Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow.pdf - 第19页
, BGA 256s , an d L GA 2 28s MLF- 10 0 D PA K T O - 252 MLF- 52 BGA 256 BGA 228 5 Compo nents/Boar d
• Single lot of in house voiding test vehicle was used.
• 6 Were finished with an OSP, 6 With Immersion Silver, 6 with
Immersion Tin, 6 with ENIG within a day or two of each other.
•
Paste applied using a 100 µ thick uncoated SS stencil
, BGA 256s, and LGA 228s
MLF-100
DPAK TO-252
MLF-52
BGA 256
BGA 228
5 Components/Board
Oven Used for Reflow
Eight Heat Zone Convection Oven with Vacuum
Chamber in between Heat and Cooling Zones