Brochure-PacTech-Solder-Jetting-Laser-Bonding.pdf - 第5页

7 8 Applications SB 2 -WB The SB²-WB is a combination of PacT ech´s unique sol - der ball jetting technology with a wire feeding mecha - nism to perform wiring process. This innovative solution has very low stress as it …

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Model

SB² - SMs Quantum

SB²- SMs Quantum:

The introduction of the dual-drawer system and vision-on-

the-y enables the loading and unloading of the products

to match the soldering speed of the SB² machine. This

brings contactless and uxless soldering technology into

3D component soldering. The SB²-SMs is a compact ma-

chine for automated sequential laser soldering, catering to

a variety of dierent microelectronic substrates, especially

dedicated for camera modules and optical devices.

SB² - SMs Quantum

Dimension

1200 x 1300 x 1700 mm

Workspace

2 drawers, 250 x 250 mm per drawer

Solder Ball Speed

6 - 8 balls / s

Solder Ball Ø

≥ 100 µm

Accuracy

+/- 5 µm (1 sigma)

Work Station

Tray

Automation

Dual drawer system

Laser Man. Alignment

Laser Auto Alignment

ü(2D)

Pattern Recognition

2D Applications

3D Applications

Repair

Products

Camera modules, industrial, automotive, medical and others

Applications Technical Specications

Camera Module

Assembly

3D Soldering

Camera Modules Assembly

SOLDER JETTING

Model

SB² - Compact

-Compact:

Small machine foot print yet being packed with the ad-

vanced laser soldering technology, SB

-Compact comes

with universal machine interface which can be upgraded

easily into any manufacturing line in a plug-and-play model

and can be multiplied quickly for production ramp. It has

a user-friendly touch-screen interface which is simple for

mass production operation.

SB² - Compact

Dimension

1100 x 704 x 1893 mm

Workspace

200 x 200 mm

Solder Ball Speed

Up to 6 balls / s

Solder Ball Ø

≥ 150 µm

Accuracy

+/- 5 µm (1 sigma)

Work Station

Stacked Drawers / In-line conveyor

Automation

2D Auto-rotatioon Bars

Laser Man. Alignment

Laser Auto Alignment

Optional

Pattern Recognition

2D Applications

3D Applications

Repair

Products

Camera modules, nger print sensors, facial recognition and others

Applications Technical Specications

3D Joint for

Optoelectronic

Cu Coil Soldering

3D Soldering for Flexible Manufacturing

Integration

SOLDER JETTING

Easy upgrade with

standarized modules and

connectors

Reel-to-Reel

Cassette Feeding

JEDEC Tray Feeder

In-line Conveyor

Drawer / Stacked Drawer

Extendable Assembly Line

7 8

Applications

-WB

The SB²-WB is a combination of PacTech´s unique sol-

der ball jetting technology with a wire feeding mecha-

nism to perform wiring process. This innovative solution

has very low stress as it is bonded with very short laser

pulse and requires no mechanical contact. The system is

highly exible, with various loop formation capabilities or

even no wire loop formation to enable smaller package

size, at the same time allowing combination of dierent

solder alloy and wire, wire bundles or ribbon. Higher re-

liability as compared to conventional wire bonding with

consistent wire thickness and better match of CTE varia-

tion between materials. Additionally, the solder wire bond

can be reworked selectively at ease. SB

-WB is a exible

wire-bonding alternative for multifunctional system plat-

forms and heterogeneous integration.

Optical bres

wiring

Connector Joining

Advanced Wire Bonding Solution

Technical Specications

Model

-WB

SOLDER JETTING

SB² - WB

Dimension

1200 x 1300 x 1950 mm

Workspace

≥ 150 x 150 mm or 320 x 320 mm

Solder Ball Speed

2 – 4 sec per pin/pad connection

Material Ø

Solder ball Ø ≥ 50 µm; wire Ø ≥ 100 µm

Prefered Pad Material

NiAu, Au, Cu

Accuracy

+/- 5 µm (1 sigma)

Work Station

Chuck / In-line conveyor

Laser Man. Alignment

Laser Auto Alignment

Optional

Pattern Recognition

2D Applications

3D Applications

Repair

Products

IC packaging, LED packaging, connectors, optical bre, 2D/3D packaging

and others

Applications

LAPLACE-Can/LAPLACE-VC

Our solution for ultra-ne-pitch cantilever assembly and

laser bonding for wafer probe cards with optional rework

capability.

