德森印刷机说明书之使用手册2.pdf - 第42页

德森精密机械设备有限公司 Shenzhen Shenzhen Shenzhen Shenzhen DeSen DeSen DeSen DeSen P re cision P re cision P re cision P re cision Machine Machine Machine Machine Co., Co., Co., Co., Ltd Ltd Ltd Ltd . . . . - 41 - 坍塌、桥连 slumping a…

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德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 40 -
2)
皮带松或皮带胶落；
The belt is loose or
the gum on belt
comes down;
3)
刮刀马达故障。
Squeegee motor
breaks down.
ing motor.
刮刀运动超出极限
Squeegee moving
exceeds the limits
1 ） 极限传感器故障。 Lim it
sensor error .
1 ）检查或更换极限传感器。 Check or
replace limit sensor.
刮刀不能上升或下降
Squeegee doesn ’ t go
up and down.
1)
气路压力可能过低；
The pressure of the air
path may be too low;
2)
气路堵塞、漏气。 The
air path is blocked or
leaks.
1)
检查刮刀气路压力是否过低；
Check the pressure of squeegee
air path to see whether it is too low
;
2)
检查刮刀气路是否有漏气、堵塞等
故障。 Check the air path of
squeegee to see whether it leaks
or is blocked etc.
印刷不完整
uncompleted printing
1)
模板孔隙堵塞或模板
与 PCB 间距太大； Th e
template void is
plugged or the
spacing between
template and PCB;
2)
范本上焊膏涂布不均；
The solder paste
coating is not even on
sample;
3)
焊膏中不规则的大金
属粉粒比例太大，堵塞
孔隙。
Too
big ratio of
irregular metal powder
particles in solders
paste and they block
the void.
1)
清洗窗孔和范本底部； Clean the
opening and the bottom of sample;
2)
选择粘度合适的焊膏并使焊膏印刷
能有效覆盖整个印刷区域； Choose
the solder paste of proper viscosity
to make the solder paste printing
to cover the whole printing area;
3)
选择金属粉末颗粒尺寸与窗口尺寸
相对应焊膏。 Choose the solder
paste whose metallic particle
matches the window size.
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 41 -
坍塌、桥连 slumping
and bridging
1)
刮刀压力太大； The
pressure of squeegee
is too big;
2)
范本底面残留焊膏太
多； There is too much
solder paste left at the
bottom of sample;
3)
焊膏粘度太低或金属
含量太少，以致无法维
持焊膏的站立。 The
viscosity and metal
content of solder
paste are too low to
keep the standing of
solder paste.
1)
调整压力； Adjust the pressure;
2)
重新固定印刷板； Re-fix the
printing board;
3)
选择合适粘度的焊膏；印刷时保持
适宜的环境温度。 Choose the
solder paste of proper viscosity;
keep an agreeable environmental
temperature on printing.
厚度不均匀 uneven
thickness
1)
范本与 PCB 未能很好
的平行吻合； The
sample fails to parallel
PCB ;
2)
PCB 焊盘镀层不平、
厚度不均； The coatin g
of PCB bonding pad
is not even or smooth;
3)
焊膏搅拌不均 （粘度 不
均） 。
The solder paste
is not mixed up (the
viscosity is not equal ).
1)
调整模板与印制板的相对位置；
adjust the relative place of template
to printing board;
2)
控制 PCB 焊盘镀层的平面度；
control the coating flatness of PCB
bonding pad;
3)
印刷前充分搅拌焊膏。 Fix well the
solder paste before printing.
边缘出现锯齿状
（分辨率不良） the rim
becomes saw-toothed
(bad resolution)
1)
焊膏粘度不足； The
viscosity of solder
paste is not big
enough;
2)
范本孔壁有毛刺、 不 光
滑； The hole wall of
model has burrs on it
and not smooth;
3)
PCB 焊盘镀层太厚或
阻焊腊边缘破损。 The
coating of PCB
1)
选择粘度略高的焊膏； Choose the
solder paste with high viscosity;
2)
制板时严格控制涂覆层厚度；
strictly control the coating
thickness over plate-making;
3)
印刷前检查漏印窗孔加工质量。
Check the machining quality of
through printing opening before
printing.
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 42 -
bonding pad is too
thick or the edge of
resistance welding
film becomes worn.
厚度不足 The thickness
is not big enough
1)
范本上焊膏涂布不均；
The solder paste
coating is not even on
model;
2)
制作范本的材料太薄；
The material for
making model is too
thin;
3)
刮刀压力不当 （太小）
；
The pressure of
squeegee is improper
(too small);
4)
PCB 焊盘镀层太厚。
The coating of PCB
bonding pad is too
thick.
1)
选择厚度合适的模板； Choose
template with proper thickness;
2)
选择颗粒度和粘度合适的锡膏；
Choose the solder paste with
proper granularity and viscosity;
3)
调整刮刀压力； Adjust the pressur e
of squeegee;
4)
减小 PCB 厚度设置。 Reduce the
thickness setting of PCB.
拉尖 Icicles
1)
范本与 PCB 间距太
大； The space
between model and
PCB is too big;
2)
焊膏粘度太大。 The
viscosity of solder
paste is too big.
1)
适当调小刮动间隙； Reduce the
scraping space a little;
2)
选择合适粘度的锡膏。 Choose tin
paste of proper viscosity
位置偏移 placement
bias
1)
设备本身的位置精度
不好； the position
accuracy of
equipment is not right;
2)
焊膏印刷时对进入网
板开口部的均匀性差；
The paste surface is
not smooth when
passed into the stencil
hole.
3)
由刮刀及其磨擦因素
1)
调整设备的重复定位精度； Adjust
the reset positioning accuracy of
equipment;
2)
选择合适粘度的焊膏； Choose the
solder paste of proper viscosity;
3)
加强对网板的印刷压力。 Reinforc e
the printing pressure on mesh
plate.