Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow.pdf - 第20页
Ov en Used f or R eflo w Eight He at Z one Convec tion Oven with V acuum Cham ber in be twee n Hea t and Cooling Zones
, BGA 256s, and LGA 228s
MLF-100
DPAK TO-252
MLF-52
BGA 256
BGA 228
5 Components/Board
Oven Used for Reflow
Eight Heat Zone Convection Oven with Vacuum
Chamber in between Heat and Cooling Zones
Close Up of Vacuum Chamber