü ü

Laser Auto Alignment

– optional (3D)

Pattern Recognition

optional*

*50 x 100 mm reduced workspace

optional

2D Applications

ü ü

3D Applications

– –

Repair

optional optional

Products

Wafer pieces, substrates,

single chips, BGAs, CSPs, others

Wafer Ø up to 8”, substrates,

single chips, BGAs, CSPs, others

Applications Technical Specications

Model

SB²-SM

SB²-M:

The SB²-M is the smallest available platform in the SB²-se-

ries with ultra small foot print yet sucient work area, being

equipped with semi-automatic solder ball placement, laser

reow and rework functions, it is dedicated to prototyp-

ing and research & development purposes. This model is

commonly used for prototype sample building, reballing,

repair and rework of products.

SB²-SM:

Being a lower cost version of the SB²-Jet without compro-

mising its placement accuracy, the SB²-SM is sequential

solder ball attach and laser reow system that can oper-

ate either in a fully automatic mode or in a semiautomatic

mode. With larger work area than the SB2-M yet relatively

compact foot print than the SB²-Jet, it is ideal for research

& development, prototyping and small volume manufac-

turing.

Prototype Build

Package Rework

Model

SB²-M

Prototype & Rework

SOLDER JETTING SOLDER JETTING

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Model

SB² - SMs Quantum

SB²- SMs Quantum:

The introduction of the dual-drawer system and vision-on-

the-y enables the loading and unloading of the products

to match the soldering speed of the SB² machine. This

brings contactless and uxless soldering technology into

3D component soldering. The SB²-SMs is a compact ma-

chine for automated sequential laser soldering, catering to

a variety of dierent microelectronic substrates, especially

dedicated for camera modules and optical devices.

SB² - SMs Quantum

Dimension

1200 x 1300 x 1700 mm

Workspace

2 drawers, 250 x 250 mm per drawer

Solder Ball Speed

6 - 8 balls / s

Solder Ball Ø

≥ 100 µm

Accuracy

+/- 5 µm (1 sigma)

Work Station

Tray

Automation

Dual drawer system

Laser Man. Alignment

Laser Auto Alignment

ü(2D)

Pattern Recognition

2D Applications

3D Applications

Repair

Products

Camera modules, industrial, automotive, medical and others

Applications Technical Specications

Camera Module

Assembly

3D Soldering

Camera Modules Assembly

SOLDER JETTING

Model

SB² - Compact

-Compact:

Small machine foot print yet being packed with the ad-

vanced laser soldering technology, SB

-Compact comes

with universal machine interface which can be upgraded

easily into any manufacturing line in a plug-and-play model

and can be multiplied quickly for production ramp. It has

a user-friendly touch-screen interface which is simple for

mass production operation.

SB² - Compact

Dimension

1100 x 704 x 1893 mm

Workspace

200 x 200 mm

Solder Ball Speed

Up to 6 balls / s

Solder Ball Ø

≥ 150 µm

Accuracy

+/- 5 µm (1 sigma)

Work Station

Stacked Drawers / In-line conveyor

Automation

2D Auto-rotatioon Bars

Laser Man. Alignment

Laser Auto Alignment

Optional

Pattern Recognition

2D Applications

3D Applications

Repair

Products

Camera modules, nger print sensors, facial recognition and others

Applications Technical Specications

3D Joint for

Optoelectronic

Cu Coil Soldering

3D Soldering for Flexible Manufacturing

Integration

SOLDER JETTING

Easy upgrade with

standarized modules and

connectors

Reel-to-Reel

Cassette Feeding

JEDEC Tray Feeder

In-line Conveyor

Drawer / Stacked Drawer

Extendable Assembly Line

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Applications

-WB

The SB²-WB is a combination of PacTech´s unique sol-

der ball jetting technology with a wire feeding mecha-

nism to perform wiring process. This innovative solution

has very low stress as it is bonded with very short laser

pulse and requires no mechanical contact. The system is

highly exible, with various loop formation capabilities or

even no wire loop formation to enable smaller package

size, at the same time allowing combination of dierent

solder alloy and wire, wire bundles or ribbon. Higher re-

liability as compared to conventional wire bonding with

consistent wire thickness and better match of CTE varia-

tion between materials. Additionally, the solder wire bond

can be reworked selectively at ease. SB

-WB is a exible

wire-bonding alternative for multifunctional system plat-

forms and heterogeneous integration.

Optical bres

wiring

Connector Joining

Advanced Wire Bonding Solution

Technical Specications

Model

-WB

SOLDER JETTING

SB² - WB

Dimension

1200 x 1300 x 1950 mm

Workspace

≥ 150 x 150 mm or 320 x 320 mm

Solder Ball Speed

2 – 4 sec per pin/pad connection

Material Ø

Solder ball Ø ≥ 50 µm; wire Ø ≥ 100 µm

Prefered Pad Material

NiAu, Au, Cu

Accuracy

+/- 5 µm (1 sigma)

Work Station

Chuck / In-line conveyor

Laser Man. Alignment

Laser Auto Alignment

Optional

Pattern Recognition

2D Applications

3D Applications

Repair

Products

IC packaging, LED packaging, connectors, optical bre, 2D/3D packaging

and others

Applications

LAPLACE-Can/LAPLACE-VC

Our solution for ultra-ne-pitch cantilever assembly and

laser bonding for wafer probe cards with optional rework

capability.

This platform is also suited for the vertical attachment of

chips or similar devices loaded into the machine from feed-

ing station to various carrier substrates loaded manually

onto the machine’s work stage. The system uses a unique

patented laser thermode tool, which is integrated in the

vacuum pick and place unit of the bonder. For the high

exibility of the laser thermode, the system requires only a

thin layer of solder on the substrate.

Cantilever

Assembly

Vertical Chip

Bonding

Ultra Fine Pitch Assembly

LAPLACE-Can LAPLACE-VC

Dimension

1520 x 1100 x 1890 mm 1520 x 1100 x 1890 mm

Workspace

Work area: 330 x 330 mm

Substrate size: up to 500 x 500 mm

Work area: 330 x 330 mm

Substrate size: up to 500 x 500 mm

Cycle time

(pick & place incl. Laser reow)

≥ 7 sec / pin ≥ 10 sec / chip

Accuracy

Placement: +/- 3.5 µm (3 sigma)

Hump tilt: +/- 3 µm

Height control: +/- 4 µm

+/- 3 µm (1 sigma)

Tooling

Customized bond tool Customized bond tool

Die Handling

Wae Pack / Probe Wafer Wae Pack / Wafer

Substrate Handling

Manual / Automatic Manual / Automatic

Product Output

Manual / Automatic Manual / Automatic

Pattern Recognition

ü ü

2D Applications

– –

3D Applications

ü ü

Repair

optional –

Products

Probecards, DRAM,

ash memory, NAND

Memory chips, diode (photodiode,

LED, µLED), MEMS (sensors,

gyroscopes, etc.)

Technical Specications

Model

LAPLACE-Can

Model

LAPLACE-VC

LASER BONDING