Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow.pdf - 第15页

Figure 26 Figure 27: OSP surface finish.

Figure 24

Figure 25

Figure 26

Figure 27: OSP surface finish.

Void Reduction in Bottom Terminated Components

Using Vacuum Assisted Reflow

M. Holtzer[2], M. Barnes[1], D.W. Lee[1], D. Heller[1], T. Cucu[2], J.

Fudala[3], J. Renda[3],

[1] Heller Industries

[2] Alpha Assembly Solutions

[3] MacDermid Enthone Electronic Solutions