Vision_Series_EN.pdf - 第9页
9 The centrepiece of our VisionX -Series is the process chamber with its outstanding heat transfer owing to adv anced hole nozzle geometry as well as monitored adjustable o verpressure in the heating module, guar - antee…
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Each product has its own requirements in the
manufacturing process. Optimized heat transfer
over the entire soldering process is the basis for
best possible results.
The VisionX-Series offers flexibly controllable pre-
heating zones within which your PCB is preheated
and prepared for the actual soldering process. The
individual zones can be controlled independently
of each other via fan frequency, and assure best
possible processes.
The VisionXP+ is equipped with special nozzle
sheets for optimized heat transfer by means of
uniform air flow over the PCBs. Flow speeds in
the upper and lower heat zones can be separately
controlled, assuring that your PCB is heated up
through and through – completely and uniformly.
This prevents stressing of the material which can
disturb the soldering process. In addition, smaller
componants are not overheated and bigger ones
are still heated through enough.
To ensure that the heat flow in the system runs
stably and the outward heat radiation is as low
as possible, our VisionX systems have optimum
insulation between the process chamber and the
exterior wall.
Using precise proling we can generate preci-
sion-reproducible temperature proles which are
tailored to component size, material or process
parameters.
From zero to 240 °C
due to optimized heat transfer
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The centrepiece of our VisionX-Series is the process chamber with its
outstanding heat transfer owing to advanced hole nozzle geometry as
well as monitored adjustable overpressure in the heating module, guar-
anteeing homogeneous and gapless heat transfer to the circuit board.
The inert process atmosphere can be assured throughout the entire
soldering process and beyond because the closed system ensures that
no external air nds its way into the process chamber. The heat flow
within the system takes place by means of circulation, i.e. the process
gas of the preheating and peak zones is extracted, cleaned and reinsert-
ed into the process at the sides.
With a linear prole, the component is not heated
in a stepped manner during soldering, in fact it
is heated along an identical linear temperature
gradient. Linear proles can reduce cycle times
and can help to reduce soldering errors such as
tombstoning.
The component is brought to a temperature
of at least 240 °C for soldering. Using a saddle
prole the board is gradually heated in line with
pre-dened, individual temperature ranges. Even
components with differing thermal masses are
heated homogeneously and temperature differ-
ences minimised.
Saddle prole
Linear prole
Convection
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Separately adjustable heating zones
Reproducible temperature prole
Outstanding process stability with the smallest possible ΔT
Homogenous heat input over the entire PCB thanks to specially designed nozzles
Low maintenance effort
Homogenous heat transfer
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VisionX-Series | Heat transfer
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A clean machine:
effective Residue Management
As is the case with all industrial processes,
substances are generated during SMT produc-
tion which have to be removed from the process
cycle because they contaminate the system. Our
highly effective residue management function
puries the process gas safely and reliably, and
keeps your system clean and dry.
The residue management function included in the
VisionX-Series combines depending on the sys-
tem type two different modes of action: pyrolysis
in the heat zone and cold condensation in the
cooling tract’s lter units. Liquid and crystalline
residues are effectively removed by means of this
combination.
VisonXP+ and Vision XP+ Vac are equipped with
pyrolysis and lter units in the cooling zone as
standard. Pyrolysis can optionally be added to
VisionXS models for the purposes of cold trap-
ping. VisionXC systems are tted with cooler lter
units in their cooling zone.
In order to make your manufacturing system
even more efcient, the VisionXP+ is optionally
available with double pyrolysis. Your system’s
cleaning efciency is signicantly increased. The
rst pyrolysis unit is located underneath the inlet
area. It puries the nitrogen from the heating
zones. The second pyrolysis unit is installed on
top of the inlet area and lters the process gas
from the heating zones. Cleaning efciency is
signicantly increased for the process gas and
the soldering system’s chambers are kept clean
and dry with very little maintenance and minimal
downtime.