IPC-2221A-2003中文版-印制板设计通用标准.pdf - 第5页

Benny Nilsson, Ericsson AB Steven M. Nolan, C.I.D.+, Silicon Graphics Computer System Randy R. Reed, Merix Corporation Kelly M. Schriver, Schriver Consultants Jeff Seekatz, Raytheon Company Kenneth C. Selk, Northrop Grum…

鸣谢

任何包含复杂技术的标准都要有大量的资料来源。虽然下面列出了刚性印制板委员会(D-30)的

IPC-2221 任务组(D-31b)的主要成员，但不可能囊括所有那些曾经帮助过本标准开发的人士。仅

在此表达对他们诚挚的感谢。

刚性印制板委员会 IPC-2221 任务组(D-31b) IPC理事会的技术连络

主席

C. Don Dupriest

Lockheed Martin Missiles

and Fire Control

主席

Lionel Fullwood

WKK Distribution Ltd.

Nilesh S. Naik

Eagle Circuits Inc.

IPC-2221 任务组(D-31b)

Lance A. Auer, Tyco Printed

Circuit Group

Stephen Bakke, C.I.D.,

Alliant Techsystems Inc.

Frank Belisle, Hamilton

Sundstrand

Mark Bentlage, IBM

Corporation

Robert J. Black, Northrop

Grumman Corporation

Gerald Leslie Bogert,

Bechtel Plant Machinery,

Inc.

John L. Bourque, C.I.D.,

Shure Inc.

Scott A. Bowles, Sovereign

Circuits Inc.

Ronald J. Brock, NSWC -

Crane

Mark Buechner

Lewis Burnett, Honeywell

Inc.

Byron Case, L-3

Communications

Ignatius Chong, Celestica

International Inc.

Christine R. Coapman,

Delphi Delco Electronics

Systems

Christopher Conklin,

Lockheed Martin

Corporation

David J. Corbett, Defense

Supply Center Columbus

Brian Crowley, Hewlett-

Packard Company

William C. Dieffenbacher,

BAE Systems Controls

Gerhard Diehl, Alcatel

SEL AG

C. Don Dupriest, Lockheed

Martin Missiles and Fire

Control

John Dusl, Lockheed Martin

Theodore Edwards, Dynaco

Corp.

Werner Engelmaier,

Engelmaier Associates,

L.C.

Gary M. Ferrari, C.I.D.+,

Ferrari Technical Services

George Franck, C.I.D.+,

Raytheon E-Systems

Mahendra S. Gandhi,

Northrop Grumman

Hue T. Green, Lockheed

Martin Space and Strategic

Missiles

Ken Greene, Siemens Energy

& Automation

Michael R. Green, Lockheed

Martin Space and Strategic

Missiles

Dr. Samy Hanna, AT&S Austria

Technologie & System

Richard P. Hartley, C.I.D.,

Hartley Enterprises

William Hazen, Raytheon

Company

Phillip E. Hinton, Hinton

‘PWB’Engineering

Michael Jouppi, Thermal

Man, Inc.

Thomas E. Kemp Rockwell

Collins

Frank N. Kimmey, C.I.D.+,

PowerWave Technologies,

Inc.

Narinder Kumar, C.I.D.,

Solectron Invotronics

Clifford H. Lamson, C.I.D.+,

Plexus Technology Group

Roger H. Landolt, Cookson

Electronics

Michael G. Luke, C.I.D.,

Raytheon Company

Wesley R. Malewicz, Siemens

Medical Systems Inc.

Kenneth Manning, Raytheon

Company

Susan S. Mansilla, Robisan

Laboratory Inc.

Rene R. Martinez, Northrop

Grumman

Brian C. McCrory, Delsen

Testing Laboratories

Randy McNutt, Northrop

Grumman

John H. Morton, C.I.D.,

Lockheed Martin

Corporation

Bob Neves, Microtek

Laboratories

2003年5月 IPC-2221A

iii

Benny Nilsson, Ericsson AB

Steven M. Nolan, C.I.D.+,

Silicon Graphics Computer

System

Randy R. Reed, Merix

Corporation

Kelly M. Schriver, Schriver

Consultants

Jeff Seekatz, Raytheon

Company

Kenneth C. Selk, Northrop

Grumman

Russell S. Shepherd,

Microtek Laboratories

Lowell Sherman, Defense

Supply Center Columbus

Akikazu Shibata, Ph.D.,

JPCA-Japan Printed

Circuit Association

Jeff Shubrooks, Raytheon

Company

Mark Snow, BAE Systems

Roger Su, L-3 Communications

Ronald E. Thompson, NSWC -

Crane

Max E. Thorson, C.I.D.,

Hewlett-Packard Company

Dung Q. Tiet, Lockheed

Martin Space and

Strategic Missiles

Dewey Whittaker,

Honeywell Inc.

David L. Wolf, Conductor

Analysis Technology, Inc.

James V. Yohe, C.I.D.,

Yohe Design Services

IPC-2221A 2003年5月

⽬录

1范围..................................... 1

1.1 目的 ................................. 1

1.2 文件层次结构 ......................... 1

1.3 单位说明 ............................. 1

1.4 表述 ................................. 1

1.5 术语定义 ............................. 1

1.6 产品分类 ............................. 1

1.6.1 板的类型 ............................. 1

1.6.2 性能等级 ............................. 1

1.6.3 可生产性水平 ......................... 2

1.7 修订变动说明 ......................... 2

2 适⽤⽂件 ................................. 2

2.1 IPC .................................. 2

2.2 联合工业标准 ......................... 3

2.3 汽车工程协会 ......................... 3

2.4 美国测试和材料协会 ................... 3

2.5 安全检测实验室 ....................... 4

2.6 IEEE ................................. 4

2.7

ANSI ................................. 4

3 通⽤要求 ................................. 4

3.1

信息层次 ............................. 4

3.1.1

优先顺序 ............................. 4

3.2

布设设计 ............................. 6

3.2.1

成品要求 ............................. 6

3.2.2

密度评估 ............................. 6

3.3

原理图/逻辑图 ........................ 6

3.4

部件表 ............................... 6

3.5

测试要求事项 ......................... 7

3.5.1

印制板组装件可测试性 ................. 7

3.5.2

边界扫描测试 ......................... 8

3.5.3

印制板组装件功能测试事项 ............. 8

3.5.4

印制板组装件在线测试事项 ............ 10

3.5.5

机械特性 ............................ 12

3.5.6

电气特性 ............................ 12

3.6

布设评价 ............................ 13

3.6.1

布设设计 ............................ 13

3.6.2

密度可行性评价 ...................... 14

3.7

性能要求 ............................ 15

4材料.................................... 17

4.1 材料选择 ............................ 17

4.1.1 按结构强度选择材料 .................. 17

4.1.2 按电气性能选择材料 .................. 17

4.1.3 按环境性能选择材料 .................. 17

4.2 介质材料(包括预浸材料和粘接剂) ...... 17

4.2.1 预浸处理的粘合层(预浸材料) .......... 17

4.2.2 粘接剂 .............................. 17

4.2.3 粘接膜或片 .......................... 19

4.2.4 导电粘接剂 .......................... 19

4.2.5 热/电绝缘粘接剂 ..................... 20

4.3 层压材料 ............................ 20

4.3.1

着色剂 .............................. 20

4.3.2

介质厚度/间距 ....................... 20

4.4

导电材料 ............................ 20

4.4.1

化学镀铜 ............................ 22

4.4.2

半导体涂层 .......................... 22

4.4.3

电镀铜 .............................. 22

4.4.4

镀金 ................................ 22

4.4.5

镀镍 ................................ 22

4.4.6

镀锡/铅 ............................. 23

4.4.7

焊料涂层 ............................ 23

4.4.8

用于板边插头的其它金属涂层 .......... 23

4.4.9

金属箔/膜 ........................... 23

4.4.10

电子元件材料 ........................ 24

4.5

有机防护涂层 ........................ 24

4.5.1

阻焊剂(阻焊膜) 涂层 ................ 24

4.5.2

敷形涂层 ............................ 25

4.5.3

防变色涂层 .......................... 26

4.6

标记和字符 .......................... 26

4.6.1

ESD事项 ............................. 27

5 机械/物理特性 ........................... 27

5.1

制作事项 ........................... 27

5.1.1

裸板制作 ............................ 27

5.2

产品/印制板构造 ..................... 27

5.2.1

印制板类型 .......................... 27

5.2.2

印制板尺寸 .......................... 27

5.2.3

印制板几何形状 (尺寸和形状) ......... 29

5.2.4

弓曲和扭曲 .......................... 29

5.2.5

结构强度 ............................ 29

5.2.6

复合(夹芯)板 ........................ 29

2003年5月 IPC-2221A