This platform is also suited for the vertical attachment of

chips or similar devices loaded into the machine from feed-

ing station to various carrier substrates loaded manually

onto the machine’s work stage. The system uses a unique

patented laser thermode tool, which is integrated in the

vacuum pick and place unit of the bonder. For the high

exibility of the laser thermode, the system requires only a

thin layer of solder on the substrate.

Cantilever

Assembly

Vertical Chip

Bonding

Ultra Fine Pitch Assembly

LAPLACE-Can LAPLACE-VC

Dimension

1520 x 1100 x 1890 mm 1520 x 1100 x 1890 mm

Workspace

Work area: 330 x 330 mm

Substrate size: up to 500 x 500 mm

Work area: 330 x 330 mm

Substrate size: up to 500 x 500 mm

Cycle time

(pick & place incl. Laser reow)

≥ 7 sec / pin ≥ 10 sec / chip

Accuracy

Placement: +/- 3.5 µm (3 sigma)

Hump tilt: +/- 3 µm

Height control: +/- 4 µm

+/- 3 µm (1 sigma)

Tooling

Customized bond tool Customized bond tool

Die Handling

Wae Pack / Probe Wafer Wae Pack / Wafer

Substrate Handling

Manual / Automatic Manual / Automatic

Product Output

Manual / Automatic Manual / Automatic

Pattern Recognition

ü ü

2D Applications

– –

3D Applications

ü ü

Repair

optional –

Products

Probecards, DRAM,

ash memory, NAND

Memory chips, diode (photodiode,

LED, µLED), MEMS (sensors,

gyroscopes, etc.)

Technical Specications

Model

LAPLACE-Can

Model

LAPLACE-VC

LASER BONDING

9 10

Applications

Model

LAPLACE-FC / LAPLACE-GENESIS

LAPLACE-FC

The LAPLACE-system provides an integrated solution for

ip chip assembly, the laser reow will be done during the

placement – all in one step. The laser assisted assembly

can be applied for soldering, ACF and NCP interconnec-

tions. The optional dispensing unit in the ip chip assembly

platform allows a maximal exibility for ux, solder paste

and/or ACF, NCP dispensation.

LAPLACE-FCR:

The LAPLACE-FCR is an automatic laser bonding system

for ip chip assembly and chip rework, enabling localized

rework without second reow and mechanical pressure

to the completed units. The system will remove defect ip

chips from the wafer or carrier substrate with the vacuum

bond tool based on pre-dened mapping les or 2D in-

spection. New chips are loaded from customizable feeding

station such as wae pack prior to laser assembly.

Flip-Chip Rework

Flex to ex bonding

LAPLACE-FC LAPLACE-GENESIS

Dimension

1500 x 1200 x 2200 mm

Workspace

320 x 320 mm

Cycle time

(pick & place incl. Laser reow)

≥ 5 sec / chip

Chip size

≥ 0.3 x 0.3 x 0.1mm

Accuracy

+/- 4.5 µm (3 sigma) +/- 0,5 µm (3 Sigma)

Tooling

Customized bond tool

Die Handling

Wae Pack, Sawing Frame, Tape and Reel

Substrate Handling

Manual / Automatic

Product Output

Manual / Automatic

Pattern Recognition

2D Applications

3D Applications

–

Repair

optional

Products

Flip Chip, passive components, sensors, MEMS

Technical Specications

Model

LAPLACE-FCR

Flip Chip Attach & Rework

LASER BONDING

LAPLACE-HT

The LAPLACE-HT is an automatic laser soldering assem-

blyline for schottky diodes and bypass diodes – especially

for solar cell modules. Using a rotary table the automat-

ic machine punches and forms lead frames, dispenses

solder paste and performs diode laser attach to the lead

frame. A nal electrical and visual test is done on the as-

sembled modules and chip packages within the machine.

A complete standalone turnkey solution! Additional appli-

cations are LED, MOSFET and camera module assembly.

LAPLACE-HT

Dimension

5000 x 3000 x 2200 mm

Workspace

Customizable work station

Cycle time

(pick & place incl. Laser reow)

≤ 1 sec / component

Accuracy

+/- 50 µm (1 sigma)

Tooling

Customization based on product

Die Handling

Sawing Frame, Tape and Reel

Substrate Handling

Automatic

Product Output

JEDEC Tray, others

Pattern Recognition

2D Applications

3D Applications

Products

Bypass diode for solar cells, LEDs, chips on lead frame

Bypass Diode

Cross section of

assembled Diode

Integrated Diode Assembly

Applications Technical Specications

LASER BONDING

Model

LAPLACE-HT

Disclaimer: The data provided in all technical specications are reference data from standard platforms and may vary

subject to application, modication and customization.