SIPLACE X4 S micron X4i S micron.pdf - 第30页

30 SIPLACE Vision Component recognition Checking the component quality Recognizing the co llinearity of components Damaged or bent leads are recognized. Thi s helps avoi d solder-free connections du ring the subsequent s…

SIPLACE Vision

High placement performance and best quality

Board (substrate) recognition

In addition to the precise recognition of components, the PCB camera also guarantees reliable detec-

tion of inkspots and PCB fiducials.

Board recognition is used for:

• Position of fiducials for position recognition purposes

• Correction of elongation/compression

• Inkspot recognition

• Reading barcodes and data matrix codes

Nozzle measurement

• Type verification

• Nozzle concentricity

• Nozzle scan for contamination and wear

SmartPin Support

• Measurement of Smart Pins and their positions, plus constant monitoring during ongoing operations

Optional functions

• Teaching and recognizing OSC-THT (OSC package) see page 36.

• SIPLACE Vision teaching station

Separately from ongoing production, the SIPLACE Vision Teaching Station facilitates quick and

easy offline generation of component shape descriptions, even for complex components.

SIPLACE Vision

Component recognition

Checking the component quality

Recognizing the collinearity of components

Damaged or bent leads are recognized. This helps avoid solder-free connections during the subsequent solder-

ing process.

Damaged leads Damaged leads

Recognizing flipped (face down) or upright components

Both chip and IC component shapes (e.g. SOT) recognized in flipped (turned face down) or upright state.

SOT OK SOT “face down”

Flipped chip Chip upright

Checking the lead width

The optical checking of the lead width recognizes tilted or damaged leads. This helps to recognize e.g. diodes

with tilted leads.

Lead width OK Tilted lead

SIPLACE Vision

Component recognition

Checking the component quality

Checking the lead length

The lead length check determines whether the leads have been distorted. This inspection is possible by checking

whether leads of the same type e.g. chip shapes have different lengths. Flipped and rotated components can also

be detected.

Component OK in this position Rotated

Detecting special shapes with rectangular functions

When using certain special component shapes, it is sometimes necessary to program parts on the components or

outlines as rectangular shapes. This ensures that they can be processed more reliably.

Rectangular function on the component Rectangular component with irregular edges

Detecting incorrect component descriptions

The Vision system checks whether the position of the component corresponds to the measured Vision data. The

following example has more leads than were programmed in the component shape description.

Teaching complex BGA structures

Complex BGA structures can be taught within only a few seconds.

Placing when inkspot is not present

A fiducial can now be defined for the omission of panels. If a fiducial is found (cross, circle, etc.), this panel will be

omitted.

Checking the inner area of circular fiducials

To differentiate circular fiducials from other structures on the board, a brightness check is performed in the inner

area of these fiducials.