德森印刷机说明书之使用手册2.pdf - 第6页

德森精密机械设备有限公司

Shenzhen

DeSen

Precision

Machine

Co.,

Ltd

.

- 4 -

尊敬的用户：

Dear customers,

感谢您使用德森精密机械有限公司销售的全自动视觉印刷机。德森精密机械有限公司秉

持 “ 高质的产品，合理的价位，真诚的服务，良好的信誉 ” 的理念，公司积极进取，科学管

理，始终坚持以高效的运作、世界同步的技术、国际认证的质量、精益求精的精神服务于客

户，愿与客户建立忠实的合作伙伴关系，共同发展壮大。

T hank you for using our full automatic visual printing machines. O ur company adheres

to the philosophies of “ high quality product, rational price, sincere service and good faith ”

.

W e are promising and manage scientifically; we has been serving customers with effectual

operation, internationally advanced techniques, internationally recognized quality and

perfect-pursuing spirit. W e are willing to become your royal cooperation partners for joint

development.

DSP1008 全自动视觉印刷机是本公司最新开发设计的新一代全自动印刷机，具有机器视

觉（ Machine Vision ）自动识别功能，采用高精度伺服（ Servo ）驱动系统，实现快速而准确

的对准定位，精确度可达 ± 0.01 毫米，印刷周期小于 10 秒，确保了高质量的焊膏印刷和

高的生产效率，可完美地印刷 0.3mm Pitch 超细间距焊盘。整机采用计算机控制，具有

Windows XP " 窗口 " 操作接口和丰富的软件功能，可由软件设定印刷高度，刮板压力以及

印刷行程，速度 , 网板自动清洗周期数等印刷参数，以及完善的 2D 锡膏检察和 CPK

分析，

保证印刷质量的稳定，可极大地方便用户的使用。

As the latest new generation of full automatic printing machine developed and

designed by our company, DSP1008 full automatic visual printing machine has Machine

Vision automatic identification function. A dopting a highly precise Servo driving system,

it

can achieve quick and accurate alignment and positioning with an accuracy of ± 0.01mm

and a printing cycle of shorter than 10s, hence resulting in high quality solder paste printing

and great production eff iciency and making

it

possible to produce bonding pad with an

ultra-small pitch of 0.3mm. Entirely controlled by a computer and configured with a

“ Windows XP ” operation interface and abundant software functions,

it

can have printing

parameters such as printing height, squeegee pressure, printing travel and rate, and

automatic cleaning cycles of screen set by software, additionally,

it

has perfect 2D solder

pas te inspection performance and CPK analysis performance, hence ensuring stable

德森精密机械设备有限公司

Shenzhen

DeSen

Precision

Machine

Co.,

Ltd

.

- 5 -

printing quality and offering great convenience for customers.

1.3

手册中术语和缩写

1.3

Terms

and

Abbreviation

s

in

the

User

Manual

本手册中使用以下一些术语和缩写。

Following terms and abbreviations are available in the User Manual.

1.3.1

印刷机：

1.3.1

Printing

machine:

在表面组装技术中，用于钢网印刷或漏版印刷的专用工艺设备。它是由橡胶或金属材料

制作的刮板，将印料（一般为膏状软钎焊料）通过用金属或非金属材料制作的模板精确

和适量地预先分配到印制板焊盘上，以便后续工序实现表面组装元器件的贴装。

It

is a special processing equipment referred in surface assembly techniques and

applied for screen printing or stencil printing

.

I

t

works in the following way: a squeegee

made of rubber or metallic material distributes proper quantity of the screened resist

(generally paste-shaped solder alloy) precisely on the printed board bonding pad in

advance with the help of a metallic or non-metallic material, so as to make the

subsequent surface-mounting of surface assembly components.

1.3.2

焊膏：

1.3.2

Solder

paste:

是将合金粉粒掺入含有助焊剂与抗垂流剂的载体，均匀混合而成的浆料或膏状体。它是

SMT 工艺中不可缺少的焊接材料，在常温下，焊膏具有一定的粘度，可将贴装元器件粘

在既定位置，在后续工序的焊接温度下，助焊剂和添加剂挥发，合金熔化，之后冷却，

即可将被焊元器件与电路板互联在一块形成永久连接。

I

t

is a sizing agent or pasty matter prepared by adding alloy powder into a carrier

containing scaling powder and t hixotropic a gent and mixing the mixture evenly. I

t

is a

necessary welding material in SMT process. U nder normal temperature, solder paste

has some viscosity and can stick the surface-mount components

at

the specific

positions. Upon the welding temperatures of the subsequent processes, the scaling

powder and additive volatilize and the alloy melts and cools down, thereby connecting

the welded components and circuit board permanently.

1.3.3

SMT

：

即 Surface Mount Technology 表面组装技术。无需对印刷板钻插装孔，直接将表面组装

元器件贴、焊到印制板表面规定位置上的装联技术。

德森精密机械设备有限公司

Shenzhen

DeSen

Precision

Machine

Co.,

Ltd

.

- 6 -

It

is the abbreviated form of Surface Mount T echnology which is a connecting

technology directly making the surface assembly components stick and welded

at

the

specific positions on the surface of printed board without drilling plug-in holes.

1.3.4

PCB

：

即 Printed-circuit-board 印刷（制）电路板。

I

t

is the abbreviated form of Printed-circuit-board .

1.3.5

印刷精度：

1.3.5

Printing

precision:

即实际印刷位置与目标位置吻合的精度，亦即视觉系统对图像的识别精度，是衡量印刷

机性能优劣的综合性指针。

It

is the precision the matching of target and actual printing positions. I

t

is the

identification precision of visual system for images. I

t

is a comprehensive index to

measure the performance of a printing machine.

1.3.6

重复定位精度：

1.3.6

Repeated

positioning

precision:

即印刷机多次工作位置重合精度，一般用各运动轴连续往复运动 100 次位置偏差的平均

值来表示，是印刷机各组合轴重现性的综合反映，也是衡量印刷机设计优劣的关键指标

。

I

t

refers to the precision of overlapping of several operating positions of a printing

machine. I

t

is generally expressed in the mean value of the position deviations of 100

times of continuously reciprocating movement s of each kinematic axis

.

I

t

is the

comprehensive indicator of the reproducibility of groups of combined shaft s of a

printing machine as well as a key index to measure the design quality of a printing

machine.

1.3.7

印刷周期时间：

1.3.7

Printing

cycle:

通常是指 PCB 从入口处开始进板，一直到从出口处出板的一个印刷工作周期，不包括其

中的刮刀行程时间和网板清洗时间。

G enerally speaking,

it

refers to the printing operation cycle from the PCB incoming from

the entrance to the outgoing of PCB from the exit, exclusive of the time of squeegee

travel and screen cleaning.

1.3.8

Mark

点：

1.3.8

Mark

point: