德森印刷机说明书之使用手册2.pdf - 第48页
德森精密机械设备有限公司 Shenzhen Shenzhen Shenzhen Shenzhen DeSen DeSen DeSen DeSen P re cision P re cision P re cision P re cision Machine Machine Machine Machine Co., Co., Co., Co., Ltd Ltd Ltd Ltd . . . . - 47 - Th e coating of …
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 46 -
附 2
2
2
2
：印刷缺陷及原因分析表
Appendix
Appendix
Appendix
Appendix
2:
2:
2:
2:
Table
Table
Table
Table
of
of
of
of
printing
printing
printing
printing
defects
defects
defects
defects
and
and
and
and
causes
causes
causes
causes
序号
series
No .
印 刷 缺 陷
Printing
Defects
产 生 原 因 Causes
防 止 或 解 决 办 法
Prevention and Solutions
1
印刷不完整
Printing is not
complete
1)
模板孔隙堵塞或模板与 PCB 间
距太大； template void plugged or
space between template and PCB
2)
范本上焊膏涂布不均； solder
paste is not coated even on sample
3)
焊膏中不规则的大金属粉粒比
例太大， 堵塞、 孔隙。
There is a big
ratio of irregular big metal particles
in solder paste, they block mesh
holes.
1)
清洗窗孔和范本底部；
clean the window and the bottom of
sample;
2)
选择粘度合适的焊膏，并使焊膏
印刷能有效，覆盖整个印刷区域
；
choose solder paste of proper
viscosity to ensure the printing
effects by solder paste and cover
the whole printing area;
3)
选择金属粉末颗粒尺寸与窗
口尺寸相对应的焊膏。 Choose
the solder paste whose size of metal
powder particle is corresponding to
the window.
2
坍塌、桥连
Collapse and
Bridging
1)
刮刀压力太大； too big pressur e
on squeegee;
2)
范本底面残留焊膏太多；
Too
much solder paste is left as
residual on the bottom of sample
3)
焊膏粘度太低或金属含量太少，
以致无法维持焊膏的站立。 Th e
viscosity or metal content of
solder paste is too low to maintain
the standing of solder paste.
1)
调整压力； adjust the pressure ;
2)
重新固定印制板； re-fix the
printing board;
3)
选择合适粘度的焊膏；印刷 时
保持适宜的环境温度。 Choose
the solder paste with proper
viscosity; and keep a suitable
environmental temperature on
printing.
3
厚度不均匀
Unevenness
1)
范本与 PCB 未能很好的平行 吻
合；
The model is not parallel to PC B;
2)
PCB 焊盘镀层不平、 厚度不均
；
1)
调整模板与印制板的相对位
置； adjust the relative place of
template to printing board;
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 47 -
The coating of PCB bonding pad is
not flat and not even;
3)
焊膏搅拌不均（粘度不均） 。
Solder paste is mixed well (the
viscosity is not equal).
2)
控制 PCB 焊盘镀层的平面度
；
control the flatness of the coating
of PCB bonding pad;
3)
印前充分搅拌焊膏。 Fix solder
paste well before printing.
4
边缘出现锯
齿状 （分辨 率
不良）
Saw tooth
appearing on
the rim(poor
resolution)
1)
焊膏粘度不足； The viscosity of
solder paste is not big enough;
2)
范本孔壁有毛刺、不光滑 ； The
hole wall of sample has burrs on it
and is not smooth;
3)
PCB 焊盘镀层太厚或阻焊膜边
缘破损。 The coating of PCB
bonding pad is too thick or the edge
of resistance welding film is worn
out.
1)
选择粘度较高的锡膏； choose
tin solder with high viscosity;
2)
制板时严格控制涂覆层厚度；
strictly control the thickness of
coating on board-making;
3)
印刷前检查漏印窗孔加工质
量。
Check the machining quality of
through printing opening before
printing.
5
厚度不足
Not enough
Thickness
1)
范本上焊膏涂布不均； Solderin g
paste is not coated even on sample;
2)
制作范本的材料太薄； The
material for making sample is too
thin;
3)
刮刀压力不当（太小） ； The
squeegee pressure is improper (too
small);
4)
PCB 焊盘镀层太厚。 The coatin g
of PCB bonding pad is too thick.
1)
选择厚度合适的模板； choose
the template of proper thickness;
2)
选择颗粒度和粘度合适的焊
膏； choose the solder paste of
proper granularity and viscosity;
3)
高速刮刀压力。 Increase the
squeegee pressure.
6
拉尖
Icicles
1)
范本与 PCB 间距太大； The
spacing between the model and PCB
is too big;
2)
焊膏粘度太大。 The viscosity of
solder paste is too strong.
1)
适当调小刮动间隙； reduce the
scraping space a little;
2)
选择合适粘度的焊膏。 Choose
the solder paste of proper viscosity.
德森精密机械设备有限公司
Shenzhen
Shenzhen
Shenzhen
Shenzhen
DeSen
DeSen
DeSen
DeSen
Precision
Precision
Precision
Precision
Machine
Machine
Machine
Machine
Co.,
Co.,
Co.,
Co.,
Ltd
Ltd
Ltd
Ltd
.
.
.
.
- 48 -
附 3
3
3
3
：锡膏厚度不均的原因分析
Appendix
Appendix
Appendix
Appendix
3
3
3
3
Reason
Reason
Reason
Reason
for
for
for
for
uneven
uneven
uneven
uneven
thickness
thickness
thickness
thickness
of
of
of
of
solder
solder
solder
solder
paste
paste
paste
paste
一、
一、
一、
一、
机器的硬件部分原因
Hardware
Hardware
Hardware
Hardware
Problems
Problems
Problems
Problems
1 升降平台是否干净。如果太脏会引起表面不平。如有锡膏洒在平台表面上，或其它 杂
物等。 Is the lifting platform clean or not? If
it
is too dirty, for instance, the solder
paste or other debris is left onto the surface, which will make the surface uneven
2
顶针是否布好、 布牢。 正确的方法是顶针布好后用手压在顶针的顶部用手轻摇动晃
，
要晃不动才行。 Is spring tip laid out well or fastened tight? The correct way is to
press the top of spring tip with hand and shake
it
lightly till
it
can ’
t
be moved any
more.
3
钢网与 PCB 板不平行所致。如发现不平行则要通知售后服务来校正。 Resulted fro m
the fact that gauze is not flat with PCB board. If any unparallel is found, please
inform after sales service for correction.
4
PCB 的铜箔是否氧化或不良。要客户生产在线 QC 严把质量关。 Is the copper foil o f
PCB oxidized or degraded? Customer production QC should check and inspect the
quality.
二、
二、
二、
二、
机器的参数设置部分原因
Parameter
Parameter
Parameter
Parameter
Setting
Setting
Setting
Setting
Problems
Problems
Problems
Problems
1 刮刀的压力设置。如果太小的压力，会导致 PCB 板上的锡浆量不足；太大的压力会
导致印刷得太薄。 Squeegee pressure setting. If the pressure is set too low, that will
lead to inefficient solder paste on PCB board; too high pressure will result in too thin
printing.
2
印刷的速度。 因为锡浆通过钢网到板上是需要时间的。 所以速度不合适会直接影响 下
下锡的效果。 Printing speed.
It
will take some time for resin cored solder get to
board through gauze. In that case, if the speed is not appropriate, that will influence
the effects of solder-falling.
3
钢网的张力和钢网的厚度。 钢网的张力如果太小会影响到脱模的质量。 还有钢网有 无
堵孔或清洁的不彻底。钢网的厚度为 0.12mm 时印出来的锡浆厚度为 140 士 30; 钢
网的厚度为 0.15mm 时则为 170 士 30 。如果印出来的锡膏在此范围内则为正常。
T ension and thickness of gauze. If tension of gauze is too small, that will influence
the quality of demoulding. Moreover, check gauze to see whether there are any
blocked holes and whether
it
is not cleaned thoroughly or not. When the thickness