Vision_Series_EN.pdf - 第7页
7 1. Single lane transport one adjustable chain 2. Dual lane transport two adjustable chains, synchronous/ asynchronous transport speed 3. Multi-track transport three adjustable chains, synchronous/ asynchronous transpor…
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Reliable from A to B
with flexible transport systems
Your component will run through various sections of the system during the
soldering process: from the preheating zone, through the peak zone to the
cooling zone. Secure transportation is a key entity when it comes to continuous
processes. Rehm offers exible systems for this.
Our transport systems provide the perfect t for your components regardless of
the circuit board geometry. Transport lanes and speeds are variably adjustable
and enable parallel soldering processes with lead-free or leaded soldering in one
reflow system. Depending on the product requirements, you can choose from
various transport models such as individual and double track transport, quadruple
or multi-track transport.
The optional centre support enables even the processing of large circuit boards
or boards with a flexible base material with ease and prevents any sagging during
the reflow soldering, thus guaranteeing a maximum degree of process stability.
top left: dual lane transport, top right: chain oiler
bottom left: lash chain centre board support, bottom right: quad lane transport
VisionX-Series | Transport system
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1. Single lane transport
one adjustable chain
2. Dual lane transport
two adjustable chains, synchronous/
asynchronous transport speed
3. Multi-track transport
three adjustable chains, synchronous/
asynchronous transport speed
4. Quad lane transport
four adjustable chains, synchronous
transport speed and width adjustment
Transport systems
1.
2.
4.
3.
VXP+
Vac
VXP+ VXS VXC
VXP+
Vac
VXP+ VXS
VXP+ VXS
VXP+
Reliable, failure-free production guaranteed by absolutely parallel transport
Precise and repeatable adjustment of the transport width
No inuence of the temperature prole by transport or center board support
Reduced maintenance, transport drive mechanism is outside of the process chamber
Ideal for any application due to various transport systems
High process reliability by integrated center board support
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Each product has its own requirements in the
manufacturing process. Optimized heat transfer
over the entire soldering process is the basis for
best possible results.
The VisionX-Series offers flexibly controllable pre-
heating zones within which your PCB is preheated
and prepared for the actual soldering process. The
individual zones can be controlled independently
of each other via fan frequency, and assure best
possible processes.
The VisionXP+ is equipped with special nozzle
sheets for optimized heat transfer by means of
uniform air flow over the PCBs. Flow speeds in
the upper and lower heat zones can be separately
controlled, assuring that your PCB is heated up
through and through – completely and uniformly.
This prevents stressing of the material which can
disturb the soldering process. In addition, smaller
componants are not overheated and bigger ones
are still heated through enough.
To ensure that the heat flow in the system runs
stably and the outward heat radiation is as low
as possible, our VisionX systems have optimum
insulation between the process chamber and the
exterior wall.
Using precise proling we can generate preci-
sion-reproducible temperature proles which are
tailored to component size, material or process
parameters.
From zero to 240 °C
due to optimized heat transfer